AIROC™ Bluetooth® LE
Most reliable and highest performing connectivity
The AIROC™ Bluetooth® Low Energy portfolio offers solutions to deliver the most reliable and highest performing connectivity for your applications. AIROC™ Bluetooth® Low Energy portfolio consists of Bluetooth® LE System-on-Chip (SoC) devices and System-in-Package (SiP) modules. The AIROC™ Bluetooth® Low Energy devices enable compute at the edge capability for a variety of IoT applications. These highly integrated SoC devices also allows interfacing with external components along with Reliable, long-range Bluetooth® Connectivity.
Bluetooth® SIG -compliant modules are fully integrated, fully certified, programmable modules designed to help you build your products faster and easier.
Infineon's Bluetooth® LE SoCs and modules are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications.
The Bluetooth® LE System-on-Chip (SoC) devices are designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT applications.