Active and preferred
RoHS Compliant
Lead-free

S28HL512TFPBHI013

Data Sheet
package

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S28HL512TFPBHI013
S28HL512TFPBHI013
Data Sheet

Product details

  • Density
    512 MBit
  • Family
    HL-T
  • Interface Bandwidth
    333 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 166
  • Interfaces
    Octal
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2037
  • Qualification
    Industrial
Recommended
OPN
S28HL512TFPBHI013
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-15550)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-15550)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The S28HL512TFPBHI013 is a 512 Mb SEMPER™ NOR flash memory using Infineon's 45-nm MIRRORBIT™ technology. It features octal interface (JEDEC JESD251), up to 400 MBps DDR read rates at 200 MHz, and operates at 2.7 V to 3.6 V in a 24-ball BGA. The device meets AEC-Q100 Grade 1 for automotive and industrial use up to 125°C. Key features include ISO26262 ASIL B compliance, Endurance Flex, ECC, CRC, sector protection, AutoBoot, and hardware reset.

Features

  • 45-nm MIRRORBIT™ stores 2 bits/cell
  • Uniform and hybrid sector architectures
  • 256/512-byte page programming buffer
  • 1024-byte OTP secure silicon array
  • Octal interface, JEDEC JESD251 compliant
  • SDR up to 200 MBps, DDR up to 400 MBps
  • Data strobe (DS) for high-speed read
  • Functional safety ISO26262 ASIL B/D ready
  • Endurance Flex wear leveling architecture
  • Interface and data integrity CRC
  • Built-in ECC: corrects 1-bit, detects 2-bit
  • Legacy and advanced sector protection

Benefits

  • High density with 2 bits/cell saves board
  • Flexible sectoring for varied application
  • Large buffer boosts programming efficiency
  • OTP array enables secure key storage
  • Octal interface delivers fast data transfer
  • High-speed SDR/DDR supports demanding systems
  • DS simplifies high-speed system design
  • Functional safety for automotive/industrial
  • Wear leveling extends flash lifetime
  • CRC ensures reliable data transfer
  • ECC enhances data reliability and safety
  • Multi-level protection guards data and config

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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