Active and preferred
RoHS Compliant
Lead-free

AIMZH120R060M1T

Automotive 1200V Silicon-carbide (SiC) Trench Power MOSFET in TO247-4L (thin leads), 60mΩ
Data Sheet
package
ea.
in stock

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AIMZH120R060M1T
AIMZH120R060M1T
ea.
Data Sheet

Product details

  • ID (@25°C) max
    38 A
  • Launch year
    2023
  • Operating Temperature
    -55 °C to 175 °C
  • Currently planned availability until at least
    2033
  • Polarity
    N
  • Qualification
    Automotive
  • RDS (on) (@ Tj = 25°C)
    60 mΩ
  • Technology
    CoolSiC™ G1
  • VDS max
    1200 V
Recommended
OPN
AIMZH120R060M1TXKSA1
Product Status active and preferred
Infineon Package
PG-TO247-4
Package Name TO247 4-pin
Packing Size 240
Packing Type TUBE
Moisture Level NA
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TO247-4
Package Name TO247 4-pin
Packing Size 240
Packing Type TUBE
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
With Infineon’s performance optimized chip technology (Gen1p), the SiC Mosfet features best-in-class switching performance, robustness against parasitic turn-ons, as well as improved RDSon and Rth(j-c). High power density, superior efficiency, bi-directional charging capabilities and significant reductions in system costs making it an ideal choice for on-board charger and DCDC applications.

Features

  • Very low switching losses
  • Increased turn-on voltage VGS(on)= 20 V
  • Best in class switching energy
  • Lowest device capacitances
  • low Crss/Ciss ratio and high VGS(th) to avoid parasitic turn-on
  • Reduced total gate charge QGtot for lower driving power and losses
  • .XT die attach technology for best in class thermal performance
  • Sense pin for optimized switching performance
  • Suitable for HV creepage requirements
  • Thinner leads for reduced risk of solder bridges

Benefits

  • Efficiency improvement
  • Enabling higher frequency
  • Increased power density
  • Cooling effort reduction
  • Reduction of system complexity and cost

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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