not for new design
RoHS Compliant

IKD06N60RF

600 V, 6 A IGBT with anti-parallel diode in TO-252 package
Data Sheet
package
ea.
in stock

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IKD06N60RF
IKD06N60RF
ea.
Data Sheet

Product details

  • Eoff (Hard Switching)
    0.09 mJ
  • Eon
    0.09 mJ
  • IC (@ 100°) max
    6 A
  • IC (@ 25° ) max
    12 A
  • ICpuls max
    18 A
  • IF max
    12 A
  • IFpuls max
    18 A
  • Irrm
    7.4 A
  • Package
    DPAK (TO-252-3)
  • Ptot max
    100 W
  • QGate
    48 nC
  • Qrr
    160 nC
  • RGint
    0 Ω
  • RG
    23 Ω
  • Soft Switching
    No
  • Switching Frequency
    4 kHz to 30 kHz
  • td(off)
    106 ns
  • td(on)
    7 ns
  • Technology
    IGBT RC Drives Fast
  • tf
    22 ns
  • tr
    8 ns
  • tSC
    5 µs
  • VCE(sat)
    2.2 V
  • VCE max
    600 V
  • VF
    2.1 V
OPN
IKD06N60RFATMA1
Product Status not for new design
Infineon Package
PG-TO252-3
Package Name DPAK
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status not for new design
Infineon Package
PG-TO252-3
Package Name DPAK
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
Hard-switching 600 V, 6 A RC-Drives TRENCHSTOP™ IGBT3 discrete in a TO-252 package with monolithically integrated reverse conducting diode, has been developed as a cost optimized solution for consumer drives market. This basic technology provides outstanding performance for permanent magnet synchronous and brushless DC motor drives.

Features

  • Optimized parameters
  • lower switching losses
  • Operating range of DC to 30 kHz
  • Max junction temperature 175°C
  • Short circuit capability of 5µs
  • Very tight parameter distribution
  • Best in class current performance
  • Best in class package size performance
  • Smooth switching performance
  • Low EMI levels

Benefits

  • Good cost/performance
  • Outstanding temperature stability
  • Very good EMI behavior
  • Up to 60% space saving on the PCB
  • High reliability
  • monolithically int. IGBT&diode
  • less thermal cycling

Documents

Documents

Design resources

Partner solutions

Developer community

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