Active and preferred
RoHS Compliant

5962R2020202VXC

Infineon's QML-V Certified 16Mb FAST Asynchronous SRAM with ECC for Radiation-Hardened Memory Solutions
Data Sheet
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5962R2020202VXC
5962R2020202VXC
Data Sheet

Product details

  • Density
    16 MBit
  • Device weight
    3878.7 mg
  • Family
    FAST SRAM
  • Interfaces
    Parallel
  • Operating Temperature
    -55 °C to 125 °C
  • Operating Voltage
    2.2 V to 3.6 V
  • Organization (X x Y)
    2M x8
  • Planned to be available until at least
    2033
  • Qualification
    Military
Recommended
OPN
Product Status active and preferred
Infineon Package
CG-FP-36
Package Name FLATPACK-36 (001-67583)
Packing Size 1
Packing Type CONTAINER
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
CG-FP-36
Package Name FLATPACK-36 (001-67583)
Packing Size 1
Packing Type CONTAINER
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Infineon’s 16Mb asynchronous SRAM family, designed with Infineon’s patented RADSTOPTM technology is ideal for space as well as other harsh environment applications. The 16Mb Fast SRAM is a high-performance, low power SRAM with ECC organized as 2-Mbit by 8-bits. For flight devices, order QML-V part number 5962R2020202VXC.

Features

  • 16 Mb density, 2M x 8
  • Embedded ECC for single-bit error correction
  • 10ns access times
  • 2.2 V to 3.6 V operating voltage range
  • –55°C to +125°C military temperature grade
  • 36-pin ceramic flat pack (CFP)
  • DLAM QML-V qualified SMD 5962-20202, 16Mb FAST async SRAM (2M x 8), (CYRS1069G30)
  • Radiation performance             
  • TID: 200 Krad              
  • SEL: > 60 MeV.cm2/mg  @ 95°C            
  • SEU: ≤ 1 x 10-10 upsets/bit-day
  • For flight devices, order QML-V part number 5962R2020202VXC

Benefits

  • Infineon’s radiation hardened memories are QML-V certified.
  • Meet the reliability and lifecycle demands of extreme environments.
  • Enhance overall system computing limits.
  • Provide Size, Weight, and Power (SWaP) benefits.
  • Greater design flexibility.

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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