Notebook adapter applications

Product portfolio for notebook adapter

Package options for notebook adapter

The CoolMOS™ CE series has been widely chosen by leading OEMs in notebook adapters.

With ease-of-use, cost competitiveness and short lead time as well as corresponding reference designs, customers can easily design CoolMOS™ CE products in their adapters and have a faster time-to-market.

 Value proposition of 600V and 650V CoolMOS™ CE for adapters

• High efficiency exceeding values achieved with planar MOSFETs
• Good thermals, especially for high density, small form factor designs
• High breakdown voltage corridor - typically breakdown voltage by far exceeds specified max. value and is higher than typical MOSFETs from other vendors
• Easy-to-use product due to good controllability via gate resistor  

Active-mode efficiency versus AC line input voltage

EMI and efficiency/thermals need a careful trade-off in notebook adapters – better efficiency/thermals require faster switching, which leads to worse EMI, e.g., due to the oscillations triggered by a high dV/dt (di/dt). With a small adjustment this challenge can be overcome. We recommend our customers to optimize EMI when designing-in high voltage superjunction MOSFETs by:

> Adding additional drain-source capacitor CDS, e.g., 100pF

> Adjusting external R_G, e.g., 5Ω–30Ω

> Optimizing PCB layout for short path from controller to MOSFET gate and a small loop inductance

> Adjusting EMI filter (only if other measures are insufficient)

The figure shows a typical example of adjusting EMI. It has been done on a common 45W adapter from the market, using a planar MOSFET. Simply replacing the planar MOSFET with IPA60R800CE leads to a worse EMI performance. However, adding a 100pF CDS significantly improves the EMI while meeting other specifications such as efficiency, temperature, etc.

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Standard package used in chargers today

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500V/600V/650V/800V CoolMOS™ CE in TO-220 FullPAK

The DPAK solution has no concerns on the package height for semi-slim and slim adapter solutions, as its height is far below the allowed height, and it is on the other side of the package, meaning space saving and power density increasing, however better thermal management is required.

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500V/600V/650V/700V/800V CoolMOS™ CE in DPAK

Package for semi-slim adapter solution, where height is smaller compared to standard adapters. The legs of the TO-220 FullPAK Narrow Lead package have been modified with standoff height reduced from about 3.3mm to approximately 1.8mm such that the leads can be fully inserted into the PCB without any production concerns. As a result, MOSFET height is reduced while creepage distance is preserved.

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500V/600V/650V CoolMOS™ CE in TO-220 FullPAK Narrow Lead