XHP™ - Reach the next level of flexibility and scalability
XHP™ is the new flexible IGBT module platform for high-power applications. Ranging from 1.7 kV to 6.5 kV, the XHP™ presents an excellent solution for demanding applications like traction, CAV and medium-voltage drives. The module allows for scalable design with best-in-class reliability and highest power density.
The modules comes in two housings, XHP™ 2 and XHP™ 3. Both have the same dimensions, 140 mm in length, 100 mm in width and 40 mm in height. This gives product designers the opportunity to build homogenous solutions across different current and voltage ratings in order to implement optimized power converter concepts. A main focus in development of the new platform was to achieve the flexibility and reliability while assuring optimal integration into customer systems.
XHP™ 3 - Flexible high-power platform
Power modules have proven to be the driving force behind the rapid development in the area of power electronic systems technology, particularly in terms of energy savings, control dynamics, noise reduction as well as weight and volume reduction. Power semiconductors are primarily used to control the energy flow between energy generation and consumption. This is done extraordinary precisely and with exceptionally low losses. Continued progress in the performance of power semiconductors drives demand for corresponding improvements in packaging technology. Infineon has contributed to this evolution across more than two decades.
The new housing for high-power IGBT modules is designed to cover the full-voltage range of IGBT chips from 3.3 to 6.5 kV. One key innovation is its scalability, which will greatly simplify system design and manufacturing. Additionally, due to its robust architecture, the new high-power platform will provide long-term reliability in applications with demanding environmental conditions.