For highest performance or when the desired current exceeds 330 A for 50 mm we have designed the Prime Line 50 modules with best-in-class power density reaching 370 A in the standard 50 mm housing. These modules have been optimized regarding thermal resistance and qualified for higher junction temperatures to push their performance beyond current limits. The result is highest power density in same foot print and our well-known reliability, leading to outstanding lifetime. Our pressure contact modules in general provide best-in-class blocking stability and are H2S robust. The 50 mm modules in pressure contact technology complete our Prime Line with 50 mm solder bond modules in 390 A. Benefit from highest current rating in a 50 mm footprint and predictably high performance due to 100% x-ray end-of-line monitoring of solder process.

  • Highest current rating in 50 mm footprint
  • Cost-effective solder bond technology
  • 100% x-ray monitoring
  • Solid baseplate for fast & easy mounting
  • Best-in-class power density (PC)
  • Short-on-fail capability (PC)
  • No open copper surfaces (PC)
  • Highest surge current in 60 mm housing
  • Proven pressure contact technology
  • Best-in-class DC blocking capability (PC)
  • Reduced system cost and foot print
  • Reduced failure & system cost
  • No failures in challenging environment with corrosive gases (rubber, data center)

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Highest power density in the same footprint and our well-known reliability, leading to outstanding lifetime. Our pressure contact modules in general provide best-in-class blocking stability. The 60 mm modules complete our Prime Line with 50 mm solder bond modules in 390 A. Benefit from the highest current rating in a 50 mm footprint and predictably high performance due to 100 percent x-ray end-of-line monitoring of the solder process.

The 50 mm modules with solder contact technology incorporate important key features, e.g., the highest current rating in a 50 mm footprint and cost-effective solder bond technology for increased competitiveness. A predictably high performance and lifetime due to 100 percent x-ray monitoring, as well as a solid baseplate for fast and easy mounting.

The 60 mm modules with pressure contact technology incorporate important key features, e.g., the best-in-class power density in standard 60 mm housing to prevent paralleling, the highest surge current in 60 mm housing, proven pressure contact technology with short-on-fail feature, and the best-in-class DC blocking capability.

The key benefits of the 50 mm modules with solder contact technology and the 60 mm modules with pressure contact technology are the predictable performance over an entire lifetime, they are ready for safety applications, easy mounting, and a faster time to market.

Highest power density in the same footprint and our well-known reliability, leading to outstanding lifetime. Our pressure contact modules in general provide best-in-class blocking stability. The 60 mm modules complete our Prime Line with 50 mm solder bond modules in 390 A. Benefit from the highest current rating in a 50 mm footprint and predictably high performance due to 100 percent x-ray end-of-line monitoring of the solder process.

The 50 mm modules with solder contact technology incorporate important key features, e.g., the highest current rating in a 50 mm footprint and cost-effective solder bond technology for increased competitiveness. A predictably high performance and lifetime due to 100 percent x-ray monitoring, as well as a solid baseplate for fast and easy mounting.

The 60 mm modules with pressure contact technology incorporate important key features, e.g., the best-in-class power density in standard 60 mm housing to prevent paralleling, the highest surge current in 60 mm housing, proven pressure contact technology with short-on-fail feature, and the best-in-class DC blocking capability.

The key benefits of the 50 mm modules with solder contact technology and the 60 mm modules with pressure contact technology are the predictable performance over an entire lifetime, they are ready for safety applications, easy mounting, and a faster time to market.

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