SOP 29x12

PG-DIP-23-2

Package details

  • Package Material
    PG
  • Package Family
    PG-DIP
  • Terminals
    23
  • Variant
    2
  • Exposed Paddle
    No
  • Body Length (mm)
    29.0
  • Body Width (mm)
    12.0
  • Min. Terminal Pitch (mm)
    1.27
Infineon single (SIP) and dual inline packages (DIP) are offered as various families. The straight lead termination design allows for high robustness board mounting using through-hole technology (THT). The leads of THD are inserted in drilled holes of the board prior to soldering. During pre-mount processing special care must be taken e.g. during lead bending. Typical products are power ICs, power MOSFET, memories, intelligent power modules (IPM), photovoltaic relays and isolators, lighting ICs, and more.

Image Gallery

PG-DIP-23-2_Package Outline
PG-DIP-23-2_Package Outline
PG-DIP-23-2_Package Outline PG-DIP-23-2_Package Outline PG-DIP-23-2_Package Outline
PG-DIP-23-2_Tape and Reel_01 PG-DIP-23-2_Tape and Reel_01 PG-DIP-23-2_Tape and Reel_01
PG-DIP-23-2_Footprint Drawing PG-DIP-23-2_Footprint Drawing PG-DIP-23-2_Footprint Drawing

Documents and drawings