CY62187G30-55BAXI
Active and preferred
RoHS Compliant
Lead-free

CY62187G30-55BAXI

ea.
in stock

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CY62187G30-55BAXI
CY62187G30-55BAXI
ea.

Product details

  • Alarms
    N
  • Density
    64 MBit
  • Family
    MoBL™ SRAM
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 85 °C
  • Operating Voltage range
    2.2 V to 3.6 V
  • Operating Voltage (VCCQ) max
    3.6 V
  • Organization (X x Y)
    4Mb x 16
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2033
  • Qualification
    Industrial
  • Real Time Clock
    N
  • Speed
    55 ns
  • Watchdog Timer
    N
OPN
CY62187G30-55BAXI
Product Status active and preferred
Infineon Package
Package Name FBGA-48 (001-50044)
Packing Size 210
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name FBGA-48 (001-50044)
Packing Size 210
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
CY62187G30-55BAXI is a 64-Mbit (4M × 16) MoBL SRAM with embedded ECC for single-bit error correction and an ERR pin for error indication. It operates from 2.2 V to 3.6 V over -40 to 85°C and provides 55 ns access. Standby current is 6 µA typical (38 µA max) with automatic power-down, and it supports 1.0 V data retention. The device uses TTL-compatible I/O and comes in a Pb-free 48-ball VFBGA with dual chip enable.

Features

  • 64-Mbit SRAM (4M × 16)
  • Embedded ECC, 1-bit correction
  • ERR pin flags 1-bit error events
  • 2.2 V to 3.6 V VCC operation
  • 55 ns read/write cycle time
  • OE to data valid: 25 ns
  • Standby current 6 µA typ, 38 µA max
  • Automatic power-down via CE/BHE/BLE
  • Byte writes via BLE/BHE enables
  • High-Z outputs when deselected
  • 1.0 V data retention mode
  • TTL-compatible inputs and outputs

Benefits

  • Fits 16-bit memory bus systems
  • ECC improves data integrity
  • ERR simplifies fault monitoring
  • Works with 2.2–3.6 V rails
  • 55 ns supports fast SRAM access
  • 25 ns OE speeds read response
  • µA standby extends battery life
  • Auto power-down cuts idle power
  • Byte writes reduce write bandwidth
  • High-Z eases bus sharing
  • 1.0 V retention saves backup power
  • TTL I/O eases logic interfacing

Applications

Documents

Design resources

Developer community