3D ToF image sensors

Sensing the world in 3D with REAL3™ Time-of-Flight image sensors

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3D Time-of-flight (ToF) image sensors

REAL3™ is Infineon's 3D imager family consisting of highly integrated time-of-flight (ToF) sensors. These single-chip imagers are sunlight-robust, highly scalable, and ready for integration into a wide range of consumer, automotive, and industrial applications.

Infineon’s REAL3™ time-of-flight image sensors enable electronic devices to acquire a real 3D map of the scene in front of the device. The surroundings, objects, and people are transformed into the digital space in real-time. Algorithms use that data to measure distances and sizes, track motions, and convert the shape of objects into 3D models. Our products are designed to be integrated into the smallest 3D ToF camera modules, accurately measuring the depth in the short range and longer range at the lowest power consumption.

Discover ToF applications for consumer & industry
Discover ToF applications for automotive
How do REAL3™ 3D Time-of-Flight image sensors work?

The REAL3™ time-of-flight imager works according to the ToF principle known as indirect ToF (i-ToF). Key components of a ToF camera module are the ToF imager, an infrared illumination (850 or 940 nm wavelength) source with driver circuitry and an optical lens stack on top of the imager. The high-quality depth map of the environment is obtained in real time.

The Time-of-flight (ToF) technology projects a single modulated, infrared light source onto an object, user, or scene of interest. The reflected light is captured by the ToF imager, which measures the amplitude and phase difference per pixel. The result is a highly reliable image of the distance plus a grayscale picture of the entire scene.

3D ToF working principle infographic
REAL3™ ToF benefits for the application
  • REAL3™ ToF image sensors enhance application’s value: a high-performance 3D image sensor portfolio allows for optimized designs that meet performance, power, size, and cost targets. 
  • Comprehensive offering from depth algorithm to mass production: sophisticated depth and AI algorithms, detection and correction of depth data artifacts, depth software support plus most advanced, fastest, and volume-proven calibration and test setups.
  • Robust performance at all environmental conditions - even in challenging ambient light conditions. 
  • More miniaturized designs: available single-chip solutions to achieve small and robust camera modules at minimum design effort.
  • Optimized BOM: highly integrated 3D ToF image sensor offering (laser safety, power supply) and low-cost vertical-cavity surface-emitting laser (VCSEL) driver optimizes the BOM (bill-of-materials) for camera modules while delivering unique feature to end applications. 
  • Faster time-to-market: mutually complementary, fully integrated offering from Infineon and pmdtechnologies spanning the entire design and production ecosystem.
Markets and applications

3D Time-of-flight (ToF) image sensors

REAL3™ is Infineon's 3D imager family consisting of highly integrated time-of-flight (ToF) sensors. These single-chip imagers are sunlight-robust, highly scalable, and ready for integration into a wide range of consumer, automotive, and industrial applications.

Infineon’s REAL3™ time-of-flight image sensors enable electronic devices to acquire a real 3D map of the scene in front of the device. The surroundings, objects, and people are transformed into the digital space in real-time. Algorithms use that data to measure distances and sizes, track motions, and convert the shape of objects into 3D models. Our products are designed to be integrated into the smallest 3D ToF camera modules, accurately measuring the depth in the short range and longer range at the lowest power consumption.

Discover ToF applications for consumer & industry
Discover ToF applications for automotive

How do REAL3™ 3D Time-of-Flight image sensors work?

The REAL3™ time-of-flight imager works according to the ToF principle known as indirect ToF (i-ToF). Key components of a ToF camera module are the ToF imager, an infrared illumination (850 or 940 nm wavelength) source with driver circuitry and an optical lens stack on top of the imager. The high-quality depth map of the environment is obtained in real time.

The Time-of-flight (ToF) technology projects a single modulated, infrared light source onto an object, user, or scene of interest. The reflected light is captured by the ToF imager, which measures the amplitude and phase difference per pixel. The result is a highly reliable image of the distance plus a grayscale picture of the entire scene.

3D ToF working principle infographic

REAL3™ ToF benefits for the application
  • REAL3™ ToF image sensors enhance application’s value: a high-performance 3D image sensor portfolio allows for optimized designs that meet performance, power, size, and cost targets. 
  • Comprehensive offering from depth algorithm to mass production: sophisticated depth and AI algorithms, detection and correction of depth data artifacts, depth software support plus most advanced, fastest, and volume-proven calibration and test setups.
  • Robust performance at all environmental conditions - even in challenging ambient light conditions. 
  • More miniaturized designs: available single-chip solutions to achieve small and robust camera modules at minimum design effort.
  • Optimized BOM: highly integrated 3D ToF image sensor offering (laser safety, power supply) and low-cost vertical-cavity surface-emitting laser (VCSEL) driver optimizes the BOM (bill-of-materials) for camera modules while delivering unique feature to end applications. 
  • Faster time-to-market: mutually complementary, fully integrated offering from Infineon and pmdtechnologies spanning the entire design and production ecosystem.
Markets and applications

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