OptiMOS™ quad-phase power modules 280 A in 10x9x5 mm package

Reducing the TCO of Generative AI data centers

Data centers are experiencing unprecedented growth  primarily driven by increased investments in artificial intelligence (AI). Data centers are currently responsible for more than two percent of global energy consumption. Fueled by AI, the power demands within data centers are expected to grow by 165% between 2023 and 2030. Continually improving the efficiency and power densities of power conversion from grid-to-core is vital to enable further advancements in compute performance while reducing total cost of ownership (TCO).

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Life Cycle Assessment – 2nd stage solutions

As the AI power demand continues to grow, so does the need for sustainable and energy-efficient solutions. At Infineon, we're committed to reducing our environmental footprint and helping our customers do the same.

That's why we conducted a life cycle assessment (LCA) to compare the environmental impact of two different voltage regulator solutions in AI servers: a backside-mounted voltage regulator module (VRM) and a discrete solution laterally mounted next to the processor.

Both solutions power the second stage of an AI server, delivering power to the processor and GPU. We compared these solutions over their entire life cycle, from raw materials and manufacturing to transportation, use phase, and end of life.

Power modules portfolio overview

OptiMOS™ TDM2454xx quad-phase power modules 280 A target high-performance AI data centers. These modules enable true vertical power delivery (VPD) and offer industry's best power density of 2.0A/mm2. TDM2454xx modules combine Infineon's robust OptiMOS™ 6 trench technology, a chip-embedded package with enhanced electrical and thermal efficiencies, and a new inductor technology to enable lower profile and therefore, true vertical power delivery. Additionally, the TDM2454xx has a footprint conducive to VPD systems enabling module tiling and improving current flow.

Key features:

  • Industry-leading power density: 10x9x5 mm for 280 A peak
  • Industry first quad-phase power module option with integrated embedded capacitors available in 10x9x5mm package
  • >2.0 A/mm2 TDC (thermally managed)*
  • First module optimized for VPD with a footprint designed for optimal for tiling arrays of modules
  • Proprietary magnetics enable low-profile vertical power delivery in compact footprint 

*Coldplate temperatures 80°C and below

Download product brief

Download product brief

This is the second generation of DC-DC power modules: OptiMOS™ TDM2354xD and TDM2354xT dual-phase power modules 160 A, geared for vertical power delivery (VPD) and showcasing high current density, benchmark electrical and thermal efficiencies.

Key features:

  • Industry-leading power density: 8x8x4 mm for 160A peak for non-TLVR option
  • Industry first dual-phase TLVR power module option available in 8x8x5mm package with 160A peak capability
  • >1.5 A/mm2 TDC (thermally managed)*
  • Over 3x reduction in junction-to-board thermal impedance enabled by Infineon chip-embedded packaging vs previous generation
  • Proprietary magnetics enable low-profile vertical power delivery in compact footprint

*Coldplate temperatures 80°C and below

Download product brief

Download product brief

This is the first generation of DC-DC power modules: OptiMOS™ TDM22545D and TDM22544D dual-phase power modules 140 A. They co-package two smart power stages, two power inductors and decoupling capacitors to implement two independent synchronous buck converters into a small package.

Key features:

  • Industry-leading power density: 10x9x5 and 10x9x8 mm for 140 A peak
  • High power density solution (>1A/mm2)
  • Simpler construction for high-volume manufacturing
  • Improved thermal management and system efficiency
  • Improved signal integrity

Download data sheets

Download data sheets

OptiMOS™ TDM2454xx quad-phase power modules 280 A target high-performance AI data centers. These modules enable true vertical power delivery (VPD) and offer industry's best power density of 2.0A/mm2. TDM2454xx modules combine Infineon's robust OptiMOS™ 6 trench technology, a chip-embedded package with enhanced electrical and thermal efficiencies, and a new inductor technology to enable lower profile and therefore, true vertical power delivery. Additionally, the TDM2454xx has a footprint conducive to VPD systems enabling module tiling and improving current flow.

Key features:

  • Industry-leading power density: 10x9x5 mm for 280 A peak
  • Industry first quad-phase power module option with integrated embedded capacitors available in 10x9x5mm package
  • >2.0 A/mm2 TDC (thermally managed)*
  • First module optimized for VPD with a footprint designed for optimal for tiling arrays of modules
  • Proprietary magnetics enable low-profile vertical power delivery in compact footprint 

*Coldplate temperatures 80°C and below

Download product brief

Download product brief

This is the second generation of DC-DC power modules: OptiMOS™ TDM2354xD and TDM2354xT dual-phase power modules 160 A, geared for vertical power delivery (VPD) and showcasing high current density, benchmark electrical and thermal efficiencies.

Key features:

  • Industry-leading power density: 8x8x4 mm for 160A peak for non-TLVR option
  • Industry first dual-phase TLVR power module option available in 8x8x5mm package with 160A peak capability
  • >1.5 A/mm2 TDC (thermally managed)*
  • Over 3x reduction in junction-to-board thermal impedance enabled by Infineon chip-embedded packaging vs previous generation
  • Proprietary magnetics enable low-profile vertical power delivery in compact footprint

*Coldplate temperatures 80°C and below

Download product brief

Download product brief

This is the first generation of DC-DC power modules: OptiMOS™ TDM22545D and TDM22544D dual-phase power modules 140 A. They co-package two smart power stages, two power inductors and decoupling capacitors to implement two independent synchronous buck converters into a small package.

Key features:

  • Industry-leading power density: 10x9x5 and 10x9x8 mm for 140 A peak
  • High power density solution (>1A/mm2)
  • Simpler construction for high-volume manufacturing
  • Improved thermal management and system efficiency
  • Improved signal integrity

Download data sheets

Download data sheets