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- Automotive Ethernet Bridges
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- 32-bit FM Arm® Cortex® Microcontroller
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- 32-bit PSOC™ Arm® Cortex® microcontroller
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- 32-bit XMC™ industrial microcontroller Arm® Cortex®-M
- Legacy microcontroller
- MOTIX™ MCU | 32-bit motor control SoC based on Arm® Cortex®-M
- Sensing controllers
- Overview
- AC-DC power conversion
- Automotive conventional powertrain ICs
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- Diodes and thyristors (Si/SiC)
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- Power MOSFETs
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- Overview
- Antenna cross switches
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- Bias and control
- Coupler
- Driver amplifiers
- High Reliability Discrete
- Low noise amplifiers (LNAs)
- RF diode
- RF switches
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- Overview
- Calypso® products
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- Contactless memories
- OPTIGA™ embedded security solutions
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- Security controllers
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- Overview
- ToF 3D image sensors
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- MEMS microphones
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- Magnetic speed sensors
- Overview
- Bipolar transistors
- Diodes
- Small signal/small power MOSFET
- Overview
- Automotive transceivers
- Control communication
- Powerline communications
- Overview
- USB 2.0 peripheral controllers
- USB 3.2 peripheral controllers
- USB hub controllers
- USB PD high-voltage microcontrollers
- USB-C AC-DC and DC-DC charging solutions
- USB-C charging port controllers
- USB-C Power Delivery controllers
- Overview
- AIROC™ Automotive wireless
- AIROC™ Bluetooth® and multiprotocol
- AIROC™ connected MCU
- AIROC™ Wi-Fi + Bluetooth® combos
- Overview
- Commercial off-the-shelf (COTs) memory portfolio
- Defense memory portfolio
- High-reliability power conversion and management
- Overview
- Rad hard microwave and RF
- Radiation hardened power
- Space memory portfolio
- Overview
- Parallel NOR flash
- SEMPER™ NOR flash family
- SEMPER™ X1 LPDDR flash
- Serial NOR flash
- Overview
- FM0+ 32-bit Arm® Cortex®-M0+ microcontroller (MCU) families
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FM3 32-bit Arm® Cortex®-M3 microcontroller (MCU) families
- Overview
- FM3 CY9AFx1xK series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFx1xL/M/N series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFx2xK/L series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFx3xK/L series ultra-low leak Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFx4xL/M/N series low power Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFx5xM/N/R series low power Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9AFxAxL/M/N series ultra-low leak Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9BFx1xN/R high-performance series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9BFx1xS/T high-performance series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9BFx2xJ series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9BFx2xK/L/M series Arm® Cortex®-M3 microcontroller (MCU)
- FM3 CY9BFx2xS/T series Arm® Cortex®-M3 microcontroller (MCU)
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FM4 32-bit Arm® Cortex®-M4 microcontroller (MCU) families
- Overview
- FM4 CY9BFx6xK/L high-performance series Arm® Cortex®-M4F microcontroller (MCU)
- FM4 CY9BFx6xM/N/R high-performance series Arm® Cortex®-M4F microcontroller (MCU)
- FM4 S6E2C high-performance series Arm® Cortex®-M4F microcontroller (MCU)
- FM4 S6E2G series connectivity Arm® Cortex®-M4F microcontroller (MCU)
- FM4 S6E2H high-performance series Arm® Cortex®-M4F microcontroller (MCU)
- Overview
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32-bit TriCore™ AURIX™ – TC2x
- Overview
- AURIX™ family – TC21xL
- AURIX™ family – TC21xSC (wireless charging)
- AURIX™ family – TC22xL
- AURIX™ family – TC23xL
- AURIX™ family – TC23xLA (ADAS)
- AURIX™ family – TC23xLX
- AURIX™ family – TC264DA (ADAS)
- AURIX™ family – TC26xD
- AURIX™ family – TC27xT
- AURIX™ family – TC297TA (ADAS)
- AURIX™ family – TC29xT
- AURIX™ family – TC29xTT (ADAS)
- AURIX™ family – TC29xTX
- AURIX™ TC2x emulation devices
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32-bit TriCore™ AURIX™ – TC3x
- Overview
- AURIX™ family - TC32xLP
- AURIX™ family – TC33xDA
- AURIX™ family - TC33xLP
- AURIX™ family – TC35xTA (ADAS)
- AURIX™ family – TC36xDP
- AURIX™ family – TC37xTP
- AURIX™ family – TC37xTX
- AURIX™ family – TC38xQP
- AURIX™ family – TC39xXA (ADAS)
- AURIX™ family – TC39xXX
- AURIX™ family – TC3Ex
- AURIX™ TC37xTE (emulation devices)
- AURIX™ TC39xXE (emulation devices)
- 32-bit TriCore™ AURIX™ – TC4x
- Overview
- PSOC™ 4 Arm® Cortex®-M0/M0+
- PSOC™ 4 HV Arm® Cortex®-M0+
- PSOC™ 5 LP Arm® Cortex®-M3
- PSOC™ 6 Arm® Cortex®-M4/M0+
- PSOC™ Multitouch Arm® Cortex®-M0
- PSOC™ Control Arm® Cortex®-M33
- PSOC™ Fingerprint Arm® Cortex®-M0+
- PSOC™ Automotive 4: Arm® Cortex®-M0/M0+
- PSOC™ Edge Arm® Cortex® M55/M33
- Overview
- 32-bit TRAVEO™ T2G Arm® Cortex® for body
- 32-bit TRAVEO™ T2G Arm® Cortex® for cluster
- Overview
- 32-bit XMC1000 industrial microcontroller Arm® Cortex®-M0
- 32-bit XMC4000 industrial microcontroller Arm® Cortex®-M4
- XMC5000 Industrial Microcontroller Arm® Cortex®-M4F
- 32-bit XMC7000 Industrial Microcontroller Arm® Cortex®-M7
- Overview
- Legacy 32-bit MCU
- Legacy 8-bit/16-bit microcontroller
- Other legacy MCUs
- Overview
- AC-DC integrated power stage - CoolSET™
- AC-DC PWM-PFC controller
- Overview
- Bridge rectifiers & AC switches
- CoolSiC™ Schottky diodes
- Diode bare dies
- Silicon diodes
- Thyristor / Diode Power Modules
- Thyristor soft starter modules
- Thyristor/diode discs
- Overview
- Automotive gate driver ICs
- Isolated Gate Driver ICs
- Level-Shift Gate Driver ICs
- Low-Side Drivers
- Transformer Driver ICs
- Overview
- AC-DC LED driver ICs
- Ballast IC
- DC-DC LED driver IC
- LED dimming interface IC
- Linear LED driver IC
- LITIX™ - Automotive LED Driver IC
- NFC wireless configuration IC with PWM output
- VCSEL driver
- Overview
- 32-bit PSOC™ Control Arm® Cortex®-M33 MCU
- iMOTION™ Integrated motor control solutions
- MOTIX™ MCU | 32-bit motor control SoC based on Arm® Cortex®-M
- MOTIX™ motor control ICs for BLDC motors
- MOTIX™ motor control ICs for brushed DC motors
- MOTIX™ multi half-bridge ICs for servo and stepper motors
- Overview
- Automotive MOSFET
- Dual MOSFETs
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- N-channel depletion mode MOSFET
- N-channel power MOSFETs
- Silicon carbide CoolSiC™ MOSFETs
- Small signal/small power MOSFET
- Overview
- Automotive transceivers
- Linear Voltage Regulators for Automotive Applications
- OPTIREG™ PMIC
- OPTIREG™ switcher
- OPTIREG™ System Basis Chips (SBC)
- Overview
- eFuse
-
High-side switches
- Overview
- Classic PROFET™ 12V | Automotive smart high-side switch
- Classic PROFET™ 24V | Automotive smart high-side switch
- Power PROFET™ + 12/24/48V | Automotive smart high-side switch
- PROFET™ + 12V | Automotive smart high-side switch
- PROFET™ + 24V | Automotive smart high-side switch
- PROFET™ + 48V | Automotive smart high-side switch
- PROFET™ +2 12V | Automotive smart high-side switch
- PROFET™ Industrial | Smart high-side switch
- PROFET™ Load Guard 12V | Automotive smart high-side switch
- PROFET™ Wire Guard 12V | Automotive eFuse
- Low-side switches
- Multichannel SPI Switches & Controller
- Overview
- Radar sensors for automotive
- Radar sensors for IoT
- Overview
- EZ-USB™ CX3 MIPI CSI2 to USB 3.0 camera controller
- EZ-USB™ FX10 & FX5N USB 10Gbps peripheral controller
- EZ-USB™ FX20 USB 20 Gbps peripheral controller
- EZ-USB™ FX3 USB 5 Gbps peripheral controller
- EZ-USB™ FX3S USB 5 Gbps peripheral controller with storage interface
- EZ-USB™ FX5 USB 5 Gbps peripheral controller
- EZ-USB™ SD3 USB 5 Gbps storage controller
- EZ-USB™ SX3 FIFO to USB 5 Gbps peripheral controller
- Overview
- EZ-PD™ CCG3 USB type-C port controller PD
- EZ-PD™ CCG3PA USB-C and PD
- EZ-PD™ CCG3PA-NFET USB-C PD controller
- EZ-PD™ CCG7x consumer USB-C Power Delivery & DC-DC controller
- EZ-PD™ PAG1: power adapter generation 1
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- EZ-PD™ PAG2-PD USB-C PD Controller
- Overview
- EZ-PD™ ACG1F one-port USB-C controller
- EZ-PD™ CCG2 USB Type-C port controller
- EZ-PD™ CCG3PA Automotive USB-C and Power Delivery controller
- EZ-PD™ CCG4 two-port USB-C and PD
- EZ-PD™ CCG5 dual-port and CCG5C single-port USB-C PD controllers
- EZ-PD™ CCG6 one-port USB-C & PD controller
- EZ-PD™ CCG6_CFP and EZ-PD™ CCG8_CFP Dual-Single-Port USB-C PD
- EZ-PD™ CCG6DF dual-port and CCG6SF single-port USB-C PD controllers
- EZ-PD™ CCG7D Automotive dual-port USB-C PD + DC-DC controller
- EZ-PD™ CCG7S Automotive single-port USB-C PD solution with a DC-DC controller
- EZ-PD™ CCG7SAF Automotive Single-port USB-C PD + DC-DC Controller + FETs
- EZ-PD™ CCG8 dual-single-port USB-C PD
- EZ-PD™ CMG1 USB-C EMCA controller
- EZ-PD™ CMG2 USB-C EMCA controller with EPR
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- 48 V systems for EVs & mild hybrids
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Automotive BMS
- Overview
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- Overview
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- Overview
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AC-DC power conversion
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Getting to the top worldwide with excellence
The largest research facility for microelectronics in Austria
According to the Top 500 Ranking published by trend business magazine, Infineon Austria was Austria’s most research-focused industrial company in 2024. In the fiscal year 2024, 686 million euro or 14 percent of total revenue went into research and development. There are 2,505 experts working in the development centers in Villach, Graz, Linz and Innsbruck, developing new solutions, technologies and innovations. Roughly one quarter of the R&D staff of the entire Group is employed by Infineon Austria.
Local competencies and global research tasks have been continuously expanded at Infineon Austria in recent years in the areas of energy efficiency, mobility and security. The recipe for success includes short development periods, the highest quality and a focus on customer-oriented system solutions with a "from product to system" approach. The thematic focal points include the development of power semiconductors and thin wafer technologies, as well as sensors, micromechanics, new semiconductor materials and contactless security applications.
Laboratory activities usually require on-site presence. Especially during the Corona pandemic, this situation poses new challenges for research and development. In order to perform measurements and experiments remotely to protect the researchers, Infineon experts from Villach developed solutions to automate laboratory work. The measuring devices at the local laboratory workstations were configured in such a way that measurements can be started and evaluated remotely. A compact and fully automated system was developed to enable the exact repeatability of measurements on different components, even remotely. This ensures a fast and highly precise exchange of components by remote control.
Power semiconductors play a key role in electronic devices. They convert mains power from the outlet to the requirements of the respective device, with the aim of minimizing energy losses that mostly take the form of waste heat. The activities in Villach focus on the development of increasingly smaller and more energyefficient chips to be used in automotive, manufacturing and consumer electronics.
The many years of development experience in Villach are bearing fruit: Infineon is the world market leader in power semiconductors. To maintain this success, the team in Villach is already working on the next generation of chips, made of new materials such as silicon carbide (SiC) and gallium nitride (GaN): In 2024, Infineon succeeded in developing the world’s first 300-millimeter GaN wafer technology for power electronics and implementing it in an existing, scalable high-volume production facility.
These so-called wide band gap technologies can convert power much more efficiently, making units smaller and lighter. This enables charging stations for electric cars with significantly shorter charging times or the mobile infrastructure for 5G networks.
The goal in the automotive research field is to design the next generation of vehicles. Power electronics, microcontroller solutions and sensor technologies designed in Villach enable innovative applications for the cars of the future. These include, for example, 3D magnetic sensors, which are able to measure movements in all directions. This makes them universally deployable for joystick-type applications, for example for multimedia systems in cars and consumer electronics.
Another key area is the development of “smart” switches for intelligent power distribution in vehicles. These make it possible to detect and isolate faults in the entire on-board system. This field of application takes on a whole new dimension due to the functional safety requirements of connected and autonomous vehicles. Products developed in accordance with the ISO 26262 series of standards are used for automotive safety applications. Infineon is therefore developing highly available and fail-safe components for the mobility of the future.
Expertise at Villach contributes to linking the real with the digital world. Here, the focus is on the development of circuits that process digital as well as analog signals. One key aspect is the field of microcontrollers with worldwide responsibility for analog-mixed-signal know-how. In the field of power management, numerous power driver solutions have been developed for industrial applications and data centers. Sensors for computers and consumer electronics are another area of focus. In addition to a variety of other analog-mixed-signal solutions, we have also achieved system competence for 5G base stations and advanced the development of the high-speed mobile communications network of the future.
- Wireless chargers
- LED lighting
- Servers
- 5G mobile infrastructure
- Photovoltaic systems and wind parks
- Anti-lock braking systems
- Electronic power steering
- Electric and hybrid vehicles
- Charging infrastructure for electric vehicles
- Refrigerators and induction stoves
Whether we are talking about microcontrollers, the Near Field Communication (NFC) transmission standard, security chips for payment cards and sovereign documents or chips for battery management in electric vehicles – the global competence center for contactless technologies is a driving force in innovations in security, mobility, and the Internet of Things. It is so successful, in fact, that in 2022 the 500th employee was hired.
In light of the rapid electrification and digitalization trends, demand for more efficient and safe microelectronics solutions is rising continuously. In order to meet this need, Infineon’s development center Graz is expanding its range of responsibilities and is developing particularly fast, powerful and energy-efficient microcontrollers for use in many areas of everyday life. The focus is on the development, design and layout of innovative microcontrollers that are used, for example, in household appliances, power tools, charging stations and batteries for e-bikes, solar systems or industrial robots and automation systems. Above all, they enable secure data processing for the Internet of Things.
Both contact-based and contactless security chips are designed to meet a range of standards for data transmission, with the aim of further increasing data transmission rates and finding new form factors for contactless applications.
Building on its expertise in contactless payment systems, Infineon is working on new chip solutions that make payment even more convenient, hygienic and secure. With biometric payment cards, the cardholder’s fingerprint is used for authentication instead of a PIN. The finger is placed on the card, where it is identified by a sensor and then matched with the fingerprint stored on the card. The microcontroller developed by the Graz team ensures secure data transmission of the confirmation from the sensor to the security chip and back to the reader.
For the automotive market, the Graz researchers developed a module to optimize the charging and discharging of batteries in electric vehicles. The range and service life of the energy storage unit in zero-emission cars are of great importance when considering a purchase. With the right battery management, these characteristics are continuously improved, and in close cooperation with vehicle manufacturers, we were able to reach a completely new level.
Infineon has been a shareholder of the VIRTUAL VEHICLE research center in Graz since October 2019 and supports pioneering research fields in digital mobility. With its microelectronics solutions, Infineon contributes to the development and improvement of intelligent and connected vehicles.
- NFC ATM cards
- Payment and credit cards
- Smart Wearables
- Electronic passports
- Scurity components for PCs and tablets
- Health insurance cards (e-cards)
- 3D image sensor chips for Augmented Reality and Virtual Reality
- Tire pressure sensors
- Control of automatic transmission
With its development center for high-frequency parts in Linz, Infineon is a pioneer in the field of radar technologies for driver assistance systems: in 2009, the Linz team launched the world’s first 77 GHz radar chip using silicongermanium technology. These radar sensors are used in driver assistance systems such as pedestrian recognition, distance warnings and automatic emergency braking, making driving safer and more comfortable.
With more than 250 million 77 GHz radar chips sold, Infineon is the technology and world market leader in this segment. The aim is to further develop this safety technology for widespread use, as in the future, radar sensors will be part of the standard equipment of every new car. Among other things, radar systems are a prerequisite for automated driving.
The development center in Linz was established in 1999 as a spin-off of the Johannes Kepler University. Infineon Austria joined in 2000 (DICE) and has been the 100% owner of the site since September 30, 2019.
Over the past 20 years, the facility with its over 210 employees has developed into a global competence center for high-frequency technologies within the Infineon Group, with world-leading expertise in radar chips for driver assistance systems.
The other key areas of the Linz team’s activities include high-frequency components for mobile telephony and navigation applications, like for example antenna switches and receive amplifiers. With the help of these, end devices can achieve very high data rates even under unfavorable reception conditions. These products can be found in almost every smartphone, tablet and navigation system, and are therefore delivered in quantities of several hundred million per year.
- Radar chips for driver assistance systems
- High-Frequency Switches and Reception Amplifiers
- 5G Base Stations: Receiver Modules
- Distance warning systems
- Automatic emergency braking
- Autonomous vehicles
- Smartphones & tablets
Infineon Austria is performing research and development projects in future-oriented fields of technology, funded amongst others by organisations of the EU and the republic of Austria.
Examples for supporters on EU level are the European Regional Development Fund (ERDF), the ECSEL initiative and Horizon 2020. On state level, the Austrian Research Promotion Agency (FFG) is our strongest partner.
Selected research projects by funding agency
Selected research projects by funding agency
ERDF
FutureGaN:
Where silicon technologies reach their limits, gallium nitride (GaN) promises a better performance for an application. Unfortunately, GaN is not ready for mass productioni yet, due to its high costs. FutureGaN pursues evolutoinary research approaches in order to prepare GaN technologies for cost-effective volume production.
FutureSiC:
The goal of FutureSiC is the advancement of silicon carbide systems with voltage from 600 for motor/generator activation and AC/DC power conversion far beyond the current state of the art. Research activities include tasks regarding technology development as well as works on new reliability tests for SiC technologies.
FutureSilicon-HV:
FutureSilicon-HV strives for high-voltage silicon technologies to get closer to their physical limits in order to facilitate cost-effective and energy-efficient applications and further expand the competitive edge of silicon technologies in that segment.
FutureSMART:
FutureSMART examines the provision of innovative smart switches for the use in the electrical systems of automobiles. The project aims to replace mechanical switches, realize software configurable power distributors and develop switches for redundant, safe supply for control units of safety-critical driver assistance systems.
ADA-NL:
In the project ADA-NL (The Next Level of Analog IC Design Automation), innovative methods such as analog generators and AI-assisted verification are being developed to improve design automation for analog circuit blocks in integrated circuits. These lead to lower R&D costs and faster time-to-market for semiconductor products.
M30V-F:
The M30V-F project (AFET7_30V MOSFET Technology Platform for Discrete PowerMOS and Power Stage Products) addresses the increase in efficiency of the on-board power system and the components connected to it in electric vehicles. The goal is to first determine the requirements for MOSFETs in the low-voltage electrical system of battery-powered electric vehicles and then to develop a new MOSFET product family that can optimally serve the changing vehicle architectures.
Chips JU (formerly KDT JU)
Listen2Future:
"Listen2Future" is focusing on acoustic sensor solutions integrated with digital technologies as key enablers for emerging applications fostering Society 5.0.
All2GaN:
"All2GaN" will strengthen the European Power Electronics Industry by offering an EU-born smart GaN Integration Toolbox as a base for applications with significantly increased material- and energy efficiency, thus meeting the global energy needs while keeping the CO2 footprint to the minimumide (GaN). The objective is to make these power semiconductors available for a wide variety of applications at globally competitive cost levels.
FFG
FATE:
The FATE (Fault-driven Analysis and Testing for Design Robustness and Stability) project running under the FFG program "ICT-THE-FUTURE" is researching a fault-based and human-focused methodology to better guide the design of cyber-physical systems in their various phases. The results of the FATE project contribute to the safety and robustness of cyber-physical applications and promote the competitiveness of the Austrian semiconductor industry.
OptoQuant
The quantum research project "OptoQuant" is working on the integration of optical components for ion traps based on modern semiconductor manufacturing processes. The aim is to increase the reliability and precision of quantum processors and to accelerate the development of quantum computers.
iLIDS4SAM:
Automated mobility systems are presently moving towards more complex urban traffic scenarios. The iLIDS4SAM project will enable this transition by developing high performance, low-cost LiDAR sensors with increased field of view and resolution.
Horizon
Multi-Moby:
The project Multi-Moby addresses the development, manufacturing and deployment of safe, efficient, and affordable urban electric vehicles for passengers and commercial vans.
IPCEI ME/CT
Since March 2021, Infineon Austria has been part of the "Important Project of Common European Interest (IPCEI) Microelectronics I" project, thus helping to strengthen the European microelectronics industry.
The goal is to develop new generations of semiconductors based on existing technologies and to transfer them to stable mass production in the shortest possible time. This includes MOSFET and SMART technologies as well as silicon carbide (SiC) and gallium nitride (GaN), rectifiers and MEMS applications. The aim is to accelerate the development and market maturity of cutting-edge technologies "made in Europe" and to ensure Europe's independence in high-tech solutions for electrification and digitalization as well as for CO2 reduction.
According to the Top 500 Ranking published by trend business magazine, Infineon Austria was Austria’s most research-focused industrial company in 2024. In the fiscal year 2024, 686 million euro or 14 percent of total revenue went into research and development. There are 2,505 experts working in the development centers in Villach, Graz, Linz and Innsbruck, developing new solutions, technologies and innovations. Roughly one quarter of the R&D staff of the entire Group is employed by Infineon Austria.
Local competencies and global research tasks have been continuously expanded at Infineon Austria in recent years in the areas of energy efficiency, mobility and security. The recipe for success includes short development periods, the highest quality and a focus on customer-oriented system solutions with a "from product to system" approach. The thematic focal points include the development of power semiconductors and thin wafer technologies, as well as sensors, micromechanics, new semiconductor materials and contactless security applications.
Laboratory activities usually require on-site presence. Especially during the Corona pandemic, this situation poses new challenges for research and development. In order to perform measurements and experiments remotely to protect the researchers, Infineon experts from Villach developed solutions to automate laboratory work. The measuring devices at the local laboratory workstations were configured in such a way that measurements can be started and evaluated remotely. A compact and fully automated system was developed to enable the exact repeatability of measurements on different components, even remotely. This ensures a fast and highly precise exchange of components by remote control.
Power semiconductors play a key role in electronic devices. They convert mains power from the outlet to the requirements of the respective device, with the aim of minimizing energy losses that mostly take the form of waste heat. The activities in Villach focus on the development of increasingly smaller and more energyefficient chips to be used in automotive, manufacturing and consumer electronics.
The many years of development experience in Villach are bearing fruit: Infineon is the world market leader in power semiconductors. To maintain this success, the team in Villach is already working on the next generation of chips, made of new materials such as silicon carbide (SiC) and gallium nitride (GaN): In 2024, Infineon succeeded in developing the world’s first 300-millimeter GaN wafer technology for power electronics and implementing it in an existing, scalable high-volume production facility.
These so-called wide band gap technologies can convert power much more efficiently, making units smaller and lighter. This enables charging stations for electric cars with significantly shorter charging times or the mobile infrastructure for 5G networks.
The goal in the automotive research field is to design the next generation of vehicles. Power electronics, microcontroller solutions and sensor technologies designed in Villach enable innovative applications for the cars of the future. These include, for example, 3D magnetic sensors, which are able to measure movements in all directions. This makes them universally deployable for joystick-type applications, for example for multimedia systems in cars and consumer electronics.
Another key area is the development of “smart” switches for intelligent power distribution in vehicles. These make it possible to detect and isolate faults in the entire on-board system. This field of application takes on a whole new dimension due to the functional safety requirements of connected and autonomous vehicles. Products developed in accordance with the ISO 26262 series of standards are used for automotive safety applications. Infineon is therefore developing highly available and fail-safe components for the mobility of the future.
Expertise at Villach contributes to linking the real with the digital world. Here, the focus is on the development of circuits that process digital as well as analog signals. One key aspect is the field of microcontrollers with worldwide responsibility for analog-mixed-signal know-how. In the field of power management, numerous power driver solutions have been developed for industrial applications and data centers. Sensors for computers and consumer electronics are another area of focus. In addition to a variety of other analog-mixed-signal solutions, we have also achieved system competence for 5G base stations and advanced the development of the high-speed mobile communications network of the future.
- Wireless chargers
- LED lighting
- Servers
- 5G mobile infrastructure
- Photovoltaic systems and wind parks
- Anti-lock braking systems
- Electronic power steering
- Electric and hybrid vehicles
- Charging infrastructure for electric vehicles
- Refrigerators and induction stoves
Whether we are talking about microcontrollers, the Near Field Communication (NFC) transmission standard, security chips for payment cards and sovereign documents or chips for battery management in electric vehicles – the global competence center for contactless technologies is a driving force in innovations in security, mobility, and the Internet of Things. It is so successful, in fact, that in 2022 the 500th employee was hired.
In light of the rapid electrification and digitalization trends, demand for more efficient and safe microelectronics solutions is rising continuously. In order to meet this need, Infineon’s development center Graz is expanding its range of responsibilities and is developing particularly fast, powerful and energy-efficient microcontrollers for use in many areas of everyday life. The focus is on the development, design and layout of innovative microcontrollers that are used, for example, in household appliances, power tools, charging stations and batteries for e-bikes, solar systems or industrial robots and automation systems. Above all, they enable secure data processing for the Internet of Things.
Both contact-based and contactless security chips are designed to meet a range of standards for data transmission, with the aim of further increasing data transmission rates and finding new form factors for contactless applications.
Building on its expertise in contactless payment systems, Infineon is working on new chip solutions that make payment even more convenient, hygienic and secure. With biometric payment cards, the cardholder’s fingerprint is used for authentication instead of a PIN. The finger is placed on the card, where it is identified by a sensor and then matched with the fingerprint stored on the card. The microcontroller developed by the Graz team ensures secure data transmission of the confirmation from the sensor to the security chip and back to the reader.
For the automotive market, the Graz researchers developed a module to optimize the charging and discharging of batteries in electric vehicles. The range and service life of the energy storage unit in zero-emission cars are of great importance when considering a purchase. With the right battery management, these characteristics are continuously improved, and in close cooperation with vehicle manufacturers, we were able to reach a completely new level.
Infineon has been a shareholder of the VIRTUAL VEHICLE research center in Graz since October 2019 and supports pioneering research fields in digital mobility. With its microelectronics solutions, Infineon contributes to the development and improvement of intelligent and connected vehicles.
- NFC ATM cards
- Payment and credit cards
- Smart Wearables
- Electronic passports
- Scurity components for PCs and tablets
- Health insurance cards (e-cards)
- 3D image sensor chips for Augmented Reality and Virtual Reality
- Tire pressure sensors
- Control of automatic transmission
With its development center for high-frequency parts in Linz, Infineon is a pioneer in the field of radar technologies for driver assistance systems: in 2009, the Linz team launched the world’s first 77 GHz radar chip using silicongermanium technology. These radar sensors are used in driver assistance systems such as pedestrian recognition, distance warnings and automatic emergency braking, making driving safer and more comfortable.
With more than 250 million 77 GHz radar chips sold, Infineon is the technology and world market leader in this segment. The aim is to further develop this safety technology for widespread use, as in the future, radar sensors will be part of the standard equipment of every new car. Among other things, radar systems are a prerequisite for automated driving.
The development center in Linz was established in 1999 as a spin-off of the Johannes Kepler University. Infineon Austria joined in 2000 (DICE) and has been the 100% owner of the site since September 30, 2019.
Over the past 20 years, the facility with its over 210 employees has developed into a global competence center for high-frequency technologies within the Infineon Group, with world-leading expertise in radar chips for driver assistance systems.
The other key areas of the Linz team’s activities include high-frequency components for mobile telephony and navigation applications, like for example antenna switches and receive amplifiers. With the help of these, end devices can achieve very high data rates even under unfavorable reception conditions. These products can be found in almost every smartphone, tablet and navigation system, and are therefore delivered in quantities of several hundred million per year.
- Radar chips for driver assistance systems
- High-Frequency Switches and Reception Amplifiers
- 5G Base Stations: Receiver Modules
- Distance warning systems
- Automatic emergency braking
- Autonomous vehicles
- Smartphones & tablets
Infineon Austria is performing research and development projects in future-oriented fields of technology, funded amongst others by organisations of the EU and the republic of Austria.
Examples for supporters on EU level are the European Regional Development Fund (ERDF), the ECSEL initiative and Horizon 2020. On state level, the Austrian Research Promotion Agency (FFG) is our strongest partner.
Selected research projects by funding agency
Selected research projects by funding agency
ERDF
FutureGaN:
Where silicon technologies reach their limits, gallium nitride (GaN) promises a better performance for an application. Unfortunately, GaN is not ready for mass productioni yet, due to its high costs. FutureGaN pursues evolutoinary research approaches in order to prepare GaN technologies for cost-effective volume production.
FutureSiC:
The goal of FutureSiC is the advancement of silicon carbide systems with voltage from 600 for motor/generator activation and AC/DC power conversion far beyond the current state of the art. Research activities include tasks regarding technology development as well as works on new reliability tests for SiC technologies.
FutureSilicon-HV:
FutureSilicon-HV strives for high-voltage silicon technologies to get closer to their physical limits in order to facilitate cost-effective and energy-efficient applications and further expand the competitive edge of silicon technologies in that segment.
FutureSMART:
FutureSMART examines the provision of innovative smart switches for the use in the electrical systems of automobiles. The project aims to replace mechanical switches, realize software configurable power distributors and develop switches for redundant, safe supply for control units of safety-critical driver assistance systems.
ADA-NL:
In the project ADA-NL (The Next Level of Analog IC Design Automation), innovative methods such as analog generators and AI-assisted verification are being developed to improve design automation for analog circuit blocks in integrated circuits. These lead to lower R&D costs and faster time-to-market for semiconductor products.
M30V-F:
The M30V-F project (AFET7_30V MOSFET Technology Platform for Discrete PowerMOS and Power Stage Products) addresses the increase in efficiency of the on-board power system and the components connected to it in electric vehicles. The goal is to first determine the requirements for MOSFETs in the low-voltage electrical system of battery-powered electric vehicles and then to develop a new MOSFET product family that can optimally serve the changing vehicle architectures.
Chips JU (formerly KDT JU)
Listen2Future:
"Listen2Future" is focusing on acoustic sensor solutions integrated with digital technologies as key enablers for emerging applications fostering Society 5.0.
All2GaN:
"All2GaN" will strengthen the European Power Electronics Industry by offering an EU-born smart GaN Integration Toolbox as a base for applications with significantly increased material- and energy efficiency, thus meeting the global energy needs while keeping the CO2 footprint to the minimumide (GaN). The objective is to make these power semiconductors available for a wide variety of applications at globally competitive cost levels.
FFG
FATE:
The FATE (Fault-driven Analysis and Testing for Design Robustness and Stability) project running under the FFG program "ICT-THE-FUTURE" is researching a fault-based and human-focused methodology to better guide the design of cyber-physical systems in their various phases. The results of the FATE project contribute to the safety and robustness of cyber-physical applications and promote the competitiveness of the Austrian semiconductor industry.
OptoQuant
The quantum research project "OptoQuant" is working on the integration of optical components for ion traps based on modern semiconductor manufacturing processes. The aim is to increase the reliability and precision of quantum processors and to accelerate the development of quantum computers.
iLIDS4SAM:
Automated mobility systems are presently moving towards more complex urban traffic scenarios. The iLIDS4SAM project will enable this transition by developing high performance, low-cost LiDAR sensors with increased field of view and resolution.
Horizon
Multi-Moby:
The project Multi-Moby addresses the development, manufacturing and deployment of safe, efficient, and affordable urban electric vehicles for passengers and commercial vans.
IPCEI ME/CT
Since March 2021, Infineon Austria has been part of the "Important Project of Common European Interest (IPCEI) Microelectronics I" project, thus helping to strengthen the European microelectronics industry.
The goal is to develop new generations of semiconductors based on existing technologies and to transfer them to stable mass production in the shortest possible time. This includes MOSFET and SMART technologies as well as silicon carbide (SiC) and gallium nitride (GaN), rectifiers and MEMS applications. The aim is to accelerate the development and market maturity of cutting-edge technologies "made in Europe" and to ensure Europe's independence in high-tech solutions for electrification and digitalization as well as for CO2 reduction.
Horizon Europe is the EU's most comprehensive research and innovation program ever, to 2027, € 95,5 billion are allocated for research and development.
The Chips JU initiative der EU supports research and innovation projects in the field of electronics with fundig from the EU, member states and spnsors of innovative ideas that can bring about lasting change in our society and our private lives.
The European Regional Development Fund (ERDF) makes a valuable contribution to growth and employment within the framework of EU regional policy.
All activities of the Austrian Research Promotion Agency (FFG) aim to strengthen Austria as a research and innovation center on the global market.