Smart induction cooktop – precise heating control
Semiconductor solutions for energy efficient and smart appliances with the highest safety standards
The induction cooktop is one of the advanced technological innovations used to cook food easily and efficiently using electromagnetic fields. Factors such as increasing safety awareness among consumers and rapid urbanization are expected to steadily increase the demand for induction cooktops in the coming years. Challenges for designers include the requirements for modern-looking equipment.
Wipe-clean, hermetically sealed surfaces and concerns about energy efficiency are high on the list of requirements. Because many electrical products are presented with clear energy efficiency ratings, many environmentally conscious consumers choose products based on this criterion alone. Induction cooking has many advantages over the alternatives. Compared to a gas cooktop, it is up to 40% more efficient and boils a liter of water much faster than using a gas cooktop.
A high level of safety is also ensured by the need for suitable cooking vessels, without which heat is not generated in the first place. Designers often face the problem of high field failure rates caused by grid disturbances, and the replacement and service costs for stoves are very high. On the other hand, the competitive nature of the market increases cost pressure and limits the use of protective features
Induction cooking system diagram
At Infineon, we are well equipped to help you overcome all the challenges common to induction cooking appliances. Our solutions target the increased consumer expectations regarding modern home appliances: Appliances must be energy-efficient and optimally integrable, ensuring a high level of safety and reliability. An intelligent, user-friendly, and secure user interface is important. We support you in creating intuitive devices with an intelligent touch interface (UI).
Our 32-bit Arm® Cortex® M0 microcontrollers of the PSoC® family use the advanced UI technology CapSense® Capacitive-Sensing UI and the MagSense™ Inductive-Sensing UI, to provide an advanced display with quick-access touch controls including personalized control, notification, and remote diagnostics. It enables automatic cooking zone adjustment, for different sized cookware. Easily connect to the smart home with our AIROC™ Wi-Fi & Combos portfolio with IEEE 802.11a/b/g/n/ac WLAN and Bluetooth.
For optimal integration and safety, we recommend the EiceDRIVER™ 25 V single-channel low-side non-inverting gate driver for IGBT in SOT-223 with best-in-class fault reporting accuracy. The high-frequency inverter is controlled by an IGBT device. In doing so, it simplifies the design while maintaining the highest power density and efficiency. The 650 V/ 1200 V/ 1350 V/ 1600 V Reverse Conducting IGBTs for voltage- and current-resonant inverters are optimized specifically for induction heating solutions. New connectivity features require dedicated hardware security. Our OPTIGA™ Trust family establishes secured communication to the cloud or other devices, secured storage, and secured firmware updates.
PSoC® microcontrollers (MCUs) bridge the gap between expensive, power-hungry application processors and low-power microcontrollers. The ultra-low-power PSoC® 6 MCU features an Arm® Cortex® M4 for high-performance AI/ML tasks such as _FP match algorithm, TFT LCD driver, voice recognition and motor control, and an Arm® Cortex® M0+ for low power tasks System control, BLE, and Caps. With built-in security, your IoT system is protected. The built-in Capsense technology allows you to easily implement robust touch control of buttons or displays.
Our AIROC™ Wi-Fi & Combos combos integrate IEEE 802.11a/b/g/n/ac WLAN and Bluetooth in a single-chip solution to enable small-form-factor IoT designs. Combo solutions are available for both 1x1 SISO with up to 433 Mbps PHY data rates and 2x2 MIMO with up to 867 Mbps PHY data rates. These solutions can be coupled with external MCUs from popular vendors or Linux on applications processors to implement a complete Wi-Fi + Bluetooth system.
Responding to a growing focus on embedded systems amongst attackers, Infineon offers OPTIGA™ Trust hardware security solutions based on a high-end security controller optimized for connected devices. It provides extremely flexible, high-performance, secured access to any major cloud provider.
Predictive maintenance enables a data-driven approach to predict and prevent device failures based on pattern recognition and intelligent software models. To collect the necessary data and enable monitoring of the condition of devices in a building, smart XENSIV™ sensors help to record the most crucial parameters of a device’s status.
Infineon combines the industry-leading performance of the TRENCHSTOP™ family with the innovative Reverse Conducting RC-H IGBT technology to create a new generation of best-in-class devices. With a monolithically integrated diode, the RC-H IGBTs are perfectly suited for soft switching application as inverterized microwave ovens.
Overcome ground-shift challenges in your design with Infineon's single-channel, non-isolated EiceDRIVER™ gate driver ICs, 1EDNx550x, that feature true differential inputs and guarantee high immunity against negative voltage undershoots and low dissipation. The 1EDNx550x gate driver ICs have true differential inputs. Their control signal inputs are largely independent of ground potential. Or use Infineon’s 1ED4417x EiceDRIVER™ 25-V single-channel low-side, non-isolated gate drivers with integrated over-current protection (OCP), fault reporting, and enable functionality in a 6-pin PG-SOT23 package. The 1ED4417x family realizes best-in-class and fast fault reporting accuracy with OCP threshold tolerance of +/-5%.
We offer an industry-leading portfolio of level-shift gate driver ICs for 500 V to 700 V applications requiring functional isolation. Available in level-shift functional Junction Isolation and in Infineon’s unique Silicon on Insulator (SOI) technology with the SOI devices offering integrated Bootstrap Diodes (BSD) for a reduced BOM and system-level cost. The SOI devices also provide industry-leading negative VS robustness for long-term reliability and fast time to market.
The Infineon SOI-based solutions also support high frequency for applications with above 100 kHz switching frequency due to the 50% lower level shift losses when compared to typical junction isolated devices.
Infineon's latest generation of fixed frequency CoolSET™ AC-DC integrated power stages with quasi-resonant switching scheme offers increased robustness and excellent performance. Infineon's fixed frequency CoolSET™ offers higher efficiency and lower switching frequency at medium and light loads, enabled by an integrated frequency step-down.
In our full-spectrum portfolio of IGBT, you can find cost-optimized solutions engineered for high performance, such as the RC-H5 IGBT family. Our products also operate under high EMC disturbances and surge conditions, and enable high power operation with a high system-efficiency due to low VCEsat, VF, Eoff, and Rth.
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This training introduces RC-H6 650 V Reverse Conducting IGBT technology for half-bridge induction cooking.
By the end of this webinar, attendees will learn:
- Understand how Infineon responds to the trends in the small home appliances market
- Get an overview of different solution offerings for brushless DC and permanent magnet motors, e.g. discrete vs. integrated power solutions
- Learn how to use integrated motor control in order to get the motor running in less than one hour