DirectFET™

OptiMOS™ and StrongIRFET™ power MOSFETs in DirectFET™ package for higher efficiency

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Overview

Infineon's DirectFET™ technology facilitates dual-sided cooling of surface-mounted power MOSFET devices. This doubles power and current densities, which in turn reduces the component count and system cost. These benefits result from the presence of solderable contacts on the surface of the silicon die for connecting the gate and source to the printed circuit board (PCB). A copper clip attached to the back of the die provides the drain connection.

Key Features

  • Exceptional power density
  • High efficiency
  • Low parasitic inductance
  • Minimized EMI
  • Double-side cooling
  • Optimized thermals
  • Low profile design
  • Board space reduction
  • High current capability
  • Less device paralleling

Products

About

DirectFET™ Introduction

DirectFET™ is a surface-mount semiconductor technology designed primarily for board-mounted power applications. It eliminates unnecessary elements of packaging that contribute to higher inductance and resistance, both thermal and electrical, so that its power capabilities exceed those of comparably sized packages.

The growing DirectFET™ package family includes various can sizes and device outlines which you will find in the product table.

DirectFET™ Applications

Together with the latest MOSFET silicon technology, DirectFET™ products are the right choice for a wide range of applications where thermal behavior, energy efficiency, and power density are in focus such as solar micro inverters, synchronous rectification, VRM modules for servers, DC-DC converters, OR-ing switches and circuit breakers, desktop PCs, workstations, and mainframes.

DirectFET™ Package Construction

DirectFET™ has a uniquely simple construction that provides breakthroughs in die-free package resistance, parasitic package inductance, and heat dissipation capabilities. Compared to standard discrete packages, DirectFET™ metal "can" construction enables double-sided cooling to effectively increase the efficiency and current-carrying capability of the device in a given footprint. DirectFET™ is compatible with today's high-volume manufacturing processes.

DirectFET™ Introduction

DirectFET™ is a surface-mount semiconductor technology designed primarily for board-mounted power applications. It eliminates unnecessary elements of packaging that contribute to higher inductance and resistance, both thermal and electrical, so that its power capabilities exceed those of comparably sized packages.

The growing DirectFET™ package family includes various can sizes and device outlines which you will find in the product table.

DirectFET™ Applications

Together with the latest MOSFET silicon technology, DirectFET™ products are the right choice for a wide range of applications where thermal behavior, energy efficiency, and power density are in focus such as solar micro inverters, synchronous rectification, VRM modules for servers, DC-DC converters, OR-ing switches and circuit breakers, desktop PCs, workstations, and mainframes.

DirectFET™ Package Construction

DirectFET™ has a uniquely simple construction that provides breakthroughs in die-free package resistance, parasitic package inductance, and heat dissipation capabilities. Compared to standard discrete packages, DirectFET™ metal "can" construction enables double-sided cooling to effectively increase the efficiency and current-carrying capability of the device in a given footprint. DirectFET™ is compatible with today's high-volume manufacturing processes.

Documents

Documents

Design resources

Developer community

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