TFLGA-13 (002-31929)

PG-TFLGA-13-4

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Package details

  • Package Material
    PG
  • Package Family
    PG-TFLGA
  • Terminals
    13
  • Variant
    4
  • Exposed Paddle
    No
  • Body Length (mm)
    5.0
  • Body Width (mm)
    5.0
  • Min. Terminal Pitch (mm)
    0.65
Infineon land grid array packages (LGA) are offered as various families. They are available as thin (T) and ultra thin (U) versions. Fine-pitch variants (F) are specifically designated. The LGA concept utilizes an overmolded laminate substrate to connect on the bottom of the package rather than around its perimeter. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Typical products are memories, gate driver ICs, GaN transistors, integrated power stages, switches, and tuners.

Image Gallery

PG-TFLGA-13-4_Footprint Drawing
PG-TFLGA-13-4_Footprint Drawing
PG-TFLGA-13-4_Footprint Drawing PG-TFLGA-13-4_Footprint Drawing PG-TFLGA-13-4_Footprint Drawing
PG-TFLGA-13-4_Tape and Reel_01 PG-TFLGA-13-4_Tape and Reel_01 PG-TFLGA-13-4_Tape and Reel_01
PG-TFLGA-13-4_Package Outline PG-TFLGA-13-4_Package Outline PG-TFLGA-13-4_Package Outline
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Documents and drawings

Documents and drawings