SG-FWLP-9-1

Package details

  • Package Material
    SG
  • Package Family
    SG-FWLP
  • Terminals
    9
  • Variant
    1
  • Exposed Paddle
    No
  • Body Length (mm)
    0.86
  • Body Width (mm)
    0.71
  • Min. Terminal Pitch ()
    0.0
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    7000
    1
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    20000
    1
Infineon chip size wafer level packages (WLP) are offered as different variants. They are chip-size package with a fan-in redistribution layer. The pre-soldered ball-shaped terminations allow for high-throughput board mounting using surface mount technology (SMT). The silicon body requires special care when handling boards with mounted components. Typical products are switches, and more.

Image Gallery

SG-FWLP-9-1_Footprint Drawing
SG-FWLP-9-1_Footprint Drawing
SG-FWLP-9-1_Footprint Drawing SG-FWLP-9-1_Footprint Drawing SG-FWLP-9-1_Footprint Drawing
SG-FWLP-9-1_Package Outline SG-FWLP-9-1_Package Outline SG-FWLP-9-1_Package Outline
SG-FWLP-9-1_Tape and Reel_01 SG-FWLP-9-1_Tape and Reel_01 SG-FWLP-9-1_Tape and Reel_01

Documents and drawings