Active and preferred
RoHS Compliant

REF_11KW_PFC_SIC_QD

3L-ANPC bi-directional, top-side cooled converter for high efficiency (99.15% peak) and power density (>11kW/L) compatible with 3-ph and 1-ph grids
Application Notes

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REF_11KW_PFC_SIC_QD
REF_11KW_PFC_SIC_QD
Application Notes

Product details

  • Board Type
    Reference Board
  • Configuration
    2EDB9259Y, BAT165, BSS138N, IMDQ65R020M2H, IMDQ75R025M2H, IPDQ60R016CM8, 2EDN7533R, ICE2QR2280G, CYBT-423054-02, XMC4400-F100K512ABXUM A1, TLF80511EJ V33, TLS4120D0EP V33
  • Description
    11 kW high-efficiency high-density bidirectional three-/single-phase AC-DC PFC/inverter
  • Dimensions
    40x99x243 mm
  • Family
    Silicon Carbide
  • Input Type
    AC
  • Output Current max
    13.75 A
  • Pout max
    11000 W
  • Sub Application
    Power Supplies
  • Supply Voltage
    180 V to 265 V
  • Target Application
    Charging EV Charging Energy Storage Industrial power
  • Topology
    PFC
Recommended
OPN
REF11KWPFCSICQDTOBO1
Product Status active and preferred
Infineon Package --
Package Name N/A
Packing Size 1
Packing Type CONTAINER
Moisture Level N/A
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package --
Package Name -
Packing Size 1
Packing Type CONTAINER
Moisture Level -
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
This reference board represents a newly developed multilevel active-neutral-point-clamped (ANPC) bi-directional converter for multiple applications with both 3-phase and 1-phase AC and 800 V DC and power ratings of 11 kW and 7.3 kW. This board works with high efficiency and high power density enabled by Infineon's newest 750 V CoolSiC™ and 600 V CoolMOS™ in Q-DPAK package.

Features

  • Three-phase design (3L-ANPC)
  • Multi-level power conversion
  • High performance (efficiency and power density)
  • Bi-directional capability
  • Full digital control
  • 600 V/750 V Si/SiC MOSFETs in Q-DPAK-TSC

Benefits

  • Addressing a wide range of applications
  • Multiple cooling possibilities
  • Compact form factor

Applications

Bill of Material

Documents

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