PG-DIP-8-11

Package details

  • Package Material
    PG
  • Package Family
    PG-DIP
  • Terminals
    8
  • Variant
    11
  • Exposed Paddle
    No
  • Body Length (mm)
    9.2
  • Body Width (mm)
    6.35
  • Min. Terminal Pitch (mm)
    2.54
  • TUBE
    Pieces/Reel
    Reels/Box
     
    2000
    40
Infineon single (SIP) and dual inline packages (DIP) are offered as various families. The straight lead termination design allows for high robustness board mounting using through-hole technology (THT). The leads of THD are inserted in drilled holes of the board prior to soldering. During pre-mount processing special care must be taken e.g. during lead bending. Typical products are power ICs, power MOSFET, memories, intelligent power modules (IPM), photovoltaic relays and isolators, lighting ICs, and more.

Image Gallery

P/PG-DIP-8-9-GIF
P/PG-DIP-8-9-GIF
P/PG-DIP-8-9-GIF P/PG-DIP-8-9-GIF P/PG-DIP-8-9-GIF
DIP89POG DIP89POG DIP89POG

Documents and drawings