PG-MQFP-64-10

Package details

  • Package Material
    PG
  • Package Family
    PG-MQFP
  • Terminals
    64
  • Variant
    10
  • Exposed Paddle
    Yes
  • Body Length (mm)
    14.0
  • Body Width (mm)
    14.0
  • Min. Terminal Pitch (mm)
    0.65
  • TAPE & REEL
    Pieces/Box
    Tubes/Box
    Reel diameter (mm)
     
    600
    1
    330
  • TRAY
    Pieces/Box
    Tubes/Box
     
    504
    6
  • TRAY
    Pieces/Box
    Tubes/Box
     
    84
    1
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

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Image of the packing type Tape & Reel - PG-MQFP-64-10
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PG-MQFP-64-10_Footprint Drawing PG-MQFP-64-10_Footprint Drawing PG-MQFP-64-10_Footprint Drawing
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PG-MQFP-BKT PG-MQFP-BKT PG-MQFP-BKT

Documents and drawings