Active and preferred
RoHS Compliant

CYBLE-202007-01

Data Sheet
package
board
ea.
in stock

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

CYBLE-202007-01
CYBLE-202007-01
ea.
Data Sheet

Product details

  • ADC (#, Max. Resolution @ Sample Rate)
    SAR (1, 12-bit @ 806 ksps)
  • Base Silicon
    PSoC™ 4-BLE
  • Bluetooth Classic
    No
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    N/A
  • Bluetooth EDR 2Mbps TX POWER
    N/A
  • Bluetooth LE Data rate
    1 MByte/s
  • Bluetooth LE RX Sensitivity
    - 93 dBm
  • Bluetooth LE TX Power
    7.5dBm
  • Bluetooth LE
    Yes
  • CAPSENSE™
    Yes
  • CPU Core
    48MHz
  • Extended Range
    No
  • Family
    AIROC™ Bluetooth Modules
  • Flash
    256 kByte
  • GPIOs
    19
  • I2C
    Configurable
  • Launch Date
    31-03-2015
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Main CPU Core
    Arm® Cortex®- M0
  • Operating Temperature
    -40 °C to 85 °C
  • Operational Amplifier
    Yes
  • Pads
    30
  • PDM
    Configurable
  • Currently planned availability until at least
    31-03-2030
  • PWM
    4
  • Secondary CPU Core
    None
  • Serial Communication Blocks
    5
  • Size (X mm x Y mm x Z mm)
    15 x 23 x 2.00 mm
  • SPI
    Configurable
  • SRAM
    32 kByte
  • Type of Antenna
    External -u.FL
  • UART
    Configurable
  • V
    1.9 V to 3.6 V
Recommended
OPN
CYBLE-202007-01
Product Status active and preferred
Infineon Package
LG-MLGA-30
Package Name MODULE-30 (002-15631)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
LG-MLGA-30
Package Name MODULE-30 (002-15631)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
Infineon’s AIROC™ CYBLE-202007-01 is a fully certified Bluetooth® LE embedded module based on Infineon’s PSOC™ 4-BLE. This module includes a royalty-free Bluetooth® stack compatible with Bluetooth® Core 5.1, reducing the additional time needed for design, development and certification. It is available in 14 x 18.5 x 2.00 mm SMT form-factor, with an external -u.FL antenna and is certified to FCC, ISED, MIC, and CE regulations.

Features

  • CAPSENSE™
  • Onboard crystal oscillator
  • Passive components
  • Flash memory
  • 18 capacitive sensors
  • PSOC™ 4-BLE Bluetooth® MCU

Benefits

  • Scalable and reconfigurable platform
  • Flexible automatic routing

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }