Infineon Dresden participates in research, development and innovation projects within future-oriented technology and product fields for topics such as future mobility, energy supply, data security and artificial intelligence. We work together with regional, national and international partners in research collaborations.
The research and development projects are funded by the European Union through the European Regional Development Fund (EU/EFRE) and the Chips Joint Undertaking, the Federal Ministry of Research, Technology and Space (BMFTR), the Federal Ministry of Economic Affairs and Energy (BMWE) and the Free State of Saxony.
Projectstart: 1 July 2023
Sponsors: European Regional Development Fund (ERDEF), Free State of Saxony
Joint project with ten partners from Saxony
Project description: Population growth, urbanization and globalization as well as the associated environmental impact are leading to an increased need for decarbonization and digitalization solutions. In the joint project “Green mobility ‘made in Saxony’ – Innovative solutions for future-oriented automotive and industrial applications (Future Mobility)”, Infineon Dresden is working with ten partners along the entire value chain for microelectronics to develop innovative solutions for new types of power products and systems.
Within this framework, development platforms as well as new methods and processes for more efficient product design and development are addressed, which are suitable for various product and application families. This is accompanied by the corresponding technology development and process innovations. Concepts for transferring the developed products and technologies to high-volume production are also being researched. The project results will form the basis for future-oriented products that improve people's quality of life and contribute to achieving climate targets.
The joint project is coordinated by Infineon Technologies Dresden AG & Co. KG. The other partners are Fabmatics, Systema, LEC, Chemnitz University of Technology, Dresden University of Technology, Dresden University of Applied Sciences, Westsächsische Hochschule Zwickau, Helmholtz-Zentrum Dresden-Rossendorf, Fraunhofer Institute for Photonic Microsystems and Fraunhofer Institute for Material and Beam Technology.
Projectstart: 1. September 2025
Sponsors: European regional development fund (ERDEF), Free State of Saxony
Joint project with nine partners from Saxony
Project description: Semiconductor products play a central role in a variety of modern electronic applications, such as the Internet of Things (IoT), mobility, and industry. The continuously increasing demand for a broad technology portfolio of reliable and efficient semiconductors leads to increasing complexity in the processes of the microelectronics industry. To address this challenge, the SuperComp collaborative project explores innovative solutions to improve the design, development, and manufacturing of complex semiconductor system solutions using advanced methods based on artificial intelligence (AI) and state-of-the-art procedures from the field of neuromorphic and quantum-based computing. Furthermore, in the two specific fields of application - technology development for complex system solutions and cloud-based, digital manufacturing and logistics - innovations from the field of semiconductor product and system development as well as AI-supported technologies in manufacturing are being developed.
The joint project is coordinated by Infineon Technologies Dresden AG & Co. KG. The other partners include SpiNNcloud systems GmbH, Saxony Media Solutions GmbH, PVA Vision GmbH, Wandelbots GmbH, SYSTEMA Systementwicklung Dipl.-Inf. Manfred Austen GmbH, Dresden University of Technology, Dresden University of Applied Sciences, Zittau/Görlitz University of Applied Sciences, and the Fraunhofer Institute for Electronic Nanosystems.
Project start: 1 Juni 2023
Sponsors: European Regional Development Fund (ERDEF), Free State of Saxony
Joint project with three partners from Saxony
Project description: Advancing digitalization and the concept of Industry 4.0 increasingly require manually controllable systems to be replaced by automatically controlled or remote-controlled systems. A switch realized by a power semiconductor and controlled by networked electronics would be of great advantage here. Increased automation also requires suitable power transistors for drives such as robots or other production machines. The aim of the LeistungsSchaltEr research project is to overcome the technological barriers to the future use of power transistors as relay or fuse replacements. Today's transistors are not suitable for this purpose. In the research project, a combination of new materials with breakthrough-resistant technologies should significantly improve the performance of systems. At the same time, costs can be reduced by using a new manufacturing process.
Infineon Dresden is coordinating the joint project with the participation of evico, NaMLab and Siltectra.
Project start: 15 October 2023
Sponsors: European Regional Development Fund (ERDEF), Free State of Saxony
Joint project with two partners from Saxony
Project description: In a variety of fields of application, such as medical diagnostics, environmental analysis or energy technology, the need for new sensor and data acquisition system solutions to combine different data sources is increasing against the backdrop of digital transformation. Under the consortium leadership of Infineon Dresden, the partners Advanced Data Processing GmbH and the Technische Universität Bergakademie Freiberg are developing innovative, highly compact sensor solutions. The aim is to test the possibility of integrating hardware and software sensor concepts on a chip, as well as the use of artificial intelligence methods. By developing concepts for more powerful and more cost-effective sensors, innovations in existing fields of application are to be made possible on the one hand and new fields of application opened up on the other.
Project start: 1 August 2023
Sponsors: European Regional Development Fund (ERDEF), Free State of Saxony
Joint project with nine partners from Saxony
Project description: As part of HybridEcho, a new hybrid ultrasound procedure that fundamentally changes the state of the art is investigated. Overall, the targeted innovations offer the potential to drastically increase image quality, enabling novel medical applications such as transcranial ultrasound of cerebral hemorrhages or efficient tumor screening of the smallest lesions. The research partners are the Else Kröner-Fresenius Center for Digital Health at Dresden University of Technology, the Institute for Communications Engineering at Dresden University of Technology, the Fraunhofer Institute for Photonic Microsystems, the Fraunhofer Institute for Ceramic Technologies and the companies Heteromerge, Exelonix, SITEC Industrietechnologie and WOLFRAM Designer und Ingenieure.
Project start: 1 December 2023
Sponsors: European Regional Development Fund (ERDF), Free State of Saxony
Joint Project with four Partners from Saxony
Project description: A technology platform for fully integrated, compact system-in-package solutions is therefore to be researched as part of the KoVoPack joint project. In order to achieve this goal, the partners will investigate and develop innovative methods for integrating new types of materials and manufacturing concepts. The partners are Fraunhofer Institute for Electronic Nano Systems (ENAS), Infineon Technologies Dresden AG & Co. KG, VON ARDENNE GmbH, SAW components Dresden GmbH, TU Chemnitz - Center for Microtechnologies.
Project start: 10 June 2022
Sponsors: European Union, Federal Ministry for Economic Affairs and Energy on the basis of a resolution of the German Bundestag and the Saxon State Ministry for Economic Affairs, Labour and Transport
Project description: IPCEI ME/CT is a strategic EU initiative that aims to fund research projects along the entire value chain of microelectronics and communication technology and thus accelerate the digitalization and green transformation of Europe. The strategic promotion of innovation and cooperation also strengthens the European labor market as well as the supply chain resilience and security of supply of European industry. Infineon's power semiconductors are used in a wide range of industries, from mobility to energy supply and communication technology, and are therefore a critical aspect of the objectives pursued.
Project start: 1 May 2023
Sponsor: Chips Joint Undertaking, Federal Ministry of Research, Technology and Space
Joint project with 52 partners from 12 European countries
Coordinator: Infineon Technologies AG
Project start: 1 June 2025
Sponsor: Chips Joint UndertakingFederal Ministry of Research, Technology and Space
Joint project with 62 partners from 15 European countries
Coordinator: Infineon Technologies AG
Project start: 1 July 2025
Sponsor: Chips Joint Undertaking, Federal Ministry of Research, Technology and Space
Joint project with 62 partners from 16 European countries
Coordinator: Infineon Technologies AG
Project start: 1 June 2024
Sponsor: FET
Joint Project with 23 partners from 9 European countries
Coordinator: CEA
Project start: 1 July 2023
Sponsor: BMWE
Joint project with nine German partners
Coordinator: Infineon Technologies AG
- PowerizeD – Digitalization of Power Electronic Applications within Key Technology Value Chains
- Listen2Future – Acoustic sensor solutions integrated with digital technologies as key enablers for emerging applications fostering Society 5.0
- QUASAR – Semiconductor quantum processor with shuttling-based scalable architecture
- RadarSkin – Intelligent robust 300 GHz radar edge sensor network
- MANNHEIM-CeCaS – Central Car Server-Supercomputing für Automotive
- QLSI – Quantum Large Scale Integration in Silicon
- KI-ASIC – AI processor architectures for radar modules in autonomous vehicles
- iRel40 – Intelligent Reliability 4.0
- Power2Power – The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade
- ArrowheadTools – Arrowhead Tools for Engineering of Digitalisation Solutions
- ESAIRQ – Sensor technologies for measuring air quality
- NeePoS – New embedded power systems
- intense2020 – Intelligent energy supply and sensor technology for the automotive electronics of the future
- EFFSIL300 – Efficient and safe power transistors based on 300mm wafers
- iDev40 – Integrated Development 4.0
- TARANTO – TowARds Advanced bicmos NanoTechnology platforms for rf to thz applicatiOns
- IPCEI – The BMWi supported the development and establishment of a production facility up to the first commercial use of innovative sensor technology for radar applications
- Autodrive – Advancing fail-aware, fail-safe, and fail-operational electronic components, systems, and architectures for highly and fully automated driving to make future mobility safer, more efficient, affordable, and end-user acceptable
- Productive40 – Electronics and ICT as enabler for digital industry and optimized supply chain management covering the entire product lifecycle
- PowerSystem – Higher power density through system solutions with efficient power MOSFETs
- SERENUS – Systematic testing and research of novel substructure and sensor concepts
- 5G-SWITCH – Novel solutions for RF-MOS devices
- EFFIZIENT – Highly efficient power transistors for electric drives
- IMAGINE – Novel 3D sensor technology for consumer goods based on the time-of-flight concept
- VINEUS – Exploration of methods for the integration of new sensors and MEMS elements
- FIFLA – FIN-FET Power semiconductors for automotive applications
- HAP2014 – Autonomous factory automation, cluster research on mobile robot systems of a new generation
- STOCKHOLM – Special wafer technology for power semiconductor systems
- SMALL300 – Superjunction MOS-Transistors for Adapter, Lighting ans Low-Power switching power supply in 300mm
- SMOLAN300 – Superjunction MOS-Transistors for easy applicability in 300mm
- PRESTO – Principles of Processing for silicon-based terahertz technologies
The research and development projects are funded by the European Union through the European Regional Development Fund (ERDF) and the Chips Joint Undertaking, the Federal Ministry of Research, Technology and Space (BMFTR), the Federal Ministry of Economic Affairs and Energy (BMWE) and the Free State of Saxony.
Semiconductors are essential for mastering the energy-related challenges of our time and and help shape the digital transformation. Infineon Dresden is a leading location for research and development and plays a central role in the company's global innovation strategy.
As a leading global provider of semiconductor solutions for power systems and IoT, Infineon enables pioneering solutions for green and efficient energy, clean and safe mobility as well as a smart and secure IoT.
Our focus in Dresden is on four central fields of innovation: Automation & Digitalization, Technology, Products & Software, and Artificial Intelligence.
Our multicultural teams unite talents from all over the world. Creative collaboration, interdisciplinary learning and an open corporate culture are essential components of our success. For us, diversity is a driving force for innovation and enables us to design forward-looking solutions for digitalization and decarbonization. Thanks to a strong international team culture and an attractive working environment, Infineon Dresden offers a dynamic environment to grow and create.
- Automation and digital transformation of semiconductor development and production
- Development of cutting-edge discrete and integrated technologies with a focus on power semiconductors and ICs
- Products and software for automotive, industrial and energy applications
- Artificial intelligence and embedded AI solutions
- Interdisciplinary teams and global cooperation for pioneering innovations
- Strong partnerships with universities, institutes and research facilities
- Excellent access to talents in Silicon Saxony
- A highly attractive working environment with flexible working conditions, especially for young families and women
The Meinholdstraße location expands our Dresden site with a new space for chip design, as well as system and software development. Together with the Königsbrücker Straße site, this creates an interconnected hub for innovation, collaboration, and future growth.
Our fields of innovation
We are pioneers in the automation of semiconductor production; our 200mm factory is the most highly automated in the world. Our solutions enable further digital transformation:
- Smart manufacturing
Data-based process optimization for sustainable production
- Automated decision-making
Fast and consistent decisions supported by data and AI
We develop energy-saving and efficient technologies for the products of tomorrow:
- Sustainable power semiconductors and IC technologies
Efficient materials and manufacturing processes for the future
- Lab characterization and technology innovations
Our chips and systems provide powerful and energy-efficient solutions for future markets:
- Automotive and Power Electronics
Products and software for electromobility, charging infrastructure and energy efficiency
- Embedded Systems and Firmware
Software for networked and secure embedded platforms
We use AI to create new, improved product features and new possibilities in the development and manufacture of products:
- Hardware and Software development
Machine learning for high-performance semiconductors
- Embedded solutions
AI-based optimization for industrial processes, smart manufacturing and autonomous driving
We are pioneers in the automation of semiconductor production; our 200mm factory is the most highly automated in the world. Our solutions enable further digital transformation:
- Smart manufacturing
Data-based process optimization for sustainable production
- Automated decision-making
Fast and consistent decisions supported by data and AI
We develop energy-saving and efficient technologies for the products of tomorrow:
- Sustainable power semiconductors and IC technologies
Efficient materials and manufacturing processes for the future
- Lab characterization and technology innovations
Our chips and systems provide powerful and energy-efficient solutions for future markets:
- Automotive and Power Electronics
Products and software for electromobility, charging infrastructure and energy efficiency
- Embedded Systems and Firmware
Software for networked and secure embedded platforms
We use AI to create new, improved product features and new possibilities in the development and manufacture of products:
- Hardware and Software development
Machine learning for high-performance semiconductors
- Embedded solutions
AI-based optimization for industrial processes, smart manufacturing and autonomous driving
Infineon Dresden participates in research, development and innovation projects within future-oriented technology and product fields for topics such as future mobility, energy supply, data security and artificial intelligence. We work together with regional, national and international partners in research collaborations.
The research and development projects are funded by the European Union through the European Regional Development Fund (EU/EFRE) and the Chips Joint Undertaking, the Federal Ministry of Research, Technology and Space (BMFTR), the Federal Ministry of Economic Affairs and Energy (BMWE) and the Free State of Saxony.
Projectstart: 1 July 2023
Sponsors: European Regional Development Fund (ERDEF), Free State of Saxony
Joint project with ten partners from Saxony
Project description: Population growth, urbanization and globalization as well as the associated environmental impact are leading to an increased need for decarbonization and digitalization solutions. In the joint project “Green mobility ‘made in Saxony’ – Innovative solutions for future-oriented automotive and industrial applications (Future Mobility)”, Infineon Dresden is working with ten partners along the entire value chain for microelectronics to develop innovative solutions for new types of power products and systems.
Within this framework, development platforms as well as new methods and processes for more efficient product design and development are addressed, which are suitable for various product and application families. This is accompanied by the corresponding technology development and process innovations. Concepts for transferring the developed products and technologies to high-volume production are also being researched. The project results will form the basis for future-oriented products that improve people's quality of life and contribute to achieving climate targets.
The joint project is coordinated by Infineon Technologies Dresden AG & Co. KG. The other partners are Fabmatics, Systema, LEC, Chemnitz University of Technology, Dresden University of Technology, Dresden University of Applied Sciences, Westsächsische Hochschule Zwickau, Helmholtz-Zentrum Dresden-Rossendorf, Fraunhofer Institute for Photonic Microsystems and Fraunhofer Institute for Material and Beam Technology.
Projectstart: 1. September 2025
Sponsors: European regional development fund (ERDEF), Free State of Saxony
Joint project with nine partners from Saxony
Project description: Semiconductor products play a central role in a variety of modern electronic applications, such as the Internet of Things (IoT), mobility, and industry. The continuously increasing demand for a broad technology portfolio of reliable and efficient semiconductors leads to increasing complexity in the processes of the microelectronics industry. To address this challenge, the SuperComp collaborative project explores innovative solutions to improve the design, development, and manufacturing of complex semiconductor system solutions using advanced methods based on artificial intelligence (AI) and state-of-the-art procedures from the field of neuromorphic and quantum-based computing. Furthermore, in the two specific fields of application - technology development for complex system solutions and cloud-based, digital manufacturing and logistics - innovations from the field of semiconductor product and system development as well as AI-supported technologies in manufacturing are being developed.
The joint project is coordinated by Infineon Technologies Dresden AG & Co. KG. The other partners include SpiNNcloud systems GmbH, Saxony Media Solutions GmbH, PVA Vision GmbH, Wandelbots GmbH, SYSTEMA Systementwicklung Dipl.-Inf. Manfred Austen GmbH, Dresden University of Technology, Dresden University of Applied Sciences, Zittau/Görlitz University of Applied Sciences, and the Fraunhofer Institute for Electronic Nanosystems.
Project start: 1 Juni 2023
Sponsors: European Regional Development Fund (ERDEF), Free State of Saxony
Joint project with three partners from Saxony
Project description: Advancing digitalization and the concept of Industry 4.0 increasingly require manually controllable systems to be replaced by automatically controlled or remote-controlled systems. A switch realized by a power semiconductor and controlled by networked electronics would be of great advantage here. Increased automation also requires suitable power transistors for drives such as robots or other production machines. The aim of the LeistungsSchaltEr research project is to overcome the technological barriers to the future use of power transistors as relay or fuse replacements. Today's transistors are not suitable for this purpose. In the research project, a combination of new materials with breakthrough-resistant technologies should significantly improve the performance of systems. At the same time, costs can be reduced by using a new manufacturing process.
Infineon Dresden is coordinating the joint project with the participation of evico, NaMLab and Siltectra.
Project start: 15 October 2023
Sponsors: European Regional Development Fund (ERDEF), Free State of Saxony
Joint project with two partners from Saxony
Project description: In a variety of fields of application, such as medical diagnostics, environmental analysis or energy technology, the need for new sensor and data acquisition system solutions to combine different data sources is increasing against the backdrop of digital transformation. Under the consortium leadership of Infineon Dresden, the partners Advanced Data Processing GmbH and the Technische Universität Bergakademie Freiberg are developing innovative, highly compact sensor solutions. The aim is to test the possibility of integrating hardware and software sensor concepts on a chip, as well as the use of artificial intelligence methods. By developing concepts for more powerful and more cost-effective sensors, innovations in existing fields of application are to be made possible on the one hand and new fields of application opened up on the other.
Project start: 1 August 2023
Sponsors: European Regional Development Fund (ERDEF), Free State of Saxony
Joint project with nine partners from Saxony
Project description: As part of HybridEcho, a new hybrid ultrasound procedure that fundamentally changes the state of the art is investigated. Overall, the targeted innovations offer the potential to drastically increase image quality, enabling novel medical applications such as transcranial ultrasound of cerebral hemorrhages or efficient tumor screening of the smallest lesions. The research partners are the Else Kröner-Fresenius Center for Digital Health at Dresden University of Technology, the Institute for Communications Engineering at Dresden University of Technology, the Fraunhofer Institute for Photonic Microsystems, the Fraunhofer Institute for Ceramic Technologies and the companies Heteromerge, Exelonix, SITEC Industrietechnologie and WOLFRAM Designer und Ingenieure.
Project start: 1 December 2023
Sponsors: European Regional Development Fund (ERDF), Free State of Saxony
Joint Project with four Partners from Saxony
Project description: A technology platform for fully integrated, compact system-in-package solutions is therefore to be researched as part of the KoVoPack joint project. In order to achieve this goal, the partners will investigate and develop innovative methods for integrating new types of materials and manufacturing concepts. The partners are Fraunhofer Institute for Electronic Nano Systems (ENAS), Infineon Technologies Dresden AG & Co. KG, VON ARDENNE GmbH, SAW components Dresden GmbH, TU Chemnitz - Center for Microtechnologies.
Project start: 10 June 2022
Sponsors: European Union, Federal Ministry for Economic Affairs and Energy on the basis of a resolution of the German Bundestag and the Saxon State Ministry for Economic Affairs, Labour and Transport
Project description: IPCEI ME/CT is a strategic EU initiative that aims to fund research projects along the entire value chain of microelectronics and communication technology and thus accelerate the digitalization and green transformation of Europe. The strategic promotion of innovation and cooperation also strengthens the European labor market as well as the supply chain resilience and security of supply of European industry. Infineon's power semiconductors are used in a wide range of industries, from mobility to energy supply and communication technology, and are therefore a critical aspect of the objectives pursued.
Project start: 1 May 2023
Sponsor: Chips Joint Undertaking, Federal Ministry of Research, Technology and Space
Joint project with 52 partners from 12 European countries
Coordinator: Infineon Technologies AG
Project start: 1 June 2025
Sponsor: Chips Joint UndertakingFederal Ministry of Research, Technology and Space
Joint project with 62 partners from 15 European countries
Coordinator: Infineon Technologies AG
Project start: 1 July 2025
Sponsor: Chips Joint Undertaking, Federal Ministry of Research, Technology and Space
Joint project with 62 partners from 16 European countries
Coordinator: Infineon Technologies AG
Project start: 1 June 2024
Sponsor: FET
Joint Project with 23 partners from 9 European countries
Coordinator: CEA
Project start: 1 July 2023
Sponsor: BMWE
Joint project with nine German partners
Coordinator: Infineon Technologies AG
- PowerizeD – Digitalization of Power Electronic Applications within Key Technology Value Chains
- Listen2Future – Acoustic sensor solutions integrated with digital technologies as key enablers for emerging applications fostering Society 5.0
- QUASAR – Semiconductor quantum processor with shuttling-based scalable architecture
- RadarSkin – Intelligent robust 300 GHz radar edge sensor network
- MANNHEIM-CeCaS – Central Car Server-Supercomputing für Automotive
- QLSI – Quantum Large Scale Integration in Silicon
- KI-ASIC – AI processor architectures for radar modules in autonomous vehicles
- iRel40 – Intelligent Reliability 4.0
- Power2Power – The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade
- ArrowheadTools – Arrowhead Tools for Engineering of Digitalisation Solutions
- ESAIRQ – Sensor technologies for measuring air quality
- NeePoS – New embedded power systems
- intense2020 – Intelligent energy supply and sensor technology for the automotive electronics of the future
- EFFSIL300 – Efficient and safe power transistors based on 300mm wafers
- iDev40 – Integrated Development 4.0
- TARANTO – TowARds Advanced bicmos NanoTechnology platforms for rf to thz applicatiOns
- IPCEI – The BMWi supported the development and establishment of a production facility up to the first commercial use of innovative sensor technology for radar applications
- Autodrive – Advancing fail-aware, fail-safe, and fail-operational electronic components, systems, and architectures for highly and fully automated driving to make future mobility safer, more efficient, affordable, and end-user acceptable
- Productive40 – Electronics and ICT as enabler for digital industry and optimized supply chain management covering the entire product lifecycle
- PowerSystem – Higher power density through system solutions with efficient power MOSFETs
- SERENUS – Systematic testing and research of novel substructure and sensor concepts
- 5G-SWITCH – Novel solutions for RF-MOS devices
- EFFIZIENT – Highly efficient power transistors for electric drives
- IMAGINE – Novel 3D sensor technology for consumer goods based on the time-of-flight concept
- VINEUS – Exploration of methods for the integration of new sensors and MEMS elements
- FIFLA – FIN-FET Power semiconductors for automotive applications
- HAP2014 – Autonomous factory automation, cluster research on mobile robot systems of a new generation
- STOCKHOLM – Special wafer technology for power semiconductor systems
- SMALL300 – Superjunction MOS-Transistors for Adapter, Lighting ans Low-Power switching power supply in 300mm
- SMOLAN300 – Superjunction MOS-Transistors for easy applicability in 300mm
- PRESTO – Principles of Processing for silicon-based terahertz technologies
The research and development projects are funded by the European Union through the European Regional Development Fund (ERDF) and the Chips Joint Undertaking, the Federal Ministry of Research, Technology and Space (BMFTR), the Federal Ministry of Economic Affairs and Energy (BMWE) and the Free State of Saxony.
Semiconductors are essential for mastering the energy-related challenges of our time and and help shape the digital transformation. Infineon Dresden is a leading location for research and development and plays a central role in the company's global innovation strategy.
As a leading global provider of semiconductor solutions for power systems and IoT, Infineon enables pioneering solutions for green and efficient energy, clean and safe mobility as well as a smart and secure IoT.
Our focus in Dresden is on four central fields of innovation: Automation & Digitalization, Technology, Products & Software, and Artificial Intelligence.
Our multicultural teams unite talents from all over the world. Creative collaboration, interdisciplinary learning and an open corporate culture are essential components of our success. For us, diversity is a driving force for innovation and enables us to design forward-looking solutions for digitalization and decarbonization. Thanks to a strong international team culture and an attractive working environment, Infineon Dresden offers a dynamic environment to grow and create.
- Automation and digital transformation of semiconductor development and production
- Development of cutting-edge discrete and integrated technologies with a focus on power semiconductors and ICs
- Products and software for automotive, industrial and energy applications
- Artificial intelligence and embedded AI solutions
- Interdisciplinary teams and global cooperation for pioneering innovations
- Strong partnerships with universities, institutes and research facilities
- Excellent access to talents in Silicon Saxony
- A highly attractive working environment with flexible working conditions, especially for young families and women
The Meinholdstraße location expands our Dresden site with a new space for chip design, as well as system and software development. Together with the Königsbrücker Straße site, this creates an interconnected hub for innovation, collaboration, and future growth.
Our fields of innovation
We are pioneers in the automation of semiconductor production; our 200mm factory is the most highly automated in the world. Our solutions enable further digital transformation:
- Smart manufacturing
Data-based process optimization for sustainable production
- Automated decision-making
Fast and consistent decisions supported by data and AI
We develop energy-saving and efficient technologies for the products of tomorrow:
- Sustainable power semiconductors and IC technologies
Efficient materials and manufacturing processes for the future
- Lab characterization and technology innovations
Our chips and systems provide powerful and energy-efficient solutions for future markets:
- Automotive and Power Electronics
Products and software for electromobility, charging infrastructure and energy efficiency
- Embedded Systems and Firmware
Software for networked and secure embedded platforms
We use AI to create new, improved product features and new possibilities in the development and manufacture of products:
- Hardware and Software development
Machine learning for high-performance semiconductors
- Embedded solutions
AI-based optimization for industrial processes, smart manufacturing and autonomous driving
We are pioneers in the automation of semiconductor production; our 200mm factory is the most highly automated in the world. Our solutions enable further digital transformation:
- Smart manufacturing
Data-based process optimization for sustainable production
- Automated decision-making
Fast and consistent decisions supported by data and AI
We develop energy-saving and efficient technologies for the products of tomorrow:
- Sustainable power semiconductors and IC technologies
Efficient materials and manufacturing processes for the future
- Lab characterization and technology innovations
Our chips and systems provide powerful and energy-efficient solutions for future markets:
- Automotive and Power Electronics
Products and software for electromobility, charging infrastructure and energy efficiency
- Embedded Systems and Firmware
Software for networked and secure embedded platforms
We use AI to create new, improved product features and new possibilities in the development and manufacture of products:
- Hardware and Software development
Machine learning for high-performance semiconductors
- Embedded solutions
AI-based optimization for industrial processes, smart manufacturing and autonomous driving