PG-MQFP-80-13

Package details

  • Package Material
    PG
  • Package Family
    PG-MQFP
  • Terminals
    80
  • Variant
    13
  • Exposed Paddle
    No
  • Body Length (mm)
    14.0
  • Body Width (mm)
    14.0
  • Min. Terminal Pitch (mm)
    0.65
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    850
    1
    330
  • TRAY
    Pieces/Reel
    Reels/Box
     
    504
    6
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

PG-MQFP-80-13_Footprint Drawing
PG-MQFP-80-13_Footprint Drawing
PG-MQFP-80-13_Footprint Drawing PG-MQFP-80-13_Footprint Drawing PG-MQFP-80-13_Footprint Drawing
PG-MQFP-80-13_Package Outline PG-MQFP-80-13_Package Outline PG-MQFP-80-13_Package Outline
PG-MQFP-80-13_Tape and Reel_01 PG-MQFP-80-13_Tape and Reel_01 PG-MQFP-80-13_Tape and Reel_01

Documents and drawings