GaNPX (R)

PG-ULGA-3-982

Package details

  • Package Material
    PG
  • Package Family
    PG-ULGA
  • Terminals
    3
  • Variant
    982
  • Exposed Paddle
    No
  • Body Length (mm)
    5.01
  • Body Width (mm)
    6.56
  • Min. Terminal Pitch (mm)
    2.88
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    3000
    1
    330
Infineon land grid array packages (LGA) are offered as various families. They are available as thin (T) and ultra thin (U) versions. Fine-pitch variants (F) are specifically designated. The LGA concept utilizes an overmolded laminate substrate to connect on the bottom of the package rather than around its perimeter. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Typical products are memories, gate driver ICs, GaN transistors, integrated power stages, switches, and tuners.

Image Gallery

PG-ULGA-3-982_Package Outline
PG-ULGA-3-982_Package Outline
PG-ULGA-3-982_Package Outline PG-ULGA-3-982_Package Outline PG-ULGA-3-982_Package Outline
PG-ULGA-3-982_Footprint Drawing PG-ULGA-3-982_Footprint Drawing PG-ULGA-3-982_Footprint Drawing

Documents and drawings