PG-IQFN-40-1

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Package details

  • Package Material
    PG
  • Package Family
    PG-IQFN
  • Terminals
    40
  • Variant
    1
  • Exposed Paddle
    Yes
  • Body Length (mm)
    6.0
  • Body Width (mm)
    6.0
  • Min. Terminal Pitch (mm)
    0.5
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    4000
    1
    330
Infineon integrated device packages without leads are offered as various families. They are available as integrated quad flat no-lead (IQFN), integrated Small-Outline Non-leaded (SON) and integrated tri-side flat no-lead (ITFN) versions. Thickness variations of thin (T), very thin (V) and very very thin (W) are available. Alternative designations for the power devices may include power quad flat no-lead (PQFN) package. The plastic packages carry dies of usually different functionality forming a system in package (SiP). Versions with double-side cooling (DSC) are available depending on the product. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). The footprints feature low to no symmetries which calls for extra consideration during the board pad design. Typical products are integrated voltage regulators, audio amplifier IC, power stages, intelligent power modules, transistors, and also current sensors.

Image Gallery

FPD PG-IQFN-40-1
FPD PG-IQFN-40-1
FPD PG-IQFN-40-1 FPD PG-IQFN-40-1 FPD PG-IQFN-40-1
SPO PG-IQFN-40-1 SPO PG-IQFN-40-1 SPO PG-IQFN-40-1
TNR PG-IQFN-40-1 TNR PG-IQFN-40-1 TNR PG-IQFN-40-1
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Documents and drawings

Documents and drawings