Active and preferred
RoHS Compliant

IPB339N20NM6

OptiMOS™ 6 power MOSFET 200 V normal level in D2PAK package
Data Sheet
package
ea.
in stock

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IPB339N20NM6
IPB339N20NM6
ea.
Data Sheet

Product details

  • Budgetary Price €/1k
    1.32
  • ID (@25°C) max
    39 A
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    D2PAK (TO-263)
  • Polarity
    N
  • QG (typ @10V)
    15.9 nC
  • RDS (on) (@10V) max
    33.9 mΩ
  • VDS max
    200 V
  • VGS(th)
    3.7 V
Recommended
OPN
IPB339N20NM6ATMA1
Product Status active and preferred
Infineon Package
PG-TO263-3
Package Name D2PAK
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TO263-3
Package Name D2PAK
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
IPB339N20NM6 OptiMOS™ 6 200 V is setting the new technology standard. It addresses the need for high power density, high efficiency, and high reliability. The OptiMOS™ 6 200 V technology was designed for optimal performance in motor drive applications such as LEV, forklifts, and drones. The new OptiMOS™ 6 features industry leading RDS(on), improved switching and current sharing capability, enabling high power density, less paralleling, and excellent EMI performance. The improved switching behavior makes the OptiMOS™ 6 200 V family an ideal choice for any type of switching applications such as telecom, server, solar, or audio. Additionally, the combination of wide SOA and industry-leading RDS(on) result in a perfect fit for static switching applications such as BMS.

Features

  • 42 % lower RDS(on)
  • 89% lower Qrr(typ)
  • More than 3 times softer diode
  • Improved capacitance linearity
  • Improved SOA
  • Pb-free plating and RoHS compliant

Benefits

  • Low conduction losses
  • Low switching losses
  • Stable operation with improved EMI
  • Less paralleling required
  • Better current sharing when paralleling
  • Environmentally friendly

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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