The 950 V and 1200 V TRENCHSTOP™ IGBT7 and EC7 diode technology is based on the latest micro-pattern trenches technology which provide strongly reduced losses and offer a high level of controllability. This cell concept is characterized by implementing parallel trench cells separated by sub-micron mesas in contrast to the formerly used square trench cells.

  • Micro-pattern trenches technology
  • Strongly reduced losses
  • High level of controllability
  • Parallel trench cells

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The chip is specially optimized for industrial drive applications and solar energy systems, which means much lower static losses, higher power density, and softer switching. Additionally, by raising the allowed maximum operation temperature up to 175°C at overload in the power module, a significant increase in power density can be obtained.

Our IGBT7 modules will be adopted in Easy, Econo, EconoDUAL™ 3, and 62 mm families.

The developed chipset consisting of IGBT7 and emitter-controlled seven-diode is optimized to meet all requirements of an inverterized general-purpose drive (GPD).

Good controllability, sufficient softness at all application-relevant current levels, a significant reduction in static losses, and a high short-circuit capability were achieved. In combination with the improvement of the EconoDUAL™ 3 housing and the new temperature specifications to cover the overload requirements of the drives, the inverter designer has a high degree of freedom.

The application tests show impressive, improved performance compared to the previous generation by achieving 38 K lower temperature with the same current. Alternatively, an output current that is up to 150 A higher can be realized. Taking into account the typical GPD criteria for normal and hard-wearing design, a frame size jumps from 370 A to 477 A is possible with the EconoDUAL™ 3 housing with IGBT 7 instead of IGBT4 inverterized.

Our Easy 1B and Easy 2B family are fully equipped with the 1200 V TRENCHSTOP™ IGBT7 and emitter-controlled diode seven technology. The portfolio offers current ratings from 10 A up to 100 A in PIM, as well as sixpack configuration.

The chip is specially optimized for industrial drive applications, which means much lower static losses, higher power density, and softer switching.

When exchanging the TRENCHSTOP™ IGBT4 with the IGBT7 solution, customers have three options to get the best out of their designs: 

  1. Power class jump: 30 percent more current with IGBT7 in the same housing and with the same system cooling.
  2. Frame size jump: 11 percent more output power plus system design reduction with IGBT7 and smaller housing.
  3. Heat sink reduction: 40 percent reduction in heatsink performance with the same output power.

The Easy 3B package with TRENCHSTOP™ IGBT7 technology extends the broad Easy portfolio in industrial drive applications to higher current ratings: 50 A, 75 A, and 100 A in PIM configuration and 100 A, 150 A, and 200 A in sixpack configuration. Thanks to the same height of 12 mm for the whole Easy family, it is perfectly suited for platform designs in industrial applications, such as servo drives, robotics, and air-conditioning. In addition to industrial drives, the EasyPACK™ 3B with 950 V Active Neutral Point-Clamping (ANPC) is a total solution for 1500 V solar inverters. For MPPT (Maximum Power Point Tracker), Infineon offers a single-module solution in dual-boost topology with three MPPTs in one module. Each of the MPPTs can handle up to 26 A current. This makes this solution ready for bi-facial solar panels.

For the inverter stage, Infineon offers two solutions: One with Si diodes and one with CoolSiC™ Schottky diodes. The EasyPACK™ 3B with TRENCHSTOP™ IGBT7 and CoolSiC™ Schottky diode can achieve up to ten percent higher power density.

The family of Econo 2 and 3 in PIM and sixpack configuration are the latest addition to the TRENCHSTOP™ IGBT7 module portfolio. The EconoPIM™ 2 and 3 module portfolio with TRENCHSTOP™ IGBT7 ranges from 25 A up to 200 A. Compared to the previous IGBT4 chip generation, there is a higher power density, an increased switching frequency, and the cooling effort can be reduced. For example, the EconoPACK™ 2 FS150R12N2T7 can reach up to 37 kW in heavy duty. All in all, there is the same or better lifetime while keeping the operating conditions unchanged.

System simplification and reduced costs by highest power density and performance. The EconoDUAL™ 3 modules with the latest TRENCHSTOP™ IGBT7 chip generation extend the existing 1200 V IGBT4 portfolio with current ratings from 300 A to 900 A. The FF750R12ME7_B11 and FF900R12ME7_B11 feature an improved housing for handling higher currents and temperatures within the same footprint. FF300R12ME7_B11, FF450R12ME7_B11, and FF600R12ME7_B11 complete the portfolio towards lower current ratings. In combination with the TRENCHSTOP™ IGBT7 technology, they show a significant reduction of losses, a high level of controllability and switching softness, as well as high short-circuit capability. Together with the maximum operation temperature of 175°C at overload, high efficiency and power density are achieved, enabling system simplification and cost reduction.

The chip is specially optimized for industrial drive applications and solar energy systems, which means much lower static losses, higher power density, and softer switching. Additionally, by raising the allowed maximum operation temperature up to 175°C at overload in the power module, a significant increase in power density can be obtained.

Our IGBT7 modules will be adopted in Easy, Econo, EconoDUAL™ 3, and 62 mm families.

The developed chipset consisting of IGBT7 and emitter-controlled seven-diode is optimized to meet all requirements of an inverterized general-purpose drive (GPD).

Good controllability, sufficient softness at all application-relevant current levels, a significant reduction in static losses, and a high short-circuit capability were achieved. In combination with the improvement of the EconoDUAL™ 3 housing and the new temperature specifications to cover the overload requirements of the drives, the inverter designer has a high degree of freedom.

The application tests show impressive, improved performance compared to the previous generation by achieving 38 K lower temperature with the same current. Alternatively, an output current that is up to 150 A higher can be realized. Taking into account the typical GPD criteria for normal and hard-wearing design, a frame size jumps from 370 A to 477 A is possible with the EconoDUAL™ 3 housing with IGBT 7 instead of IGBT4 inverterized.

Our Easy 1B and Easy 2B family are fully equipped with the 1200 V TRENCHSTOP™ IGBT7 and emitter-controlled diode seven technology. The portfolio offers current ratings from 10 A up to 100 A in PIM, as well as sixpack configuration.

The chip is specially optimized for industrial drive applications, which means much lower static losses, higher power density, and softer switching.

When exchanging the TRENCHSTOP™ IGBT4 with the IGBT7 solution, customers have three options to get the best out of their designs: 

  1. Power class jump: 30 percent more current with IGBT7 in the same housing and with the same system cooling.
  2. Frame size jump: 11 percent more output power plus system design reduction with IGBT7 and smaller housing.
  3. Heat sink reduction: 40 percent reduction in heatsink performance with the same output power.

The Easy 3B package with TRENCHSTOP™ IGBT7 technology extends the broad Easy portfolio in industrial drive applications to higher current ratings: 50 A, 75 A, and 100 A in PIM configuration and 100 A, 150 A, and 200 A in sixpack configuration. Thanks to the same height of 12 mm for the whole Easy family, it is perfectly suited for platform designs in industrial applications, such as servo drives, robotics, and air-conditioning. In addition to industrial drives, the EasyPACK™ 3B with 950 V Active Neutral Point-Clamping (ANPC) is a total solution for 1500 V solar inverters. For MPPT (Maximum Power Point Tracker), Infineon offers a single-module solution in dual-boost topology with three MPPTs in one module. Each of the MPPTs can handle up to 26 A current. This makes this solution ready for bi-facial solar panels.

For the inverter stage, Infineon offers two solutions: One with Si diodes and one with CoolSiC™ Schottky diodes. The EasyPACK™ 3B with TRENCHSTOP™ IGBT7 and CoolSiC™ Schottky diode can achieve up to ten percent higher power density.

The family of Econo 2 and 3 in PIM and sixpack configuration are the latest addition to the TRENCHSTOP™ IGBT7 module portfolio. The EconoPIM™ 2 and 3 module portfolio with TRENCHSTOP™ IGBT7 ranges from 25 A up to 200 A. Compared to the previous IGBT4 chip generation, there is a higher power density, an increased switching frequency, and the cooling effort can be reduced. For example, the EconoPACK™ 2 FS150R12N2T7 can reach up to 37 kW in heavy duty. All in all, there is the same or better lifetime while keeping the operating conditions unchanged.

System simplification and reduced costs by highest power density and performance. The EconoDUAL™ 3 modules with the latest TRENCHSTOP™ IGBT7 chip generation extend the existing 1200 V IGBT4 portfolio with current ratings from 300 A to 900 A. The FF750R12ME7_B11 and FF900R12ME7_B11 feature an improved housing for handling higher currents and temperatures within the same footprint. FF300R12ME7_B11, FF450R12ME7_B11, and FF600R12ME7_B11 complete the portfolio towards lower current ratings. In combination with the TRENCHSTOP™ IGBT7 technology, they show a significant reduction of losses, a high level of controllability and switching softness, as well as high short-circuit capability. Together with the maximum operation temperature of 175°C at overload, high efficiency and power density are achieved, enabling system simplification and cost reduction.

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