Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
END OF LIFE
discontinued
RoHS Compliant
Lead-free

OC1120

END OF LIFE
eSIM turnkey solution for cellular-connected consumer devices

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OC1120
OC1120

Product details

  • Ambient Temperature
    -25 °C to 85 °C
  • Applications
    Consumer devices (smartphones, tablets, wearables, notebooks, Access points)
  • Asymmetric Cryptography
    RSA up to 2048 bit, ECC up to 521 bit, NIST P-256, Brainpool256r1, FRP256V1
  • Certifications
    GSMA, 3GPP, CC EAL6+ certified hardware
  • CPU
    32-bit
  • Delivery Forms
    XFWLB-25-3, VQFN-8-4
  • Interfaces
    ISO 7816
  • NVM
    800 kByte
  • Package
    SG-XFWLB-25-3, PG-VQFN-8-4
  • Product Description
    OPTIGA™ Connect Consumer OC1120 is an eSIM solution dedicated to consumer devices with full compatibility with all Mobile Network Operators offering GSMAS eSIM consumer services. OC1120 supports standard cellular technologies 2G, 3G, 4G-LTE as well as 5G.
  • Symmetric Cryptography
    AES up to 256 bit, DES
  • Use Cases
    eSIM (embedded SIM)
OPN
OC11200810WLB25XTSA1
Product Status discontinued
Infineon Package SG-XFWLB-25
Package Name N/A
Packing Size 1
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status discontinued
Infineon Package SG-XFWLB-25
Package Name -
Packing Size 1
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
OPTIGA™ Connect Consumer is a ready-to-connect eSIM solution for consumer devices. It is especially suited to extending cellular connectivity to smaller devices like smart watches, fitness trackers and other wearables. This eSIM solution fully complies with the latest specifications from GSMA (SGP.22 V2.2.2) and Trusted Connectivity Alliance (eUICC Profile Package V2.3.1)

Features

  • SIM, USIM, CSIM, RUIM and ISIM
  • RSP compliant with GSMA SGP.22 v2.2.2
  • Compliant w/ TCA eUICC Profile Pkg V2.3.
  • Chip-scale and ETSI MFF2 packages
  • Up to 800 kByte free memory
  • Security evaluated (BSI-CC-PP-0100-2018)
  • Voltage classes: B, C
  • Temperature: -25 to +85°C
  • Data retention: 10 years
  • Over-the-air functionality for RFM / RAM

Benefits

  • Increased customer convenience
  • More design flexibility
  • Future ready device
  • Based on a solid security platform
  • Interoperable
  • lower design-in and qualification effort

Documents

Documents

Design resources

Partner solutions

Developer community

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