IM73A135 | High performance XENSIV™ MEMS microphone with ultra high dynamic range

Overview

Infineon’s XENSIV™ MEMS analog microphone IM73A135 sets a new performance benchmark in MEMS microphones. A best-in-class signal to noise ratio (SNR) of 73 dB and a high acoustic overload point of 135 dBSPL enable clear audio pick up of the quietest and the loudest sounds. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The IM73A135 allows designers to reach a level of high audio performance that was previously only achievable by ECMs while at the same time reaping the benefits inherent in MEMS technology.

Summary of Features

Ultra-low self-noise / ultra-high SNR (73 dB)
Selectable power modes for battery critical applications (170/70 µA)
Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
Ultra high dynamic range and very high acoustic overload point (AOP) of 135 dBSPL
Very tight part-to-part phase and sensitivity matching (± 1 dB)
Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz
Ultra-low group delay (2µs @ 1kHz)

Benefits

Crystal clear audio pick up of the quietest and the loudest sounds
High ingress protection (IP57) at a microphone level
Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

Potential Applications