Active and preferred
RoHS Compliant
Lead-free

CY15B204QSN-108SXET

4Mb 3.0V Automotive-E 108MHz QSPI EXCELON™ F-RAM in 8-pin SOIC

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CY15B204QSN-108SXET
CY15B204QSN-108SXET

Product details

  • Density
    4 MBit
  • Family
    EXCELON™
  • Frequency
    108 MHz
  • Interfaces
    QSPI
  • Lead Ball Finish
    Pure Sn
  • Operating Temperature range
    -40 °C to 125 °C
  • Operating Voltage range
    1.8 V to 3.6 V
  • Organization (X x Y)
    512Kb x 8
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2033
  • Qualification
    Automotive(E)
OPN
CY15B204QSN108SXETXUMA1
Product Status active and preferred
Infineon Package
Package Name SOIC-8 (001-85261)
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
Package Name SOIC-8 (001-85261)
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The CY15B204QSN-108SXET is a 4 Mb EXCELON™ Auto Ferroelectric RAM (F-RAM) with a 512K × 8 organization and high-speed Quad SPI interface supporting up to 108 MHz SDR and 54 MHz DDR. It delivers 10^13 endurance cycles, 121-year data retention at 85°C, and instant non-volatile writes at bus speed. Operating from 1.8 V to 3.6 V across -40°C to +125°C, it integrates ECC, CRC, and advanced data protection.

Features

  • 4 Mb ferroelectric RAM, 512K × 8
  • 10^13 read/write cycle endurance
  • 121-year data retention
  • Quad, Dual, Extended, Single SPI support
  • Up to 108 MHz SPI SDR, 54 MHz SPI DDR
  • Execute-in-place (XIP) read/write
  • Hardware write protect, software block
  • Embedded ECC and CRC for data integrity
  • Unique device ID, programmable serial number
  • 256-byte special sector, reflow tolerant
  • Low-power: 15 mA active, 0.1 µA hibernate
  • JEDEC-compliant I/O voltage and leakage

Benefits

  • Eliminates write delays, instant
  • No wear-out, supports frequent data logging
  • Reliable data retention for 121 years
  • Flexible SPI interface for easy integration
  • High-speed operation for fast access
  • No polling needed, seamless XIP operation
  • Robust data protection, prevents accidental
  • ECC/CRC ensure data reliability and error
  • Device traceability with unique IDs
  • Special sector survives reflow soldering
  • Low power reduces system energy use
  • JEDEC I/O levels ensure compatibility

Applications

Documents

Design resources

Developer community

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