SLE 97

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Highest performance for your NFC secure element and SIM card

The SLE 97 SOLID FLASH™ family is Infineon’s state-of-the-art 32-bit product generation designed specifically for high-performance security chip cards. It comes in various form factors to suit all high-end and embedded applications from SIM/UICC secure elements to microSD secure elements.


> SLE 97 security controllers for USB tokens


Product Product Description Leading Technologies Applications Interfaces NVM / 凌捷掩膜 RAM Asymmetric Cryptography Symmetric Cryptography Certifications Delivery Forms
Matching Results: 16
descending ascending descending ascending descending ascending descending ascending descending ascending descending ascending descending ascending descending ascending descending ascending descending ascending descending ascending
SLE 97CSFX1M00PE   Security cryptocontroller
SOLID FLASH™
Authentication
ISO 7816
SPI
1.0 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
SMD
Wafer sawn
SLE 97CIFX1M00PE   Security cryptocontroller
SOLID FLASH™
Authentication
I2C
ISO 7816
1.0 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
SMD
Wafer sawn
SLE 97CNFX8000PE   32-bit SWP SIM-card security cryptocontroller
NFC optimized
SOLID FLASH™
Mobile communication
SWP SIM/UICC (NFC)
ISO 7816
Mifare compatible
SWP
800.0 kByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
FCOS™ module
SMD
VQFN-8
Wafer sawn
Wirebond module
SLE 97CNFX1M00PE   32-bit SWP SIM-card security cryptocontroller
NFC optimized
SOLID FLASH™
Mobile communication
SWP SIM/UICC (NFC)
Payment
ISO 7816
Mifare compatible
SWP
1.0 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
FCOS™ module
SMD
VQFN-8
Wafer sawn
Wirebond module
SLE 97CNFX1M30PE   32-bit SWP SIM-card security cryptocontroller
NFC optimized
SOLID FLASH™
Mobile communication
SWP SIM/UICC (NFC)
ISO 7816
Mifare compatible
SWP
1.3 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
FCOS™ module
SMD
VQFN-32
Wafer sawn
Wirebond module
SLE 97CNFX1M50PE   32-bit SWP SIM-card security cryptocontroller
NFC optimized
SOLID FLASH™
Mobile communication
SWP SIM/UICC (NFC)
ISO 7816
Mifare compatible
SWP
1.5 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
FCOS™ module
SMD
VQFN-32
Wafer sawn
Wirebond module
SLE 97CUNFX8000PE   32-bit USB and SWP SIM-card security cryptocontroller
SOLID FLASH™
Mobile communication
USB SIM/UICC
ISO 7816
Mifare compatible
SWP
USB
800.0 kByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
FCOS™ module
SMD
VQFN-8
Wafer sawn
Wirebond module
SLE 97CUNFX1M00PE   32-bit USB and SWP SIM-card security cryptocontroller
SOLID FLASH™
Mobile communication
USB SIM/UICC
ISO 7816
Mifare compatible
SWP
USB
1.0 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
FCOS™ module
SMD
VQFN-8
Wafer sawn
Wirebond module
SLE 97CUNFX1M30PE   32-bit USB and SWP SIM-card security cryptocontroller
SOLID FLASH™
Mobile communication
USB SIM/UICC
ISO 7816
Mifare compatible
SWP
USB
1.3 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
FCOS™ module
S-MFC5.4
S-MFC5.6
S-MFC5.8-8-1
Wafer sawn
Wirebond module
SLE 97CUNFX1M50PE   32-bit USB and SWP SIM-card security cryptocontroller
SOLID FLASH™
Mobile communication
USB SIM/UICC
ISO 7816
Mifare compatible
SWP
USB
1.5 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
FCOS™ module
S-MFC5.4
S-MFC5.6
S-MFC5.8-8-1
Wafer sawn
Wirebond module
SLE 97CSNFX1M04PE   32-bit SWP security cryptocontroller for embedded secure element
NFC optimized
SOLID FLASH™
eSE (embedded secure element)
NFC
Payment
GPIOs
ISO 7816
Mifare compatible
SPI
SWP
1.0 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
SMD
Wafer sawn
SLE 97CSNFX1M34PE   32-bit SWP security cryptocontroller for embedded secure element
NFC optimized
SOLID FLASH™
eSE (embedded secure element)
NFC
Payment
GPIOs
ISO 7816
Mifare compatible
SPI
SWP
1.3 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
SMD
Wafer sawn
SLE 97CSNFX1M54PE   32-bit SWP security cryptocontroller for embedded secure element
NFC optimized
SOLID FLASH™
eSE (embedded secure element)
NFC
Payment
GPIOs
ISO 7816
Mifare compatible
SPI
SWP
1.5 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 2048-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
Wafer sawn
SLE 97CNFX1M34PE   32-bit SWP security cryptocontroller for embedded secure element
NFC optimized
SOLID FLASH™
eSE (embedded secure element)
NFC
Payment
ISO 7816
Mifare compatible
SWP
1.3 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 2048-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
Wafer sawn
SLE 97CNFX1M54PE   32-bit SWP security cryptocontroller for embedded secure element
NFC optimized
SOLID FLASH™
eSE (embedded secure element)
NFC
Payment
ISO 7816
Mifare compatible
SWP
1.5 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 2048-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
Wafer sawn
SLE 97CNFX1M04PE   32-bit SWP security cryptocontroller for embedded secure element
NFC optimized
SOLID FLASH™
eSE (embedded secure element)
NFC
Payment
ISO 7816
Mifare compatible
SWP
1.0 MByte
32.0 kByte
ECC up to 521-bit
RSA up to 4096-bit
AES up to 256-bit
DES, 3DES
CC EAL5+ high
EMVCo
CSP
SMD
Wafer sawn

Impressive feature lineup for your embedded secure elements

 25% more performance than standard SC300™ products  SLE 97 products are the first generation to benefit from the collaboration between Infineon and ARM aimed at enhancing the performance of chip card and security controllers. They implement a unique 32-bit CPU based on the ARM® SecurCore™ SC300™ controller and enhanced by Infineon’s cache and security technologies.
 SWP secure element  Since 2007, the Single Wire Protocol (SWP) interface is the standard connection between UICC/SIM devices and the ContactLess Frontend (CLF) modem within NFC-enabled mobile devices. The SLE 97 SOLID FLASH™ family comes with in-built support for the SWP interface.
 Enabling smallest SIM and embedded form factors  With an optimized footprint, SLE 97 products enable the smallest SIM form factors such as 3FF and 4FF thanks to Infineon’s FlipChip technology (FCOS™). They are also available in a wafer-level package for embedded solutions with a minimal footprint.

 1.5 MB storage for your NFC SIM/UICC applications or your NFC secure element

Thanks to the code density offered by the ARM® architecture, SLE 97 provides way more than 1 MB for NFC applications, thus supporting widespread deployment of NFC in the market over time.

At a glance 

  • ARM® SecurCore ® SC300™ enhanced by Infineon’s cache and security technologies
  • Up to 1.5 MB SOLID FLASH™, allowing fast prototyping and short time-to-market
  • Single Wire Protocol (SWP) and ISO 7816 interface, providing the best fit for embedded secure element requirements
  • Very high endurance NVM (500K) for best quality products
  • Compliance with the CIPURSE™ open standard
  • SPI Interface for additional flexibility
  • Certified to security level CC EAL5+ high and EMVCo – a key requirement for secure NFC transactions

 

Applications

  • NFC SIM/UICC
  • Embedded SIM with NFC support
  • USB SIM cards with NFC support
  • CIPURSE™ mobile

Product Selection Guide

Title Size Date Version
2.1 MB 03 Nov 2015 11_15

Product Brief

Title Size Date Version
570 KB 16 Dec 2014 08_14
250 KB 19 May 2015 05_15
238 KB 27 Nov 2014 09_14

Whitepaper

Title Size Date Version
1.4 MB 13 Feb 2015 01_15
1.7 MB 17 Apr 2012 04_12
2.8 MB 07 Jan 2015 08_14

Application Brochure

Title Size Date Version
1.5 MB 18 Feb 2016 02_16
235 KB 08 Nov 2012 11_12

Contactless payment using smart wearables

 

Presenting Infineon’s breakthrough Boosted NFC Secure Element in innovative smart wearable devices. Infineon’s Boosted NFC Secure Element is an all-in-one solution for secure NFC payments. Combining ultra-low power consumption and an ultra-small PCB footprint with extraordinary contactless performance, it is the perfect fit for today’s smart wearable devices.

 
Length 3:07

 

Infineon's Secure NFC Solutions - Building Trust in the Mobile World

 

The video shows the benefits our products have to offer for typical NFC applications like Mobile Payment, Access Management, etc. Learn more about our unique and complete portfolio of NFC Secure Elements which support every approach to bring NFC into mobile devices.

 
Length 3:07

 

NFC raises the bar for security, performance and convenience

 

NFC-enabled handsets enhance the mobile customer experience by enabling information exchange and smart applications. Applications such as NFC Mobile Payment utilize information that users want to keep private. Personal data and financial transactions must then be protected by the usage of NFC Secure Elements utilizing robust security concept similar to the security levels provided by certified credit cards. Infineon Technologies which has been active as an innovation leader in the secure chip card IC (integrated circuit) market for more than two decades, supports the NFC ecosystem with distinct security offerings that meet the requirements for the different NFC platforms in the market.

 
Length 3:27

 

Protecting mobile devices from compromise and malware | Steve Hanna

 

Mobile security threats are on the rise. Mobile malware such as malicious apps can endanger confidential information like personal data and even cause severe financial damage. Hardware security provides strong protection for keys and allows reliable prevention or detection of changes made to the device.

 

Watch this video to see why hardware-based security solutions are a reliable tool for protecting against mobile security threats.

 
Length 3:59

 

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