Plastic Green (PG) Ball Grid Array Package (BGA)

Ball Grid Array (BGA) packages with a multilayer glass woven epoxy substrate. The terminations consist of lead-free solder balls that allow for Surface Mount Technology (SMT) assembly. Our square plastic green (PG) ball grid array packages (BGA) are also available as a Low-profile Fine-pitch BGA (LFBGA) variant with smaller body size and lower I/O counts.