According to the Top 500 Ranking published by trend business magazine, Infineon Austria was Austria’s most research-focused industrial company in 2024. In the fiscal year 2024, 686 million euro or 14 percent of total revenue went into research and development. There are 2,505 experts working in the development centers in Villach, Graz, Linz and Innsbruck, developing new solutions, technologies and innovations. Roughly one quarter of the R&D staff of the entire Group is employed by Infineon Austria.

Local competencies and global research tasks have been continuously expanded at Infineon Austria in recent years in the areas of energy efficiency, mobility and security. The recipe for success includes short development periods, the highest quality and a focus on customer-oriented system solutions with a "from product to system" approach. The thematic focal points include the development of power semiconductors and thin wafer technologies, as well as sensors, micromechanics, new semiconductor materials and contactless security applications.

Laboratory activities usually require on-site presence. Especially during the Corona pandemic, this situation poses new challenges for research and development. In order to perform measurements and experiments remotely to protect the researchers, Infineon experts from Villach developed solutions to automate laboratory work. The measuring devices at the local laboratory workstations were configured in such a way that measurements can be started and evaluated remotely. A compact and fully automated system was developed to enable the exact repeatability of measurements on different components, even remotely. This ensures a fast and highly precise exchange of components by remote control.

Power semiconductors play a key role in electronic devices. They convert mains power from the outlet to the requirements of the respective device, with the aim of minimizing energy losses that mostly take the form of waste heat. The activities in Villach focus on the development of increasingly smaller and more energyefficient chips to be used in automotive, manufacturing and consumer electronics.

Sustainability
Sustainability
Sustainability

The many years of development experience in Villach are bearing fruit: Infineon is the world market leader in power semiconductors. To maintain this success, the team in Villach is already working on the next generation of chips, made of new materials such as silicon carbide (SiC) and gallium nitride (GaN): In 2024, Infineon succeeded in developing the world’s first 300-millimeter GaN wafer technology for power electronics and implementing it in an existing, scalable high-volume production facility.

These so-called wide band gap technologies can convert power much more efficiently, making units smaller and lighter. This enables charging stations for electric cars with significantly shorter charging times or the mobile infrastructure for 5G networks.

The goal in the automotive research field is to design the next generation of vehicles. Power electronics, microcontroller solutions and sensor technologies designed in Villach enable innovative applications for the cars of the future. These include, for example, 3D magnetic sensors, which are able to measure movements in all directions. This makes them universally deployable for joystick-type applications, for example for multimedia systems in cars and consumer electronics.

Another key area is the development of “smart” switches for intelligent power distribution in vehicles. These make it possible to detect and isolate faults in the entire on-board system. This field of application takes on a whole new dimension due to the functional safety requirements of connected and autonomous vehicles. Products developed in accordance with the ISO 26262 series of standards are used for automotive safety applications. Infineon is therefore developing highly available and fail-safe components for the mobility of the future.

Expertise at Villach contributes to linking the real with the digital world. Here, the focus is on the development of circuits that process digital as well as analog signals. One key aspect is the field of microcontrollers with worldwide responsibility for analog-mixed-signal know-how. In the field of power management, numerous power driver solutions have been developed for industrial applications and data centers. Sensors for computers and consumer electronics are another area of focus. In addition to a variety of other analog-mixed-signal solutions, we have also achieved system competence for 5G base stations and advanced the development of the high-speed mobile communications network of the future.

  • Wireless chargers
  • LED lighting
  • Servers
  • 5G mobile infrastructure
  • Photovoltaic systems and wind parks
  • Anti-lock braking systems
  • Electronic power steering
  • Electric and hybrid vehicles
  • Charging infrastructure for electric vehicles
  • Refrigerators and induction stoves

Whether we are talking about microcontrollers, the Near Field Communication (NFC) transmission standard, security chips for payment cards and sovereign documents or chips for battery management in electric vehicles – the global competence center for contactless technologies is a driving force in innovations in security, mobility, and the Internet of Things. It is so successful, in fact, that in 2022 the 500th employee was hired.

In light of the rapid electrification and digitalization trends, demand for more efficient and safe microelectronics solutions is rising continuously. In order to meet this need, Infineon’s development center Graz is expanding its range of responsibilities and is developing particularly fast, powerful and energy-efficient microcontrollers for use in many areas of everyday life. The focus is on the development, design and layout of innovative microcontrollers that are used, for example, in household appliances, power tools, charging stations and batteries for e-bikes, solar systems or industrial robots and automation systems. Above all, they enable secure data processing for the Internet of Things.

Both contact-based and contactless security chips are designed to meet a range of standards for data transmission, with the aim of further increasing data transmission rates and finding new form factors for contactless applications.

Building on its expertise in contactless payment systems, Infineon is working on new chip solutions that make payment even more convenient, hygienic and secure. With biometric payment cards, the cardholder’s fingerprint is used for authentication instead of a PIN. The finger is placed on the card, where it is identified by a sensor and then matched with the fingerprint stored on the card. The microcontroller developed by the Graz team ensures secure data transmission of the confirmation from the sensor to the security chip and back to the reader.

For the automotive market, the Graz researchers developed a module to optimize the charging and discharging of batteries in electric vehicles. The range and service life of the energy storage unit in zero-emission cars are of great importance when considering a purchase. With the right battery management, these characteristics are continuously improved, and in close cooperation with vehicle manufacturers, we were able to reach a completely new level.

Infineon has been a shareholder of the VIRTUAL VEHICLE research center in Graz since October 2019 and supports pioneering research fields in digital mobility. With its microelectronics solutions, Infineon contributes to the development and improvement of intelligent and connected vehicles.

  • NFC ATM cards
  • Payment and credit cards
  • Smart Wearables
  • Electronic passports
  • Scurity components for PCs and tablets
  • Health insurance cards (e-cards)
  • 3D image sensor chips for Augmented Reality and Virtual Reality
  • Tire pressure sensors
  • Control of automatic transmission

With its development center for high-frequency parts in Linz, Infineon is a pioneer in the field of radar technologies for driver assistance systems: in 2009, the Linz team launched the world’s first 77 GHz radar chip using silicongermanium technology. These radar sensors are used in driver assistance systems such as pedestrian recognition, distance warnings and automatic emergency braking, making driving safer and more comfortable.

With more than 250 million 77 GHz radar chips sold, Infineon is the technology and world market leader in this segment. The aim is to further develop this safety technology for widespread use, as in the future, radar sensors will be part of the standard equipment of every new car. Among other things, radar systems are a prerequisite for automated driving.

The development center in Linz was established in 1999 as a spin-off of the Johannes Kepler University. Infineon Austria joined in 2000 (DICE) and has been the 100% owner of the site since September 30, 2019. 

Over the past 20 years, the facility with its over 210 employees has developed into a global competence center for high-frequency technologies within the Infineon Group, with world-leading expertise in radar chips for driver assistance systems.

The other key areas of the Linz team’s activities include high-frequency components for mobile telephony and navigation applications, like for example antenna switches and receive amplifiers. With the help of these, end devices can achieve very high data rates even under unfavorable reception conditions. These products can be found in almost every smartphone, tablet and navigation system, and are therefore delivered in quantities of several hundred million per year.

  • Radar chips for driver assistance systems
  • High-Frequency Switches and Reception Amplifiers
  • 5G Base Stations: Receiver Modules
  • Distance warning systems
  • Automatic emergency braking
  • Autonomous vehicles
  • Smartphones & tablets

Infineon Austria is performing research and development projects in future-oriented fields of technology, funded amongst others by organisations of the EU and the republic of Austria.

Examples for supporters on EU level are the European Regional Development Fund (ERDF), the ECSEL initiative and Horizon 2020. On state level, the Austrian Research Promotion Agency (FFG) is our strongest partner.

Selected research projects by funding agency

Selected research projects by funding agency

FutureGaN:

Where silicon technologies reach their limits, gallium nitride (GaN) promises a better performance for an application. Unfortunately, GaN is not ready for mass productioni yet, due to its high costs. FutureGaN pursues evolutoinary research approaches in order to prepare GaN technologies for cost-effective volume production.

FutureSiC:

The goal of FutureSiC is the advancement of silicon carbide systems with voltage from 600 for motor/generator activation and AC/DC power conversion far beyond the current state of the art. Research activities include tasks regarding technology development as well as works on new reliability tests for SiC technologies.

FutureSilicon-HV:

FutureSilicon-HV strives for high-voltage silicon technologies to get closer to their physical limits in order to facilitate cost-effective and energy-efficient applications and further expand the competitive edge of silicon technologies in that segment.

FutureSMART:

FutureSMART examines the provision of innovative smart switches for the use in the electrical systems of automobiles. The project aims to replace mechanical switches, realize software configurable power distributors and develop switches for redundant, safe supply for control units of safety-critical driver assistance systems.

ADA-NL:

In the project ADA-NL (The Next Level of Analog IC Design Automation), innovative methods such as analog generators and AI-assisted verification are being developed to improve design automation for analog circuit blocks in integrated circuits. These lead to lower R&D costs and faster time-to-market for semiconductor products.

M30V-F:

The M30V-F project (AFET7_30V MOSFET Technology Platform for Discrete PowerMOS and Power Stage Products) addresses the increase in efficiency of the on-board power system and the components connected to it in electric vehicles. The goal is to first determine the requirements for MOSFETs in the low-voltage electrical system of battery-powered electric vehicles and then to develop a new MOSFET product family that can optimally serve the changing vehicle architectures.

Listen2Future:

"Listen2Future" is focusing on acoustic sensor solutions integrated with digital technologies as key enablers for emerging applications fostering Society 5.0.

View project website

 

All2GaN:

"All2GaN" will strengthen the European Power Electronics Industry by offering an EU-born smart GaN Integration Toolbox as a base for applications with significantly increased material- and energy efficiency, thus meeting the global energy needs while keeping the CO2 footprint to the minimumide (GaN). The objective is to make these power semiconductors available for a wide variety of applications at globally competitive cost levels. 

View project website

FATE:

The FATE (Fault-driven Analysis and Testing for Design Robustness and Stability) project running under the FFG program "ICT-THE-FUTURE" is researching a fault-based and human-focused methodology to better guide the design of cyber-physical systems in their various phases. The results of the FATE project contribute to the safety and robustness of cyber-physical applications and promote the competitiveness of the Austrian semiconductor industry.

OptoQuant 

The quantum research project "OptoQuant" is working on the integration of optical components for ion traps based on modern semiconductor manufacturing processes. The aim is to increase the reliability and precision of quantum processors and to accelerate the development of quantum computers.

iLIDS4SAM:

Automated mobility systems are presently moving towards more complex urban traffic scenarios. The iLIDS4SAM project will enable this transition by developing high performance, low-cost LiDAR sensors with increased field of view and resolution.

to the project website

Multi-Moby:

The project Multi-Moby addresses the development, manufacturing and deployment of safe, efficient, and affordable urban electric vehicles for passengers and commercial vans. 

 to the project website

Since March 2021, Infineon Austria has been part of the "Important Project of Common European Interest (IPCEI) Microelectronics I" project, thus helping to strengthen the European microelectronics industry.

The goal is to develop new generations of semiconductors based on existing technologies and to transfer them to stable mass production in the shortest possible time. This includes MOSFET and SMART technologies as well as silicon carbide (SiC) and gallium nitride (GaN), rectifiers and MEMS applications. The aim is to accelerate the development and market maturity of cutting-edge technologies "made in Europe" and to ensure Europe's independence in high-tech solutions for electrification and digitalization as well as for CO2 reduction.

 to the project website

According to the Top 500 Ranking published by trend business magazine, Infineon Austria was Austria’s most research-focused industrial company in 2024. In the fiscal year 2024, 686 million euro or 14 percent of total revenue went into research and development. There are 2,505 experts working in the development centers in Villach, Graz, Linz and Innsbruck, developing new solutions, technologies and innovations. Roughly one quarter of the R&D staff of the entire Group is employed by Infineon Austria.

Local competencies and global research tasks have been continuously expanded at Infineon Austria in recent years in the areas of energy efficiency, mobility and security. The recipe for success includes short development periods, the highest quality and a focus on customer-oriented system solutions with a "from product to system" approach. The thematic focal points include the development of power semiconductors and thin wafer technologies, as well as sensors, micromechanics, new semiconductor materials and contactless security applications.

Laboratory activities usually require on-site presence. Especially during the Corona pandemic, this situation poses new challenges for research and development. In order to perform measurements and experiments remotely to protect the researchers, Infineon experts from Villach developed solutions to automate laboratory work. The measuring devices at the local laboratory workstations were configured in such a way that measurements can be started and evaluated remotely. A compact and fully automated system was developed to enable the exact repeatability of measurements on different components, even remotely. This ensures a fast and highly precise exchange of components by remote control.

Power semiconductors play a key role in electronic devices. They convert mains power from the outlet to the requirements of the respective device, with the aim of minimizing energy losses that mostly take the form of waste heat. The activities in Villach focus on the development of increasingly smaller and more energyefficient chips to be used in automotive, manufacturing and consumer electronics.

Sustainability
Sustainability
Sustainability

The many years of development experience in Villach are bearing fruit: Infineon is the world market leader in power semiconductors. To maintain this success, the team in Villach is already working on the next generation of chips, made of new materials such as silicon carbide (SiC) and gallium nitride (GaN): In 2024, Infineon succeeded in developing the world’s first 300-millimeter GaN wafer technology for power electronics and implementing it in an existing, scalable high-volume production facility.

These so-called wide band gap technologies can convert power much more efficiently, making units smaller and lighter. This enables charging stations for electric cars with significantly shorter charging times or the mobile infrastructure for 5G networks.

The goal in the automotive research field is to design the next generation of vehicles. Power electronics, microcontroller solutions and sensor technologies designed in Villach enable innovative applications for the cars of the future. These include, for example, 3D magnetic sensors, which are able to measure movements in all directions. This makes them universally deployable for joystick-type applications, for example for multimedia systems in cars and consumer electronics.

Another key area is the development of “smart” switches for intelligent power distribution in vehicles. These make it possible to detect and isolate faults in the entire on-board system. This field of application takes on a whole new dimension due to the functional safety requirements of connected and autonomous vehicles. Products developed in accordance with the ISO 26262 series of standards are used for automotive safety applications. Infineon is therefore developing highly available and fail-safe components for the mobility of the future.

Expertise at Villach contributes to linking the real with the digital world. Here, the focus is on the development of circuits that process digital as well as analog signals. One key aspect is the field of microcontrollers with worldwide responsibility for analog-mixed-signal know-how. In the field of power management, numerous power driver solutions have been developed for industrial applications and data centers. Sensors for computers and consumer electronics are another area of focus. In addition to a variety of other analog-mixed-signal solutions, we have also achieved system competence for 5G base stations and advanced the development of the high-speed mobile communications network of the future.

  • Wireless chargers
  • LED lighting
  • Servers
  • 5G mobile infrastructure
  • Photovoltaic systems and wind parks
  • Anti-lock braking systems
  • Electronic power steering
  • Electric and hybrid vehicles
  • Charging infrastructure for electric vehicles
  • Refrigerators and induction stoves

Whether we are talking about microcontrollers, the Near Field Communication (NFC) transmission standard, security chips for payment cards and sovereign documents or chips for battery management in electric vehicles – the global competence center for contactless technologies is a driving force in innovations in security, mobility, and the Internet of Things. It is so successful, in fact, that in 2022 the 500th employee was hired.

In light of the rapid electrification and digitalization trends, demand for more efficient and safe microelectronics solutions is rising continuously. In order to meet this need, Infineon’s development center Graz is expanding its range of responsibilities and is developing particularly fast, powerful and energy-efficient microcontrollers for use in many areas of everyday life. The focus is on the development, design and layout of innovative microcontrollers that are used, for example, in household appliances, power tools, charging stations and batteries for e-bikes, solar systems or industrial robots and automation systems. Above all, they enable secure data processing for the Internet of Things.

Both contact-based and contactless security chips are designed to meet a range of standards for data transmission, with the aim of further increasing data transmission rates and finding new form factors for contactless applications.

Building on its expertise in contactless payment systems, Infineon is working on new chip solutions that make payment even more convenient, hygienic and secure. With biometric payment cards, the cardholder’s fingerprint is used for authentication instead of a PIN. The finger is placed on the card, where it is identified by a sensor and then matched with the fingerprint stored on the card. The microcontroller developed by the Graz team ensures secure data transmission of the confirmation from the sensor to the security chip and back to the reader.

For the automotive market, the Graz researchers developed a module to optimize the charging and discharging of batteries in electric vehicles. The range and service life of the energy storage unit in zero-emission cars are of great importance when considering a purchase. With the right battery management, these characteristics are continuously improved, and in close cooperation with vehicle manufacturers, we were able to reach a completely new level.

Infineon has been a shareholder of the VIRTUAL VEHICLE research center in Graz since October 2019 and supports pioneering research fields in digital mobility. With its microelectronics solutions, Infineon contributes to the development and improvement of intelligent and connected vehicles.

  • NFC ATM cards
  • Payment and credit cards
  • Smart Wearables
  • Electronic passports
  • Scurity components for PCs and tablets
  • Health insurance cards (e-cards)
  • 3D image sensor chips for Augmented Reality and Virtual Reality
  • Tire pressure sensors
  • Control of automatic transmission

With its development center for high-frequency parts in Linz, Infineon is a pioneer in the field of radar technologies for driver assistance systems: in 2009, the Linz team launched the world’s first 77 GHz radar chip using silicongermanium technology. These radar sensors are used in driver assistance systems such as pedestrian recognition, distance warnings and automatic emergency braking, making driving safer and more comfortable.

With more than 250 million 77 GHz radar chips sold, Infineon is the technology and world market leader in this segment. The aim is to further develop this safety technology for widespread use, as in the future, radar sensors will be part of the standard equipment of every new car. Among other things, radar systems are a prerequisite for automated driving.

The development center in Linz was established in 1999 as a spin-off of the Johannes Kepler University. Infineon Austria joined in 2000 (DICE) and has been the 100% owner of the site since September 30, 2019. 

Over the past 20 years, the facility with its over 210 employees has developed into a global competence center for high-frequency technologies within the Infineon Group, with world-leading expertise in radar chips for driver assistance systems.

The other key areas of the Linz team’s activities include high-frequency components for mobile telephony and navigation applications, like for example antenna switches and receive amplifiers. With the help of these, end devices can achieve very high data rates even under unfavorable reception conditions. These products can be found in almost every smartphone, tablet and navigation system, and are therefore delivered in quantities of several hundred million per year.

  • Radar chips for driver assistance systems
  • High-Frequency Switches and Reception Amplifiers
  • 5G Base Stations: Receiver Modules
  • Distance warning systems
  • Automatic emergency braking
  • Autonomous vehicles
  • Smartphones & tablets

Infineon Austria is performing research and development projects in future-oriented fields of technology, funded amongst others by organisations of the EU and the republic of Austria.

Examples for supporters on EU level are the European Regional Development Fund (ERDF), the ECSEL initiative and Horizon 2020. On state level, the Austrian Research Promotion Agency (FFG) is our strongest partner.

Selected research projects by funding agency

Selected research projects by funding agency

FutureGaN:

Where silicon technologies reach their limits, gallium nitride (GaN) promises a better performance for an application. Unfortunately, GaN is not ready for mass productioni yet, due to its high costs. FutureGaN pursues evolutoinary research approaches in order to prepare GaN technologies for cost-effective volume production.

FutureSiC:

The goal of FutureSiC is the advancement of silicon carbide systems with voltage from 600 for motor/generator activation and AC/DC power conversion far beyond the current state of the art. Research activities include tasks regarding technology development as well as works on new reliability tests for SiC technologies.

FutureSilicon-HV:

FutureSilicon-HV strives for high-voltage silicon technologies to get closer to their physical limits in order to facilitate cost-effective and energy-efficient applications and further expand the competitive edge of silicon technologies in that segment.

FutureSMART:

FutureSMART examines the provision of innovative smart switches for the use in the electrical systems of automobiles. The project aims to replace mechanical switches, realize software configurable power distributors and develop switches for redundant, safe supply for control units of safety-critical driver assistance systems.

ADA-NL:

In the project ADA-NL (The Next Level of Analog IC Design Automation), innovative methods such as analog generators and AI-assisted verification are being developed to improve design automation for analog circuit blocks in integrated circuits. These lead to lower R&D costs and faster time-to-market for semiconductor products.

M30V-F:

The M30V-F project (AFET7_30V MOSFET Technology Platform for Discrete PowerMOS and Power Stage Products) addresses the increase in efficiency of the on-board power system and the components connected to it in electric vehicles. The goal is to first determine the requirements for MOSFETs in the low-voltage electrical system of battery-powered electric vehicles and then to develop a new MOSFET product family that can optimally serve the changing vehicle architectures.

Listen2Future:

"Listen2Future" is focusing on acoustic sensor solutions integrated with digital technologies as key enablers for emerging applications fostering Society 5.0.

View project website

 

All2GaN:

"All2GaN" will strengthen the European Power Electronics Industry by offering an EU-born smart GaN Integration Toolbox as a base for applications with significantly increased material- and energy efficiency, thus meeting the global energy needs while keeping the CO2 footprint to the minimumide (GaN). The objective is to make these power semiconductors available for a wide variety of applications at globally competitive cost levels. 

View project website

FATE:

The FATE (Fault-driven Analysis and Testing for Design Robustness and Stability) project running under the FFG program "ICT-THE-FUTURE" is researching a fault-based and human-focused methodology to better guide the design of cyber-physical systems in their various phases. The results of the FATE project contribute to the safety and robustness of cyber-physical applications and promote the competitiveness of the Austrian semiconductor industry.

OptoQuant 

The quantum research project "OptoQuant" is working on the integration of optical components for ion traps based on modern semiconductor manufacturing processes. The aim is to increase the reliability and precision of quantum processors and to accelerate the development of quantum computers.

iLIDS4SAM:

Automated mobility systems are presently moving towards more complex urban traffic scenarios. The iLIDS4SAM project will enable this transition by developing high performance, low-cost LiDAR sensors with increased field of view and resolution.

to the project website

Multi-Moby:

The project Multi-Moby addresses the development, manufacturing and deployment of safe, efficient, and affordable urban electric vehicles for passengers and commercial vans. 

 to the project website

Since March 2021, Infineon Austria has been part of the "Important Project of Common European Interest (IPCEI) Microelectronics I" project, thus helping to strengthen the European microelectronics industry.

The goal is to develop new generations of semiconductors based on existing technologies and to transfer them to stable mass production in the shortest possible time. This includes MOSFET and SMART technologies as well as silicon carbide (SiC) and gallium nitride (GaN), rectifiers and MEMS applications. The aim is to accelerate the development and market maturity of cutting-edge technologies "made in Europe" and to ensure Europe's independence in high-tech solutions for electrification and digitalization as well as for CO2 reduction.

 to the project website

HORIZON EU
HORIZON EU
HORIZON EU

Horizon Europe is the EU's most comprehensive research and innovation program ever, to 2027, € 95,5 billion are allocated for research and development.

EMAS Logo
EMAS Logo
EMAS Logo

The Chips JU initiative der EU supports research and innovation projects in the field of electronics with fundig from the EU, member states and spnsors of innovative ideas that can bring about lasting change in our society and our private lives.

msci keyvisual
msci keyvisual
msci keyvisual

The European Regional Development Fund (ERDF) makes a valuable contribution to growth and employment within the framework of EU regional policy. 

FFG
FFG
FFG

All activities of the Austrian Research Promotion Agency (FFG) aim to strengthen Austria as a research and innovation center on the global market.