not for new design
RoHS Compliant
Lead-free

IPT60R125G7

A new SMD package using Kelvin source concept
Data Sheet
package
ea.
in stock

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IPT60R125G7
IPT60R125G7
ea.
Data Sheet

Product details

  • Budgetary Price €/1k
    1.52
  • ID max
    20 A
  • ID (@25°C) max
    20 A
  • IDpuls max
    54 A
  • Mounting
    SMT
  • Operating Temperature
    -55 °C to 150 °C
  • Package
    TOLL
  • Pin Count
    8 Pins
  • Polarity
    N
  • Ptot max
    120 W
  • Qgd
    10 nC
  • QG
    27 nC
  • QG (typ @10V)
    27 nC
  • RDS (on) max
    125 mΩ
  • RDS (on) (@10V) max
    125 mΩ
  • RthJA max
    62 K/W
  • RthJC max
    1.04 K/W
  • Rth
    1.04 K/W
  • Special Features
    highest performance
  • VDS max
    600 V
  • VGS(th)
    3.5 V
OPN
IPT60R125G7XTMA1
Product Status not for new design
Infineon Package
PG-HSOF-8
Package Name TOLL
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status not for new design
Infineon Package
PG-HSOF-8
Package Name TOLL
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
For the first time the CoolMOS™ C7 Gold superjunction MOSFET series (G7) brings together the benefits of the improved 600V CoolMOS™ C7 Gold technology, 4pin Kelvin source capability and the improved thermal properties of the TO-Leadless (TOLL) package to enable a possible SMD solution for high current hard switching topologies such as power factor correction (PFC) up to 3kW and for resonant circuits such as high end LLC.

Features

  • Best-in-class FOM R DS(on) x E oss
  • Best-in-class R DS(on) x Q G
  • Inbuilt Kelvin source pin
  • Low parasitic source inductance (~1nH)
  • MSL1 compliant, total Pb-free
  • Enables improved thermal performance R th

Benefits

  • Higher efficiency by C7 Gold technology
  • Fast switching due to low inductance SMD
  • Fast switching due to Kelvin source pin
  • Low R DS(on)  in small footprint
  • Improved power density due to SMD
  • Assembly cost reduction by using SMD

Documents

Documents

Design resources

Partner solutions

Developer community

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