Discover the future of e-mobility with Infineon's HybridPACK™ Drive G2 Fusion

Infineon Technologies AG is proud to introduce the groundbreaking HybridPACK™ Drive G2 Fusion, a revolutionary power module designed to push the boundaries of electric mobility. By merging silicon and silicon carbide (SiC) technologies, Infineon sets a new standard for traction inverters in the e-mobility sector, combining affordability with high performance and efficiency.

The HybridPACK™ Drive G2 Fusion: A technological breakthrough

The HybridPACKTM Drive G2 Fusion represents a monumental leap in power module technology for electric vehicles. This innovative module incorporates Infineon’s advanced silicon and SiC technologies, striking an optimal balance between performance and cost-efficiency. This provides system suppliers with the flexibility to optimize inverters without compromising on quality or increasing system costs.

Key Advantages of HybridPACK™ Drive G2 Fusion:

  • Enhanced efficiency: SiC technology in the module offers higher thermal conductivity, breakdown voltage, and switching speed, significantly boosting efficiency while reducing overall system costs.
  • Cost-effective solution: By utilizing a hybrid composition of 30% SiC and 70% silicon, the module achieves nearly the same system efficiency as a full SiC solution but at a fraction of the cost.
  • Plug 'n' Play convenience: Designed for easy integration, this module can be swiftly incorporated into existing vehicle systems without requiring extensive modifications.

Expert insights

negar-soufi-amlashi

Negar Soufi Amlashi

“Our new HybridPACK™ Drive G2 Fusion module underlines Infineon’s innovation leadership in the automotive semiconductor industry,” said Negar Soufi-Amlashi, Senior Vice President & General Manager High Voltage at Infineon's Automotive division. "Addressing the demand for greater e-mobility range, this technological breakthrough smartly combines silicon carbide and silicon. Integrated in a well-introduced module package footprint, it offers a compelling cost-performance ratio over pure silicon carbide modules without adding system complexity for automotive system suppliers and vehicle manufacturers."
negar-soufi-amlashi

Negar Soufi Amlashi

“Our new HybridPACK™ Drive G2 Fusion module underlines Infineon’s innovation leadership in the automotive semiconductor industry,” said Negar Soufi-Amlashi, Senior Vice President & General Manager High Voltage at Infineon's Automotive division. "Addressing the demand for greater e-mobility range, this technological breakthrough smartly combines silicon carbide and silicon. Integrated in a well-introduced module package footprint, it offers a compelling cost-performance ratio over pure silicon carbide modules without adding system complexity for automotive system suppliers and vehicle manufacturers."
negar-soufi-amlashi

Negar Soufi Amlashi

“Our new HybridPACK™ Drive G2 Fusion module underlines Infineon’s innovation leadership in the automotive semiconductor industry,” said Negar Soufi-Amlashi, Senior Vice President & General Manager High Voltage at Infineon's Automotive division. "Addressing the demand for greater e-mobility range, this technological breakthrough smartly combines silicon carbide and silicon. Integrated in a well-introduced module package footprint, it offers a compelling cost-performance ratio over pure silicon carbide modules without adding system complexity for automotive system suppliers and vehicle manufacturers."

Versatility and robustness

The HybridPACKTM Drive G2 Fusion module is an integral part of Infineon's HybridPACKTM Drive power module portfolio. It features up to 220 kW in the 750 V class and ensures high reliability across a wide temperature range from -40 °C to +175 °C. With improved thermal conductivity and the unique properties of Infineon's CoolSiC™ technology, coupled with silicon IGBT EDT3 technology, this module supports both single and dual gate drivers, facilitating ease of re-design from full silicon or SiC inverters to hybrid solutions.

Innovative integration for precision control

Infineon's holistic expertise in SiC MOSFET and silicon IGBT technology, power module packaging, gate drivers, and sensors enables premium products with significant cost savings at the system level. The HybridPACKTM Drive package integrates Swoboda or XENSIV™ Hall sensors, ensuring more precise and efficient motor control.

Will you be in Nuremberg for PCIM 2025, 6-8 May? Visit us at booth 470 in Hall 7 and meet our experts on the HybridPACKTM Drive G2 Fusion in person! If you can’t be on site, register for our digital platform now to access all information on our offerings

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We showcased the future of mobility at electronica 2024 in Munich from November 12 to 15. At the Infineon booth visitors had the chance to explore our HybridPACKTM Drive G2 Fusion along with other innovative solutions driving the green and digital transformation.

If you missed the event or want to revisit our presentations, you can still access all the content. Follow this  link to register for our digital platform and dive into the full range of materials we presented during electronica 2024

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