Revolutionary CoolMOS™ superjunction MOSFET technologies require innovative package solutions to enable tomorrow's trends
Low power applications are typically sold into the price sensitive consumer world where customers are closely looking into bill of material (BOM) cost savings. To allow savings, Infineon offers special package features that avoid additional assembly treatments on the customer's side as well as smaller packages, enabled by our outstanding CoolMOS™ superjunction technology.
High power applications are very performance oriented. To further improve efficiency and thermal behavior, even by considering smaller form factors, Infineon introduced packages with Kelvin Source functionality and with DDPAK, the first top side cooled SMD package. Combine the benefits of the high voltage technologies 600V CoolMOS™ G7 superjunction (SJ) MOSFET and CoolSiC™ Schottky diode 650V G6 with the innovative concept of top-side cooling in DDPAK.