PG-LQFP-64-31

Package details

  • Package Material
    PG
  • Package Family
    PG-LQFP
  • Terminals
    64
  • Variant
    31
  • Exposed Paddle
    Yes
  • Body Length (mm)
    10.0
  • Body Width (mm)
    10.0
  • Min. Terminal Pitch (mm)
    0.5
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    1900
    1
    330
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

PG-LQFP-64-31_Package Outline
PG-LQFP-64-31_Package Outline
PG-LQFP-64-31_Package Outline PG-LQFP-64-31_Package Outline PG-LQFP-64-31_Package Outline
PG-LQFP-64-31_Footprint Drawing PG-LQFP-64-31_Footprint Drawing PG-LQFP-64-31_Footprint Drawing

Documents and drawings