Offering a convenient digital payment experience

Coil on Module – Packaging innovation to support fast and easy transition from contact-based to dual-interface cards

Learn more about the innovative packaging technology from Infineon, designed to increase the durability and robustness of smart cards. And at the same time, reducing costs for the manufacturer.

The payment market is moving away from cash and contact-based cards in response to consumer demands for convenient digital payment experiences. Consequently, smart card technology is making its way into more and more mobile devices, wearables and Internet-connected things. Driven by MasterCard/VISA, the market is also migrating to dual-interface schemes. These combine both contact-based and contactless functionality based on the EMV standard. This offers enhanced authentication functionality, greater protection against fraud and tampering, and seamless interoperability – all key success factors in the payment business.

 

In response to these market trends, card manufacturers face a number of production challenges. These include higher complexity for dual interface card production, cost efficiency and time-to-market pressures. Contemplating a transition to a contactless or DIF scheme, many manufacturers are therefore looking to mitigate costs by avoiding capital investments, saving on consumables, maximizing production yield and taking a lean approach to stock management. Ready-to-run solution bundling the security chip with a module and an antenna can accelerate time-to-market here by simplifying production.

We have developed an innovative inductive coupling technology that bridges the gap between today's contact-based payment applications and tomorrows contactless or dual-interface world. Coil on Module (CoM) addresses todays reliability and robustness issues by replacing the mechanical connection between the module and the antenna with a radio frequency link. This eliminates issues such as damage to the antenna and lack of contact between the module and the antenna during the personalization process. CoM improves the performance and reliability of the final product.

In addition, this assembly solution simplifies stock management, increases manufacturing yield and thus cuts manufacturing costs. Even more to the point, it is a low-investment option as it is fully compatible with existing contact-based production equipment. To further simplify rollout, CoM is available with pre-certified reference solutions for VISA/MasterCard.

 

  • S-COM8.4 and S-COM8.6
  • Re-use of existing card lamination process
  • Wire embedded card antenna on PVC base material
  • Card production with high production yield and reliability
  • Optimized for 4-line embossing of payment cards
  • Tailored to customer sheet layout
  • One universal card antenna design for different chip/module combinations
  • Enables paper approval process based on reference approvals at the payment schemes
  • Reduced ESD impact on contact readers, POS & ATMs
  • Fast adoption to new form factors like 6-pin DIF
  • Available as part of the SECORATM Pay solution offering combining high-security SLE 77 and SLC 32P controllers and operating systems