Tough times!

Today’s contactless and DIF cards don’t have it easy. Stuffed into a wallet, they get sat on, bent, twisted, squashed and thrown about all day long. What’s more, they get pulled out and shoved back in to the wallet every time the user wants to buy a coffee, ride the subway, enter a building, pay for shopping or collect a prescription from the drugstore. The constant mechanical strain through rough daily handling means that the conventional physical connection between the radio frequency (RF) antenna and the card module can easily snap. And it frequently does.

Coil on Module contactless
Coil on Module contactless
Coil on Module contactless
Riding the wave of technology change

In an increasingly mobile world, consumers are demanding fast, easy access to multiple services from a single card or device. This is fueling a move away from previously contact-based applications such as payment and identification towards contactless and dual-interface (DIF) multi-purpose schemes.

Fast, flexible card production processes built on stable, agile supply chains are essential to allow rapid rollout of competitive, customized offerings. Here optimized solutions bundling chip, module and antenna can give manufacturers a valuable lead.

Government ID
Payment
Coil on Module robustness
Coil on Module robustness
Coil on Module robustness
Spotlight on security and robustness

Alongside security, durability has thus become a key success factor for multi-application cards. Card manufacturers need solutions with a robust design that complies with strict tender requirements governing factors such as tamper resistance and lifetime.

Infineon’s packaging innovations are designed to increase the durability and robustness of smart cards while at the same time reducing cost for the manufacturer.

Coil on Module
Coil on Module
Coil on Module
Introducing Coil on Module

Coil on Module (CoM), our award-winning dual interface chip packaging technology, uses a radio frequency (RF) link instead of the mechanical/electrical connection typically used between the card antenna and the module.

This inductive coupling, along with a robust polycarbonate monoblock, greatly increases the robustness and long-term reliability of contactless and DIF cards in the field. Consequently, CoM enables lifetimes of ten years and more – essential for identification documents.

Why Infineon

Coil on Module highlights benefits
Coil on Module highlights benefits
Coil on Module highlights benefits

With our field-proven, plug & play packaging technology based on inductive coupling, we offer our customers a smart solution for the transition from contact-based to contactless using CoM DIF cards. Our CoM packages featuring polycarbonate monoblocks meet all security and robustness requirements for government identification or payment cards in particular, effortlessly overcoming the weak spot in today’s dual-interface card designs.

Maintaining lean production processes identical to those deployed in contact-based environments, our customers can look forward to immediate, high-speed volume production without having to invest in any new or special machinery. In addition, they benefit from a simplified, secure supply chain with reduced stock levels as one antenna supports all chip/module combinations.

As the leading provider of security solutions with a track record stretching back more than 30 years, we have developed an excellent worldwide sales and customer support structure over time. Presenting a single point of accountability, our one-stop, global offering extends beyond chips to include the operating system, module and antenna for reduced production complexity.

Application brochures

Application brochures

Related links

Payment solutions
Government identification
Smart card contactless controller modules

Our offering

Meeting the needs for convenience and durability

Coil on Module – Packaging innovation for eID documents

Going the full distance – ID cards in the field

Production challenges

ID card manufacturers face a number of production challenges. On the one hand, they are looking for ways to support contactless or DIF functionality without complicating their production landscape. This entails mitigating costs by avoiding capital investments, saving on consumables, maximizing production yield and taking a lean approach to stock management. Ready-to-run solution bundling the security chip with a module and an antenna can accelerate time-to-market here by simplifying production. And, on the other, they face growing space constraints as a result of new card constructions e.g. with additional security or transperent layers that limit the area available on the card for the module.

The answer to today’s ID challenges from Infineon

Highlights of our CoM offering for government ID projects

  • S-COM10.6 with inductive coupling
  • Wire-embedded class 1 (ISO14443) card antenna on PC
  • re-use of existing card lamination process
  • Full compliance with PC monoblock security requirements
  • PVC and PET-G also available
  • One universal card antenna for any chip / module combination
  • Available in solution bundles combining high-security SLE 77, SLE 78 and SLC52G controllers and operating systems
GovernmentID ePassport
GovernmentID ePassport
GovernmentID ePassport

Given their security-critical nature, government ID cards have to be designed to the very highest standards to enable robust protection against fraud and tampering. They are required to maintain this performance over a minimum ten-year period – which is significantly longer than typical payment or loyalty cards, for instance. In addition, identification cards are increasingly being merged with payment or other applications, which requires manufacturers to implement contactless or dual-interface (DIF) production capabilities.

CoM for GovID
CoM for GovID
CoM for GovID

Infineon has developed an innovative inductive coupling technology. Coil on Module (CoM) replaces traditional electro-mechanical links with inductive connections. This entails placing a small antenna directly on the chip module. This connects with a coupling area on a standard-size antenna in the card using an electromagnetic field within the card body. This radio frequency (RF) connection resolves space constraints, as the chip module is almost 30% slimmer than common modules. In addition, the wire embedded antenna fully supports the polycarbonate (PC) monoblock concept which is stronger, more robust and more flexible than mixed material designs, allowing full compliance with the extended lifetime requirements of ID documents. Moreover the module also supports customized designs like featuring a logo on the module. Last but not least, with CoM, card manufacturers do not need to invest in new equipment to support DIF functionality, as the production process flow is similar to contact-based card production.

Offering a convenient digital payment experience

Coil on Module – Packaging innovation to support fast and easy transition from contact-based to dual-interface cards

Learn more about the innovative packaging technology from Infineon, designed to increase the durability and robustness of smart cards. And at the same time, reducing costs for the manufacturer.

Security pays off

Production challenges

In response to these market trends, card manufacturers face a number of production challenges. These include higher complexity for dual interface card production, cost efficiency and time-to-market pressures. Contemplating a transition to a contactless or DIF scheme, many manufacturers are therefore looking to mitigate costs by avoiding capital investments, saving on consumables, maximizing production yield and taking a lean approach to stock management. Ready-to-run solution bundling the security chip with a module and an antenna can accelerate time-to-market here by simplifying production.

Answering today’s payment challenges with CoM from Infineon

Highlights of our CoM offering for payment projects

  • S-COM8.4 and S-COM8.6
  • Re-use of existing card lamination process
  • Wire embedded card antenna on PVC base material
  • Card production with high production yield and reliability
  • Optimized for 4-line embossing of payment cards
  • Tailored to customer sheet layout
  • One universal card antenna design for different chip/module combinations
  • Enables paper approval process based on reference approvals at the payment schemes
  • Reduced ESD impact on contact readers, POS & ATMs
  • Fast adoption to new form factors like 6-pin DIF
  • Available as part of the SECORATM Pay solution offering combining high-security SLE 77 and SLC 32P controllers and operating systems
Ticketing Payment
Ticketing Payment
Ticketing Payment

The payment market is moving away from cash and contact-based cards in response to consumer demands for convenient digital payment experiences. Consequently, smart card technology is making its way into more and more mobile devices, wearables and Internet-connected things. Driven by MasterCard/VISA, the market is also migrating to dual-interface schemes. These combine both contact-based and contactless functionality based on the EMV standard. This offers enhanced authentication functionality, greater protection against fraud and tampering, and seamless interoperability – all key success factors in the payment business.

CoM for Pay
CoM for Pay
CoM for Pay

We have developed an innovative inductive coupling technology that bridges the gap between today's contact-based payment applications and tomorrows contactless or dual-interface world. Coil on Module (CoM) addresses todays reliability and robustness issues by replacing the mechanical connection between the module and the antenna with a radio frequency link. This eliminates issues such as damage to the antenna and lack of contact between the module and the antenna during the personalization process. CoM improves the performance and reliability of the final product.

In addition, this assembly solution simplifies stock management, increases manufacturing yield and thus cuts manufacturing costs. Even more to the point, it is a low-investment option as it is fully compatible with existing contact-based production equipment. To further simplify rollout, CoM is available with pre-certified reference solutions for VISA/MasterCard.

Award-winning CoM design

The 2013 Global Frost & Sullivan Award for New Product Innovation Leadership went to our Coil on Module (CoM) packaging technology. Each year, Frost & Sullivan presents this award to the developer of an innovative element in a product that leverages leading-edge technologies. The award recognizes the value-added features/benefits of the product and the increased ROI it offers customers.

Frost & Sullivan acknowledged our CoM chip package and related card antenna designs for their ability to accelerate the introduction of cards that can be used for both contact-based as well as contactless applications. Highlights cited by the research and consulting organization include improved card robustness, up to five times faster manufacturing processes, flexible card design and minimal investments in new manufacturing equipment. It predicts that banks and financial institutions will benefit from improved performance, longer lifetimes and simplified supply chains for the final products.

“Infineon is a leading manufacturer of semiconductor solutions, which has enabled it to gain deeper expertise in manufacturing processes and subsequently, on ways to improve chips and packaging technologies,” said Frost & Sullivan Global Program Director, Digital Identification, ICT, Jean-Noel Georges. “Leveraging this experience, the company has developed a complete solution for dual-interface cards that bridges the gap from todays contact-based applications to tomorrows contactless world."

Frost & Sullivan award press release

Meeting the needs for convenience and durability

Coil on Module – Packaging innovation for eID documents

Going the full distance – ID cards in the field

Production challenges

ID card manufacturers face a number of production challenges. On the one hand, they are looking for ways to support contactless or DIF functionality without complicating their production landscape. This entails mitigating costs by avoiding capital investments, saving on consumables, maximizing production yield and taking a lean approach to stock management. Ready-to-run solution bundling the security chip with a module and an antenna can accelerate time-to-market here by simplifying production. And, on the other, they face growing space constraints as a result of new card constructions e.g. with additional security or transperent layers that limit the area available on the card for the module.

The answer to today’s ID challenges from Infineon

Highlights of our CoM offering for government ID projects

  • S-COM10.6 with inductive coupling
  • Wire-embedded class 1 (ISO14443) card antenna on PC
  • re-use of existing card lamination process
  • Full compliance with PC monoblock security requirements
  • PVC and PET-G also available
  • One universal card antenna for any chip / module combination
  • Available in solution bundles combining high-security SLE 77, SLE 78 and SLC52G controllers and operating systems
GovernmentID ePassport
GovernmentID ePassport
GovernmentID ePassport

Given their security-critical nature, government ID cards have to be designed to the very highest standards to enable robust protection against fraud and tampering. They are required to maintain this performance over a minimum ten-year period – which is significantly longer than typical payment or loyalty cards, for instance. In addition, identification cards are increasingly being merged with payment or other applications, which requires manufacturers to implement contactless or dual-interface (DIF) production capabilities.

CoM for GovID
CoM for GovID
CoM for GovID

Infineon has developed an innovative inductive coupling technology. Coil on Module (CoM) replaces traditional electro-mechanical links with inductive connections. This entails placing a small antenna directly on the chip module. This connects with a coupling area on a standard-size antenna in the card using an electromagnetic field within the card body. This radio frequency (RF) connection resolves space constraints, as the chip module is almost 30% slimmer than common modules. In addition, the wire embedded antenna fully supports the polycarbonate (PC) monoblock concept which is stronger, more robust and more flexible than mixed material designs, allowing full compliance with the extended lifetime requirements of ID documents. Moreover the module also supports customized designs like featuring a logo on the module. Last but not least, with CoM, card manufacturers do not need to invest in new equipment to support DIF functionality, as the production process flow is similar to contact-based card production.

Offering a convenient digital payment experience

Coil on Module – Packaging innovation to support fast and easy transition from contact-based to dual-interface cards

Learn more about the innovative packaging technology from Infineon, designed to increase the durability and robustness of smart cards. And at the same time, reducing costs for the manufacturer.

Security pays off

Production challenges

In response to these market trends, card manufacturers face a number of production challenges. These include higher complexity for dual interface card production, cost efficiency and time-to-market pressures. Contemplating a transition to a contactless or DIF scheme, many manufacturers are therefore looking to mitigate costs by avoiding capital investments, saving on consumables, maximizing production yield and taking a lean approach to stock management. Ready-to-run solution bundling the security chip with a module and an antenna can accelerate time-to-market here by simplifying production.

Answering today’s payment challenges with CoM from Infineon

Highlights of our CoM offering for payment projects

  • S-COM8.4 and S-COM8.6
  • Re-use of existing card lamination process
  • Wire embedded card antenna on PVC base material
  • Card production with high production yield and reliability
  • Optimized for 4-line embossing of payment cards
  • Tailored to customer sheet layout
  • One universal card antenna design for different chip/module combinations
  • Enables paper approval process based on reference approvals at the payment schemes
  • Reduced ESD impact on contact readers, POS & ATMs
  • Fast adoption to new form factors like 6-pin DIF
  • Available as part of the SECORATM Pay solution offering combining high-security SLE 77 and SLC 32P controllers and operating systems
Ticketing Payment
Ticketing Payment
Ticketing Payment

The payment market is moving away from cash and contact-based cards in response to consumer demands for convenient digital payment experiences. Consequently, smart card technology is making its way into more and more mobile devices, wearables and Internet-connected things. Driven by MasterCard/VISA, the market is also migrating to dual-interface schemes. These combine both contact-based and contactless functionality based on the EMV standard. This offers enhanced authentication functionality, greater protection against fraud and tampering, and seamless interoperability – all key success factors in the payment business.

CoM for Pay
CoM for Pay
CoM for Pay

We have developed an innovative inductive coupling technology that bridges the gap between today's contact-based payment applications and tomorrows contactless or dual-interface world. Coil on Module (CoM) addresses todays reliability and robustness issues by replacing the mechanical connection between the module and the antenna with a radio frequency link. This eliminates issues such as damage to the antenna and lack of contact between the module and the antenna during the personalization process. CoM improves the performance and reliability of the final product.

In addition, this assembly solution simplifies stock management, increases manufacturing yield and thus cuts manufacturing costs. Even more to the point, it is a low-investment option as it is fully compatible with existing contact-based production equipment. To further simplify rollout, CoM is available with pre-certified reference solutions for VISA/MasterCard.

Award-winning CoM design

The 2013 Global Frost & Sullivan Award for New Product Innovation Leadership went to our Coil on Module (CoM) packaging technology. Each year, Frost & Sullivan presents this award to the developer of an innovative element in a product that leverages leading-edge technologies. The award recognizes the value-added features/benefits of the product and the increased ROI it offers customers.

Frost & Sullivan acknowledged our CoM chip package and related card antenna designs for their ability to accelerate the introduction of cards that can be used for both contact-based as well as contactless applications. Highlights cited by the research and consulting organization include improved card robustness, up to five times faster manufacturing processes, flexible card design and minimal investments in new manufacturing equipment. It predicts that banks and financial institutions will benefit from improved performance, longer lifetimes and simplified supply chains for the final products.

“Infineon is a leading manufacturer of semiconductor solutions, which has enabled it to gain deeper expertise in manufacturing processes and subsequently, on ways to improve chips and packaging technologies,” said Frost & Sullivan Global Program Director, Digital Identification, ICT, Jean-Noel Georges. “Leveraging this experience, the company has developed a complete solution for dual-interface cards that bridges the gap from todays contact-based applications to tomorrows contactless world."

Frost & Sullivan award press release