ToF 3D image sensors

Sensing the world in 3D with REAL3™ Time-of-Flight image sensors

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About

Time-of-flight (ToF) 3D image sensors

REAL3™ is Infineon's 3D product family, consisting of highly integrated Time-of-Flight (ToF) image sensors and optimized laser driver ICs. The single-chip imagers are sunlight-robust, highly scalable, and ready for integration into a wide range of consumer, automotive, and industrial applications. Together with the highly integrated driver ICs for VCSEL illumination, they form an optimized bundle for the smallest ToF camera module designs.

Discover ToF sensors for consumer
Discover ToF sensors for automotive and industrial
Discover complementary VCSEL driver ICs
How do REAL3™ Time-of-Flight 3D image sensors work?

The ToF camera module projects modulated infrared light onto an object, user, or scene of interest. The reflected light is captured by the ToF imager, which measures the amplitude and phase difference for each pixel. This raw data is then processed by an external application processor, resulting in a highly reliable distance image, as well as a grayscale picture of the entire scene.

ToF 3D working principle infographic
REAL3™ ToF benefits for the application

Why Time-of-Flight:
Robust, measured 3D depth data with high resolution under all lighting conditions!

  • Depth data is measured, neither calculated nor estimated, as in 2D AI or 2D stereo camera solutions.
  • Works under all light conditions, from darkness to strong direct sunlight, night view including depth and gray value picture.
  • Depth data includes confidence data to guarantee data integrity.
  • Small form factor, mechanically stable solution, lifetime calibration, no risk of losing calibration over lifetime.
  • Low computational load on system processor.

Why REAL3™ ToF from Infineon:
Highly optimized, flexible, best-in-class performance, and volume-proven!

  • Comprehensive iToF product portfolio: from automotive-grade, ASIL-B level packaged VGA imager to HQVGA imager as bare die for consumer applications, and low-cost laser driver ICs for optimized camera module bills of materials (BOM).
  • Volume-proven in automotive, robotics, smartphone, XR, and other consumer and industrial applications.
  • High flexibility: integrated controller and freely programmable modulation frequencies and operation modes, such as HDR mode with multiple modulation frequencies, code-based modulation, control of multiple illumination sources, camera synchronization, and multi-camera operation.
  • Best sunlight robustness: patented Suppression of Backlight Illumination (SBI) circuitry in every pixel.
  • Fast time-to-market: a mutually complementary, fully integrated offering from Infineon and pmdtechnologies, coupled with a strong partner network spanning the entire design and production ecosystem.

Time-of-flight (ToF) 3D image sensors

REAL3™ is Infineon's 3D product family, consisting of highly integrated Time-of-Flight (ToF) image sensors and optimized laser driver ICs. The single-chip imagers are sunlight-robust, highly scalable, and ready for integration into a wide range of consumer, automotive, and industrial applications. Together with the highly integrated driver ICs for VCSEL illumination, they form an optimized bundle for the smallest ToF camera module designs.

Discover ToF sensors for consumer
Discover ToF sensors for automotive and industrial
Discover complementary VCSEL driver ICs

How do REAL3™ Time-of-Flight 3D image sensors work?

The ToF camera module projects modulated infrared light onto an object, user, or scene of interest. The reflected light is captured by the ToF imager, which measures the amplitude and phase difference for each pixel. This raw data is then processed by an external application processor, resulting in a highly reliable distance image, as well as a grayscale picture of the entire scene.

ToF 3D working principle infographic

REAL3™ ToF benefits for the application

Why Time-of-Flight:
Robust, measured 3D depth data with high resolution under all lighting conditions!

  • Depth data is measured, neither calculated nor estimated, as in 2D AI or 2D stereo camera solutions.
  • Works under all light conditions, from darkness to strong direct sunlight, night view including depth and gray value picture.
  • Depth data includes confidence data to guarantee data integrity.
  • Small form factor, mechanically stable solution, lifetime calibration, no risk of losing calibration over lifetime.
  • Low computational load on system processor.

Why REAL3™ ToF from Infineon:
Highly optimized, flexible, best-in-class performance, and volume-proven!

  • Comprehensive iToF product portfolio: from automotive-grade, ASIL-B level packaged VGA imager to HQVGA imager as bare die for consumer applications, and low-cost laser driver ICs for optimized camera module bills of materials (BOM).
  • Volume-proven in automotive, robotics, smartphone, XR, and other consumer and industrial applications.
  • High flexibility: integrated controller and freely programmable modulation frequencies and operation modes, such as HDR mode with multiple modulation frequencies, code-based modulation, control of multiple illumination sources, camera synchronization, and multi-camera operation.
  • Best sunlight robustness: patented Suppression of Backlight Illumination (SBI) circuitry in every pixel.
  • Fast time-to-market: a mutually complementary, fully integrated offering from Infineon and pmdtechnologies, coupled with a strong partner network spanning the entire design and production ecosystem.

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