Infineon advances GaN ease-of-use with integrated half-bridge solutions launching CoolGaN™ Drive HB 600 V G5

Market News

Feb 26, 2026

Munich, Germany – 26 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ portfolio with the CoolGaN Drive HB 600 V G5 product family. The four new devices – IGI60L1111B1M, IGI60L1414B1M, IGI60L2727B1M, and IGI60L5050B1M – integrate two 600 V GaN switches in a half-bridge configuration together with integrated high- and low-side gate drivers and a bootstrap diode, delivering a compact, thermally optimized power stage that further reduces design complexity. By bringing key functions into one optimized package, the family lowers external component count, eases PCB layout challenges typically associated with fast-switching GaN and helps designers shorten development cycles while achieving the core advantages of GaN technology: higher switching frequencies, lower switching and conduction losses, and greater power density.
 
“GaN is transforming power conversion, and Infineon’s mission is to maximize the transformation with scalable and easy-to-use solutions for customers,” says Johannes Schoiswohl, Head of GaN Business Line at Infineon. “With these new integrated solutions, we combine high-speed GaN performance with a level of integration and robustness that helps designers move faster, shrink their systems, and raise efficiency – pushing the boundaries of what’s possible in compact power electronics.”
 
Targeting low-power motor drive systems and switched-mode power supplies, the integrated half-bridge enables smaller magnetics and passive components, higher efficiency across operating conditions, and improved dynamic performance in space-constrained designs. Engineered for high-speed precision, the device achieves ultra-fast switching with a 98 ns propagation delay and minimal mismatch, supporting efficient high-frequency operation while maintaining predictable timing behavior. For simplified system integration, it offers a PWM input compatible with standard logic levels and operates from a single 12 V gate driver supply, while fast UVLO recovery helps ensure robust behavior during start-up and transient supply events. For superior thermal performance, the products are housed in a 6 x 8 mm² TFLGA-27 package with exposed pads, enabling efficient heat spreading and supporting heatsink-less designs in many applications.
 
These new solutions further reinforce Infineon’s strong position in the GaN market by combining proven CoolGaN device technology with system-level integration and deep power conversion know-how, enabling customers to adopt GaN more confidently and scale high-efficiency designs across industrial and consumer platforms. 

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About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

 

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The Infineon CoolGaN™ Drive HB 600 V G5 product family enables GaN ease-of-use with integrated half-bridge solutions.

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Michael Burner

Spokesperson Consumer, Compute and Communication, PSS Division

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