PG-MQFP-100-2

Package details

  • Package Material
    PG
  • Package Family
    PG-MQFP
  • Terminals
    100
  • Variant
    2
  • Exposed Paddle
    No
  • Body Length (mm)
    20.0
  • Body Width (mm)
    14.0
  • Min. Terminal Pitch (mm)
    0.65
  • TRAY
    Pieces/Box
    Tubes/Box
     
    198
    3
  • TAPE & REEL
    Pieces/Box
    Tubes/Box
    Reel diameter (mm)
     
    500
    1
    330
  • TRAY
    Pieces/Box
    Tubes/Box
     
    660
    10
  • TRAY
    Pieces/Box
    Tubes/Box
     
    396
    6
  • TRAY
    Pieces/Box
    Tubes/Box
     
    66
    1
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

PG-MQFP-100-2_Package Outline
PG-MQFP-100-2_Package Outline
PG-MQFP-100-2_Package Outline PG-MQFP-100-2_Package Outline PG-MQFP-100-2_Package Outline
PG-MQFP-100-2_Footprint Drawing PG-MQFP-100-2_Footprint Drawing PG-MQFP-100-2_Footprint Drawing
PG-MQFP-BKT PG-MQFP-BKT PG-MQFP-BKT
cpmg5718.gif cpmg5718.gif cpmg5718.gif

Documents and drawings