SG-FWLP-40-4

Package details

  • Package Material
    SG
  • Package Family
    SG-FWLP
  • Terminals
    40
  • Variant
    4
  • Exposed Paddle
    No
  • Body Length (mm)
    1.2
  • Body Width (mm)
    1.32
  • Min. Terminal Pitch ()
    0.0
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    6000
    1
    178
Infineon chip size wafer level packages (WLP) are offered as different variants. They are chip-size package with a fan-in redistribution layer. The pre-soldered ball-shaped terminations allow for high-throughput board mounting using surface mount technology (SMT). The silicon body requires special care when handling boards with mounted components. Typical products are switches, and more.

Image Gallery

SG-FWLP-40-4_Tape and Reel
SG-FWLP-40-4_Tape and Reel
SG-FWLP-40-4_Tape and Reel SG-FWLP-40-4_Tape and Reel SG-FWLP-40-4_Tape and Reel
SG-FWLP-40-4_Footprint Drawing SG-FWLP-40-4_Footprint Drawing SG-FWLP-40-4_Footprint Drawing
SG-FWLP-40-4_Package Outline SG-FWLP-40-4_Package Outline SG-FWLP-40-4_Package Outline

Documents and drawings