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How key semiconductor components e.g. Power module/ Chip embedding, gate-drive, microcontroller and current sensors seamlessly build efficient and cost competitive Inverter system. Latest application portfolio with award winning chip embedding technology, new inverter T-type topology is supported by SiC-SiC HybridPACK™ drive module, and AI based junction temperature calculation for more reliable and efficient drive cycles. 

  • Chip embedding S-Cells (>100 ARMS per 1200 V S-Cell) Fast switching, Fast development cycle for your own developed high performance power stage
  • SiC SiC T-type inverter balances drive-train efficiency, with 10% range extension vs. its IGBT counterpart 
  • HybridPACKTM HD  (heavy duty) based on advanced SiC-MOSFET technology built for harsh commercial vehicles. Ultimate reliability, longer life, and optimized costs.
  • AURIX™ TC4x enables OEM better profitability with cost optimization for Power Stage 
  • EiceDRIVER™ 3040 ensures more efficient drive cycle through slew rate control D12
Marion Heiß
Marion Heiß
Marion Heiß

System Application Engineer

Omar is the global System Application Engineer (G.SAE) for Automotive Main Inverter inside Infineon. His background is in power electronics. In the last 10 years Omar worked on reference design with Infineon latest generation devices.

Webinar related documents
Five Inverter Decisions. Two segments. One Chipset.
June 24, 2026
14:00 ( CET )