EconoPACK™ 2 & 3

Our high performance and flexible solution that fulfills high power density needs

EconoPACK™ 4

Rugged mechanical design with ultrasonic welded and injection-molded screw terminals

EconoPIM™ 2 & 3

Our integrated solution tailored for general purpose inverters

eupec ™ EconoBRIDGE™

Our versatile rectifier stage dedicated to work with EconoPACK™ 2 & 3

EconoPACK™ 2 & 3 with shunts

Cost reduction by consistent accuracy of current measurement

EconoPACK™ +

Increasing the efficiency while gaining the lifetime and durability

EconoDUAL™ 3

First choice for highest reliability and lifetime in demanding applications

Econo IGBT Modules

Power Simulation IPOSIM

PressFIT Technology

3:00

Customers of power electronics require ever more modern, easy connection technologies, which also provide a higher reliability to meet the trends to higher temperatures and new applications.

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities.

Thermal Interface Material

3:03

A thermal interface material, especially developed for and pre-applied to Infineon`s power modules outperforms the general purpose materials available.

IGBT Module Finder