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New ecosystem partners for AIROC™ CYW5459X portfolio to accelerate design cycle of robust, seamless connection for video and AI edge devices and IoT
New ecosystem partners for AIROC™ CYW5459X portfolio to accelerate design cycle of robust, seamless connection for video and AI edge devices and IoT
Market News
Munich, Germany – February 20, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced it has added five new platform and module partners to support its proven high performance AIROC™ CYW5459x Wi-Fi and Bluetooth® combo portfolio. Additional partners include module partners Murata Electronics, AzureWave, Quectel Wireless and platform partners NVIDIA and Rockchip Electronics Co. With these new partners, end customers can accelerate development cycle and shorten time-to-market for their end products.
Infineon’s CYW5459x and partner solutions deliver high-performance IoT applications with robust connectivity in congested environments, while maintaining seamless video, audio and data streaming in an extended range. Infineon’s CYW54590 and CYW54591 devices also reduce overall system power consumption and operate in harsh temperature environments. The embedded network intelligence agent allows customers to monitor network health and generate actionable decisions remotely via the cloud.
“The combination of the enhanced features offered by CYW5459x and our extended partner support improves the user experience for teleconferencing, audio and video streaming cameras, industrial automation and AI-enabled devices,” said Sivaram Trikutam, Vice President, Wi-Fi Product Line, Infineon. “With these new capabilities, customers can be assured that their live-streaming applications will work in some of the most congested environments, and their time-to-market will be reduced.”
The collaboration with ecosystem partners NVIDIA and Rockchip enables customers to integrate Artificial Intelligence (AI) and immediate “decisions” at the edge to their devices. Global-certified modules from Murata Electronics, AzureWave and Quectel Wireless significantly shorten customer design cycles by three to six months and reduce overall cost for regulatory certification.
Partner Quotes
“As the world’s leading IoT processor supplier, Rockchip has various product lines with processors that bring exceptional value to customers with Infineon’s AIROC CYW5459x,” said Zhengyuan Lin, Vice President, Rockchip. "Rockchip is very delighted to collaborate with Infineon, and looks forward to future collaborations with the CYW5459x.”
“As video, audio and data streaming applications continually increase, we need to find more solutions to support our growing requirements for always-on service for live streaming applications,” said Akira Sasaki, General Manager, Connectivity Module Marketing, Murata. “Our collaboration with Infineon on the CYW5459x portfolio will enable us to provide our customers with exceptional seamless and reliable Wi-Fi connections for audio and video streaming services—quickly and more cost effectively.”
“AzureWave is a market leader in providing reliable design, manufacturing and software services of wireless module solution,” said Patrick Lin, Vice President of Product Marketing, AzureWave. “ We take pride in shortening customers’ development process and time-to-market with miniaturization technologies, multifunctional designs, eco-friendly functionalities, and a wide range of platforms and OS supports. With Infineon high-performance, low-power Wi-Fi solution, we satisfy customer's expectations with high-quality products, optimized designs and exceptional services,” said Patrick Lin, Vice President of Product Marketing, AzureWave.
“We’re delighted to announce that our FC80A high-performance Wi-Fi and Bluetooth module based on Infineon’s AIROC CYW5459x platform is available for the global market,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “Featuring ultra-compact size, low power consumption, 2.4GHz and 5GHz RSDB (Real simultaneous dual band) and Bluetooth 5.1, the FC80A can be easily embedded into size-constrained applications to provide reliable and high-speed data transmission. It is an ideal solution for consumer applications including VR, video streaming devices and more.”
Availability
Infineon’s AIROC CYW5459x Wi-Fi and Bluetooth combo is available now. More information about the complete solution is available at: www.infineon.com/products/wireless-connectivity/airoc-wi-fi-plus-bluetooth-combos
Modules for the Infineon CYW5459x:
- Murata modules: https://www.murata.com/ja-jp/products/connectivitymodule/wi-fi-bluetooth/overview/lineup/type2bz
- AzureWave modules: https://www.azurewave.com/img/infineon/AW-CM572_DS_DF_C_STD.pdf and https://www.azurewave.com/wireless-modules-infineon.html
- Quectel FC80A module: https://www.quectel.com/product/wi-fi-bluetooth-fc80a
Platform reference designs:
- NVIDIA Orin AI Platform: https://www.nvidia.com/en-us/autonomous-machines/embedded-systems/jetson-orin/
- Rockchip’s application processor: rock-chips.com/a/en/products/index.html.
More information about Infineon’s contribution to energy efficiency: www.infineon.com/green-energy.
Press Photos
AIROCΓäó CYW5459x
Infineon’s AIROC™ CYW5459x and ecosystem partner solutions deliver high-performance IoT applications with robust connectivity in congested environments, while maintaining seamless video, audio and data streaming in an extended range. Infineon’s CYW54590 and CYW54591 devices also reduce overall system power consumption and operate in harsh temperature environments. With the new partners, end customers can accelerate development cycle and shorten time-to-market for their end products.
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AIROC Industrial Application
Infineon’s AIROC™ CYW5459x and ecosystem partner solutions deliver high-performance IoT applications with robust connectivity in congested environments, while maintaining seamless video, audio and data streaming in an extended range. Infineon’s CYW54590 and CYW54591 devices also reduce overall system power consumption and operate in harsh temperature environments. With the new partners, end customers can accelerate development cycle and shorten time-to-market for their end products.
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Information Number : INFPSS202302-063