Active and preferred
RoHS Compliant

IQDH88N06LM5CG

OptiMOS™ power MOSFETs 60 V in PQFN 5x6 mm2 Source-Down package with industry leading RDS(on) .
Data Sheet
ea.
in stock

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IQDH88N06LM5CG
IQDH88N06LM5CG
ea.
Data Sheet

Product details

  • Budgetary Price €/1k
    1.77
  • ID (@25°C) max
    447 A
  • IDpuls max
    1788 A
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    PQFN 5x6 Source-Down
  • Polarity
    N
  • QG (typ @4.5V)
    76 nC
  • QG (typ @10V)
    152 nC
  • RDS (on) (@10V) max
    0.86 mΩ
  • RDS (on) (@4.5V) max
    1.24 mΩ
  • Special Features
    Center-Gate
  • VDS max
    60 V
  • VGS(th)
    1.7 V
Recommended
OPN
IQDH88N06LM5CGATMA1
Product Status active and preferred
Infineon Package PG-TTFN-9
Package Name PQFN 5x6 Source-Down
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package PG-TTFN-9
Package Name PQFN 5x6 Source-Down
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The power MOSFET IQDH88N06LM5CG 60 V comes in a PQFN 5x6 mm2 Source-Down package. The part offers the industry’s lowest RDS(ON) of 0.88 mΩ combined with outstanding thermal performance for easy power loss management. This enables higher system efficiency and power density for a large variety of end applications like class-D audio, high-power chargers, SMPS, telecom, and intermediate bus conversion in high-performance computing, like hyper-scale datacenters and AI-server farms.

Features

  • OptiMOS™ 60 V with outstanding FOMs
  • Source-Down package with thermal
  • Source-Down with maximized chip ratio
  • Source-Down in Center-Gate footprint

Benefits

  • Minimized conduction losses
  • Reduced voltage overshoot
  • Increased maximum current capability
  • Fast switching
  • Less device paralleling required
  • Center-Gate for optimal parallelization
  • Low RDS(on) on 5x6 mm² PCB
  • Enhanced thermal management
  • Minimal parasitics, optimal switching
  • Industry standard package

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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