TQFP-100 (51-85048)

P-TQFP-100-804

Package details

  • Package Material
    P
  • Package Family
    P-TQFP
  • Terminals
    100
  • Variant
    804
  • Exposed Paddle
    No
  • Body Length (mm)
    13.995
  • Body Width (mm)
    13.995
  • Min. Terminal Pitch (mm)
    0.5
  • TRAY
    Pieces/Box
    Tubes/Box
     
    900
    10
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

P-TQFP-100-804_Package Outline
Image of the package outline - P-TQFP-100-804
P-TQFP-100-804_Package Outline P-TQFP-100-804_Package Outline P-TQFP-100-804_Package Outline
P-TQFP-100-804_Tape and Reel P-TQFP-100-804_Tape and Reel P-TQFP-100-804_Tape and Reel
P-TQFP-100-804_Footprint Drawing P-TQFP-100-804_Footprint Drawing P-TQFP-100-804_Footprint Drawing

Documents and drawings