Active and preferred
RoHS Compliant

IQDH35N03LM5CG

OptiMOS™ power MOSFETs 30 V in PQFN 5x6 mm2 Source-Down package with industry leading RDS(on) .
Data Sheet

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

IQDH35N03LM5CG
IQDH35N03LM5CG
Data Sheet

Product details

  • Budgetary Price €/1k
    1.5
  • ID (@25°C) max
    700 A
  • IDpuls max
    2800 A
  • Operating Temperature
    -55 °C to 150 °C
  • Package
    PQFN 5x6 Source-Down
  • Polarity
    N
  • QG (typ @4.5V)
    91 nC
  • QG (typ @10V)
    197 nC
  • RDS (on) (@4.5V) max
    0.4 mΩ
  • RDS (on) (@10V) max
    0.35 mΩ
  • Special Features
    Center-Gate
  • VDS max
    30 V
  • VGS(th)
    1.6 V
Recommended
OPN
IQDH35N03LM5CGATMA1
Product Status active and preferred
Infineon Package PG-TTFN-9
Package Name PQFN 5x6 Source-Down
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package PG-TTFN-9
Package Name PQFN 5x6 Source-Down
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The power MOSFET IQDH35N03LM5CG 30 V comes in a PQFN 5x6 mm2 Source-Down package. The part offers the industry’s lowest RDS(on) of 0.35 mΩ combined with outstanding thermal performance for easy power loss management. This enables higher system efficiency and power density for a large variety of end applications like SMPS , telecom power, and intermediate bus conversion in high-performance computing, like hyper-scale data centers and AI-server farms.

Features

  • OptiMOS™ 30 V with outstanding FOMs
  • Source-Down package with thermal
  • Source-Down with maximized chip ratio
  • Source-Down in Center-Gate footprint

Benefits

  • Minimized conduction losses
  • Reduced voltage overshoot
  • Increased maximum current capability
  • Fast switching
  • Less device paralleling required
  • Center-Gate for optimal parallelization
  • Lowest RDS(on) on 5x6 mm² PCB
  • Enhanced thermal management
  • Minimal parasitics, optimal switching
  • Industry standard package

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }