TO-leadless

600 V and 650 V CoolMOS™ C7 Gold superjunction MOSFET in TO-Leadless (G7) - the perfect balance of high-efficiency and ease of use

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Overview

The combination of improved 650 V CoolMOS™ C7 and 600 V CoolMOS™ C7 superjunction (SJ) MOSFET technology plus the low parasitic inductance from both the package and 4-pin Kelvin source option, and the improved thermal performance of the TOLL package all add together to enable for the first time the possibility of using a surface mount (or SMD) solution in mid to high power factor correction circuits and resonant topologies such as LLC.

Key Features

  • Thermal improvement over D²PAK
  • World‘s lowest RDS(on)/package
  • Space reduction vs D²PAK and TO-220
  • MSL1 compliant, wave, and reflow
  • Visual inspection with grooved pins
  • Kelvin source option

Products

About

High-power SMD package

Thermal and current performances are better than those of D2PAK and similar to those of TO-220. Combined with a fast-switching CoolMOS™, this package provides distinct advantages in terms of converter density and reduced assembly costs. Kelvin source options permit accelerated commutation with reduced oscillations resulting in reduced EMI filter needs.

Reduced assembly costs

TO-leadless permits high-throughput automatic placement on the PCB - previously not achievable for this power class components. While the package, being leadless, offers minimized stray inductances, it also permits for optical inspection of the solder joint quality - improving the end-of-line yields.

Benefits

  • Higher system efficiency by lower switching losses
  • Improved performance and power density

Benefits of TO-Leadless package:

  • Improved power density
  • High quality and ease of use
  • Improved manufacturing
  • Improved efficiency and ease of use
  • Can be used in higher current applications

High-power SMD package

Thermal and current performances are better than those of D2PAK and similar to those of TO-220. Combined with a fast-switching CoolMOS™, this package provides distinct advantages in terms of converter density and reduced assembly costs. Kelvin source options permit accelerated commutation with reduced oscillations resulting in reduced EMI filter needs.

Reduced assembly costs

TO-leadless permits high-throughput automatic placement on the PCB - previously not achievable for this power class components. While the package, being leadless, offers minimized stray inductances, it also permits for optical inspection of the solder joint quality - improving the end-of-line yields.

Benefits

  • Higher system efficiency by lower switching losses
  • Improved performance and power density

Benefits of TO-Leadless package:

  • Improved power density
  • High quality and ease of use
  • Improved manufacturing
  • Improved efficiency and ease of use
  • Can be used in higher current applications

Documents

Documents

Design resources

Developer community

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