Course descriptions for track 3

Attend one of the technical sessions to learn more about the next innovative technologies and solutions.

 

Field Oriented Control (FOC) of Permanent Magnet Synchronous Motors (PMSM)

Time: 9:00AM - 10:00AM

Back by popular demand… Our Field Oriented Control (FOC) motor control introduction.  This year’s twist... Sensors! 
We will start with an introduction to the theory behind FOC, how it works and what kinds of calculations are needed to perform it.  We will follow this up with a look at how resolvers are used in FOC systems and how magnetic sensor technology is providing attractive alternatives.

Mike Copeland is a Principal Engineer for Industrial Microcontrollers and Motor Control Systems.  He manages the digital SAEs in the Infineon Americas ATV CEMA team.  One of his focus applications is motor control.  Mike joined Infineon in 1997 and has BS and MS in Electrical Engineering from Michigan State University with a focus on motor control.   Mike currently lives in Beaverton, Oregon with his wife Trisha and son David.

Bob Valascho has been with Infineon Technologies since mid-2011.  He has 14 years experience in automotive and industrial embedded systems applications.  At Infineon, he has had roles in Application Engineering related to power electronics and microcontroller applications.  His focus has been related to support for real-time control and systems, such as Switch Mode Power Supplies and Motor Control topics.  His current role is Senior Staff Application Engineer, supporting the Aurix family of microcontrollers.  He has a Bachelor’s degree in Computer Engineering/Electrical Engineering from Michigan State University, and an MBA from Wayne State University.

Frank Aiello is a System Application Engineer in the Body Systems group at Infineon. He joined Infineon in 2006, and has over 29 years experience in automotive and embedded systems applications in OEM, Tier1 and semiconductor supplier roles.  At Infineon, his current focus is on power electronics and motor control applications.  He has a BSEE from Michigan Tech, and MSEE from the University of Michigan.

Wafer manufacturing and failure analysis complexity for microcontrollers

Time: 10:30AM - 11:45AM

New market trends and applications will steeply increase the demand for microcontrollers. 
Wafer manufacturing for a Microcontroller is a very complex process. Avoiding and finding defects is even more challenging. This training will cover:

  • An overview of the wafer fabrication process
  • Defect density reduction strategies
  • Electrical verification and Failure Analysis steps

Attendees will learn:

  • The steps how a Microcontroller chip is manufactured and analyzed
  • Limitations due to security
  • How you can help to get quicker resolution for failing devices

Customer Quality Manager, Automotive Americas
Location: Livonia

Professional career path:
Project Management – Custom Control Systems and Mechanical Systems
Product Engineer – Automotive Body Electronics
Supplier Quality Manager – Semiconductors – Tier 1 Automotive (18 years)

Current:
ATV Customer Quality Manager - Americas region (complaint management / customer approval process)
Microcontroller Specialist – Customer Quality Manager – Americas region

Senior Manager Strategic QM Projects, Frontend Quality
Location: Germany Dresden

Professional career path:
Technology and Product Reliability Engineering (Infineon/Qimonda and GlobalFoundries)
Head of Global Customer Return Management (Qimonda)
Cooperate Project Manager 28nm (GlobalFoundries)
Back Office for Technology Transfers (Infineon)

Current:
Frontend Cluster Quality Projects
Overall Project Manager “Defect Density – Take the next stage”

Yet another network protocol: What CAN-XL could mean for the future

Time: 2:00PM - 3:15PM

Give an engineer a data bus and he will ask for more payload and higher data rates. Somehow or other, CAN-XL was initiated to close the gap from CAN(-FD) to Ethernet regarding payload and data rate and to use the cost efficiency and confidence into CAN technology.

In this talk, you will learn about the flexibility of CAN-XL as well as the physical and protocol layer. The talk will also address the compatibility and difference to 10BaseT1 Ethernet and the progress of the development of the corresponding standards.

Tobias started his carreer as a research engineer in the field of advanced HMI concepts and function development. After changing to a major Tier-1, he was responsible for representing the technical interests in international standardization  committees, focusing on e.g. signal improvement for CAN-FD and data commuinication for AD functions.
Within Infineon, he is now working as Application Engineer for automotive networking.
Tobias holds a PhD in Media Informatics.

Si, SiC, and GaN - the story continues

Time: 2:00PM - 3:15PM 

Beside the well-established and high performing Silicon based devices, the new technologies SiC and GaN boost performance in power conversion applications of automotive applications and allow for higher efficiency and power density designs. We will introduce the benefits of SiC and GaN in EV electric vehicle traction drives inverters, Onboard-charger and High-Voltage DCDC,  and how these devices will help to optimize the applications and increase EV vehicle range and performance.

This year’s presentation continues the story by confirming the benefits - such as the efficiency increase -  showing the results of our own hardware based tests latest products released now or soon. Additionally we will share more detailed information about new product releases and an overview about upcoming application hardware support for evaluation.

Mr. Christian Schweikert is Senior Staff Engineer for Automotive Silicon Carbide at Infineon Technologies AG. Mr. Schweikert has completed in 1997 the University of Applied Sciences / Fachhochschule Karlsruhe in Germany with the degree Diploma Engineer [FH] for Sensor Systems Technologies.  Since 1999 he is employed at Infineon Technologies AG in Munich/Germany. He held various positions as Marketing Manager and Application Engineer for automotive sensors, mixed-Signal-, and power semiconductors for Automotive applications. Since 2016 he is Application Engineer for Silicon Carbide based High Power Products for Automotive Applications.

Oleg Vodyakho received the Dr.-Ing. degree in electrical engineering from the University (FernUniversität) of Hagen, Germany, in 2007. He was with Nokian Capacitors (an Alstom Company), John Deere and Eaton Corporation as a Research/Development Engineer. He is now with Infineon Technologies Americas Corp with Powertrain/Electric Drive Train group as an xEV system application engineer. His current interests include application and control of high power inverters and electric traction drives, power electronics system control and power quality issues.

Design techniques in DCDC Converters - designing with EMC in mind

Time: 3:30PM - 4:45PM

Linked to the increasing demand off computation power, the amount of DCDC converters is rapidly growing. In addition, many former LDO based solutions are replaced by DCDC in order to achieve a better overall efficiency. The fast switching current and voltage transients shall not disturb the reception of Radio TV and Data-communication. Therefore, EMC emission limits need to be fulfilled.

This tutorial will explain:

  • DCDC Converter Emission-source based on the step-down (BUCK) Converter
  • Placement rules for mandatory Filter elements
  • PCB-Layout Rules and examples
  • Single- or multistage Input-filter?
  • Easy setup approach for input Pi-Filter
  • How to adjust the input Pi-Filter based on 1st measurement results
  • Pi-Filter PCB-Layout hints

Stephan Cordes is part of the EMC department located at the Infineon Headquarter in Munich. He is responsible for the EMC of all fast switching power applications with focus on DCDC converters. Stephan has been with Infineon for 19 years and has his Ph.D. in electrical engineering for power electronics.